CONN IC DIP SOCKET ZIF 14POS GLD
| Part | Termination | Termination Post Length | Termination Post Length | Contact Resistance | Contact Finish - Mating | Contact Finish - Post | Current Rating (Amps) | Housing Material | Contact Material - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Type | Type | Type | Mounting Type | Pitch - Post | Pitch - Post | Contact Material - Mating | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Features | Number of Positions or Pins (Grid) | Usage | Shelf Life Start | Storage/Refrigeration Temperature [Min] | Storage/Refrigeration Temperature [Max] | Width [y] | Width [y] | Thickness | Thickness | Thickness | Length | Length | Length | Backing, Carrier | Shelf Life | Color | Adhesive | Tape Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Press-Fit | 0.11 in | 2.78 mm | 25 mOhm | Gold | Gold | 1 A | Polysulfone (PSU), Glass Filled | Beryllium Copper | 30 µin | 0.76 µm | 7.62 mm | 0.3 in | DIP, ZIF (ZIP) | Connector | 2.54 mm | 0.1 in | Beryllium Copper | UL94 V-0 | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | -55 °C | 125 °C | Closed Frame | 14 | ||||||||||||||||||
Solder | 0.14 in | 3.56 mm | Gold | Gold | 1 A | Polyethersulfone (PES), Glass Filled | Beryllium Copper | 30 µin | 0.76 µm | SOIC | Through Hole | Beryllium Copper | UL94 V-0 | -55 °C | 150 °C | Closed Frame | 14 | |||||||||||||||||||||||||||
High Temperature Adhesion | Date of Manufacture | 16 °C, 60 °F | 27 °C, 80 °F | 2 " | 50.8 mm | 0.0067 " | 0.17 mm | 6.7 mils | 60 yds | 55 m | 180 ft | Crepe Paper | 12 Months | Tan | Rubber | Masking |