RFN5BM3SFHTL
ActiveRohm Semiconductor
SUPER FAST RECOVERY DIODE (AEC-Q101 QUALIFIED)
RFN5BM3SFHTL
ActiveRohm Semiconductor
SUPER FAST RECOVERY DIODE (AEC-Q101 QUALIFIED)
Description
General part information
RFN5B Series
RFN5BGE6S is the silicon epitaxial planar type Fast Recovery Diode.
Technical Specifications
Parameters and characteristics for this part
| Specification | RFN5BM3SFHTL |
|---|---|
| Current - Average Rectified (Io) | 5 A |
| Current - Reverse Leakage | 10 µA |
| Grade | Automotive |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction (Max) | 150 °C |
| Package / Case | SC-63, DPAK (2 Leads + Tab), TO-252-3 |
| Package Name | TO-252 |
| Qualification | AEC-Q101 |
| Reverse Recovery Time (trr) | 30 ns |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Standard |
| Voltage - DC Reverse (Vr) (Max) | 350 V |
| Voltage - Forward (Vf) (Max) | 1.5 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
How to Select Reverse Current Protection Diodes for LDO Regulators
About Flammability of Materials
Notes for Temperature Measurement Using Thermocouples
Part Explanation
Basics of Thermal Resistance and Heat Dissipation
Compliance of the RoHS directive
Precautions When Measuring the Rear of the Package with a Thermocouple
Package Dimensions
Inner Structure
θ<sub>JC</sub> and Ψ<sub>JT</sub>
How to Create Symbols for PSpice Models
Judgment Criteria of Thermal Evaluation
Condition of Soldering / Land Pattern Reference
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Two-Resistor Model for Thermal Simulation
Diode Types and Applications
Report of SVHC under REACH Regulation
What Is Thermal Design
PCB Layout Thermal Design Guide
How to Select Rectifier Diodes
Absolute Maximum Rating and Electrical Characteristics of Diodes
Anti-Whisker formation - Diodes
List of Diode Package Thermal Resistance
Importance of Probe Calibration When Measuring Power: Deskew
How to Use LTspice® Models: Tips for Improving Convergence
About Export Regulations
Explanation for Marking
Reliability Test Result
Method for Monitoring Switching Waveform
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
ESD Data
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Measurement Method and Usage of Thermal Resistance RthJC
How to Use LTspice® Models
Moisture Sensitivity Level - Diodes
Notes for Calculating Power Consumption:Static Operation
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
Impedance Characteristics of Bypass Capacitor
Taping Information
Power Loss and Thermal Design of Diodes
What is a Thermal Model? (Diode)
Notes for Temperature Measurement Using Forward Voltage of PN Junction
AEC-Q101 Automotive Requirements
