214-7390-55-1902

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IC & COMPONENT SOCKET, 14 CONTACTS, SOIC SOCKET, 2.54 MM, TEXTOOL SERIES, 3.81 MM

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214-7390-55-1902

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IC & COMPONENT SOCKET, 14 CONTACTS, SOIC SOCKET, 2.54 MM, TEXTOOL SERIES, 3.81 MM

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DocumentsDatasheet Technical Data Sheet EN

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	214-7390-55-1902	214 Series

Adhesive	-	Rubber
Backing, Carrier	-	Crepe Paper
Color	-	Tan
Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Gold	Gold
Contact Finish Thickness - Mating	-	30 Áin
Contact Finish Thickness - Mating	-	0.76 Ám
Contact Finish Thickness - Post	30 µin	30 µin
Contact Finish Thickness - Post	0.76 µm	0.76 µm
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post	Beryllium Copper	Beryllium Copper
Contact Resistance	-	25 mOhm
Current Rating (Amps)	1 A	1 A
Features	Closed Frame	Closed Frame
Housing Material	Polyethersulfone (PES), Glass Filled	Polysulfone (PSU), Glass Filled, Polyethersulfone (PES), Glass Filled
Length	-	60 yds
Length	-	55 m
Length	-	180 ft
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Connector, Through Hole
Number of Positions or Pins (Grid)	14	14
Operating Temperature [Max]	150 °C	125 - 150 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch - Mating	-	0.1 in
Pitch - Mating	-	2.54 mm
Pitch - Post	-	2.54 mm
Pitch - Post	-	0.1 in
Shelf Life	-	12 Months
Shelf Life Start	-	Date of Manufacture
Storage/Refrigeration Temperature	-	16 - 60 °F
Storage/Refrigeration Temperature	-	27 - 80 °F
Tape Type	-	Masking
Termination	Solder	Press-Fit, Solder
Termination Post Length	3.56 mm	2.78 - 3.56 mm
Termination Post Length	0.14 in	0.11 - 0.14 in
Thickness	-	0.0067 "
Thickness	-	0.17 mm
Thickness	-	6.7 mils
Type	SOIC	DIP, ZIF (ZIP), SOIC
Type	-	7.62 mm
Type	-	0.3 in
Usage	-	High Temperature Adhesion
Width	-	2 "
Width	-	50.8 mm

214 Series

CONN IC DIP SOCKET ZIF 14POS GLD

Part	Termination	Termination Post Length	Termination Post Length	Contact Resistance	Contact Finish - Mating	Contact Finish - Post	Current Rating (Amps)	Housing Material	Contact Material - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type	Type	Type	Mounting Type	Pitch - Post	Pitch - Post	Contact Material - Mating	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Features	Number of Positions or Pins (Grid)	Usage	Shelf Life Start	Storage/Refrigeration Temperature [Min]	Storage/Refrigeration Temperature [Max]	Width [y]	Width [y]	Thickness	Thickness	Thickness	Length	Length	Length	Backing, Carrier	Shelf Life	Color	Adhesive	Tape Type
3M 214-3339-00-0602J	Press-Fit	0.11 in	2.78 mm	25 mOhm	Gold	Gold	1 A	Polysulfone (PSU), Glass Filled	Beryllium Copper	30 µin	0.76 µm	7.62 mm	0.3 in	DIP, ZIF (ZIP)	Connector	2.54 mm	0.1 in	Beryllium Copper	UL94 V-0	30 Áin	0.76 Ám	0.1 in	2.54 mm	-55 °C	125 °C	Closed Frame	14
3M 214-7390-55-1902	Solder	0.14 in	3.56 mm		Gold	Gold	1 A	Polyethersulfone (PES), Glass Filled	Beryllium Copper	30 µin	0.76 µm			SOIC	Through Hole			Beryllium Copper	UL94 V-0					-55 °C	150 °C	Closed Frame	14
3M 214-2"X60YD																												High Temperature Adhesion	Date of Manufacture	16 °C, 60 °F	27 °C, 80 °F	2 "	50.8 mm	0.0067 "	0.17 mm	6.7 mils	60 yds	55 m	180 ft	Crepe Paper	12 Months	Tan	Rubber	Masking

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 37.47
		10	$ 32.81
		30	$ 31.39
		50	$ 30.38
		100	$ 29.36
		250	$ 27.74

Description

General part information

214 Series

The 214-7390-55-1902 is a 14-way Textool™ SOIC Socket with gold-plated beryllium copper contacts. Lid can be actuated from top or front and is compatible with automated load/unload equipment. Lid applies 80g normal force per lead for maximum electrical reliability. User friendly, compact size 3M Textool lidded socket is available for SOIC gull wing packages on 50mil centers.