214-7390-55-1902
ActiveIC & COMPONENT SOCKET, 14 CONTACTS, SOIC SOCKET, 2.54 MM, TEXTOOL SERIES, 3.81 MM
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214-7390-55-1902
ActiveIC & COMPONENT SOCKET, 14 CONTACTS, SOIC SOCKET, 2.54 MM, TEXTOOL SERIES, 3.81 MM
Deep-Dive with AI
Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | 214-7390-55-1902 | 214 Series |
|---|---|---|
| Adhesive | - | Rubber |
| Backing, Carrier | - | Crepe Paper |
| Color | - | Tan |
| Contact Finish - Mating | Gold | Gold |
| Contact Finish - Post | Gold | Gold |
| Contact Finish Thickness - Mating | - | 30 Áin |
| Contact Finish Thickness - Mating | - | 0.76 Ám |
| Contact Finish Thickness - Post | 30 µin | 30 µin |
| Contact Finish Thickness - Post | 0.76 µm | 0.76 µm |
| Contact Material - Mating | Beryllium Copper | Beryllium Copper |
| Contact Material - Post | Beryllium Copper | Beryllium Copper |
| Contact Resistance | - | 25 mOhm |
| Current Rating (Amps) | 1 A | 1 A |
| Features | Closed Frame | Closed Frame |
| Housing Material | Polyethersulfone (PES), Glass Filled | Polysulfone (PSU), Glass Filled, Polyethersulfone (PES), Glass Filled |
| Length | - | 60 yds |
| Length | - | 55 m |
| Length | - | 180 ft |
| Material Flammability Rating | UL94 V-0 | UL94 V-0 |
| Mounting Type | Through Hole | Connector, Through Hole |
| Number of Positions or Pins (Grid) | 14 | 14 |
| Operating Temperature [Max] | 150 °C | 125 - 150 °C |
| Operating Temperature [Min] | -55 °C | -55 °C |
| Pitch - Mating | - | 0.1 in |
| Pitch - Mating | - | 2.54 mm |
| Pitch - Post | - | 2.54 mm |
| Pitch - Post | - | 0.1 in |
| Shelf Life | - | 12 Months |
| Shelf Life Start | - | Date of Manufacture |
| Storage/Refrigeration Temperature | - | 16 - 60 °F |
| Storage/Refrigeration Temperature | - | 27 - 80 °F |
| Tape Type | - | Masking |
| Termination | Solder | Press-Fit, Solder |
| Termination Post Length | 3.56 mm | 2.78 - 3.56 mm |
| Termination Post Length | 0.14 in | 0.11 - 0.14 in |
| Thickness | - | 0.0067 " |
| Thickness | - | 0.17 mm |
| Thickness | - | 6.7 mils |
| Type | SOIC | DIP, ZIF (ZIP), SOIC |
| Type | - | 7.62 mm |
| Type | - | 0.3 in |
| Usage | - | High Temperature Adhesion |
| Width | - | 2 " |
| Width | - | 50.8 mm |
214 Series
CONN IC DIP SOCKET ZIF 14POS GLD
| Part | Termination | Termination Post Length | Termination Post Length | Contact Resistance | Contact Finish - Mating | Contact Finish - Post | Current Rating (Amps) | Housing Material | Contact Material - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Type | Type | Type | Mounting Type | Pitch - Post | Pitch - Post | Contact Material - Mating | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Features | Number of Positions or Pins (Grid) | Usage | Shelf Life Start | Storage/Refrigeration Temperature [Min] | Storage/Refrigeration Temperature [Max] | Width [y] | Width [y] | Thickness | Thickness | Thickness | Length | Length | Length | Backing, Carrier | Shelf Life | Color | Adhesive | Tape Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Press-Fit | 0.11 in | 2.78 mm | 25 mOhm | Gold | Gold | 1 A | Polysulfone (PSU), Glass Filled | Beryllium Copper | 30 µin | 0.76 µm | 7.62 mm | 0.3 in | DIP, ZIF (ZIP) | Connector | 2.54 mm | 0.1 in | Beryllium Copper | UL94 V-0 | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | -55 °C | 125 °C | Closed Frame | 14 | ||||||||||||||||||
Solder | 0.14 in | 3.56 mm | Gold | Gold | 1 A | Polyethersulfone (PES), Glass Filled | Beryllium Copper | 30 µin | 0.76 µm | SOIC | Through Hole | Beryllium Copper | UL94 V-0 | -55 °C | 150 °C | Closed Frame | 14 | |||||||||||||||||||||||||||
High Temperature Adhesion | Date of Manufacture | 16 °C, 60 °F | 27 °C, 80 °F | 2 " | 50.8 mm | 0.0067 " | 0.17 mm | 6.7 mils | 60 yds | 55 m | 180 ft | Crepe Paper | 12 Months | Tan | Rubber | Masking |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 37.47 | |
| 10 | $ 32.81 | |||
| 30 | $ 31.39 | |||
| 50 | $ 30.38 | |||
| 100 | $ 29.36 | |||
| 250 | $ 27.74 | |||
Description
General part information
214 Series
The 214-7390-55-1902 is a 14-way Textool™ SOIC Socket with gold-plated beryllium copper contacts. Lid can be actuated from top or front and is compatible with automated load/unload equipment. Lid applies 80g normal force per lead for maximum electrical reliability. User friendly, compact size 3M Textool lidded socket is available for SOIC gull wing packages on 50mil centers.
Documents
Technical documentation and resources