RFN5BGE6STL
ActiveRohm Semiconductor
RECTIFIER, 600V, 5A, TO-252 ROHS COMPLIANT: YES
RFN5BGE6STL
ActiveRohm Semiconductor
RECTIFIER, 600V, 5A, TO-252 ROHS COMPLIANT: YES
Description
General part information
RFN5B Series
RFN5BGE6S is the silicon epitaxial planar type Fast Recovery Diode.
Technical Specifications
Parameters and characteristics for this part
| Specification | RFN5BGE6STL |
|---|---|
| Current - Average Rectified (Io) | 5 A |
| Current - Reverse Leakage | 10 µA |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction | 150 °C |
| Package / Case | SC-63, DPAK (2 Leads + Tab), TO-252-3 |
| Package Name | TO-252GE |
| Reverse Recovery Time (trr) | 50 ns |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Standard |
| Voltage - DC Reverse (Vr) (Max) | 600 V |
| Voltage - Forward (Vf) (Max) | 1.55 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
How to Use the Thermal Resistance and Thermal Characteristics Parameters
How to Create Symbols for PSpice Models
Power Loss and Thermal Design of Diodes
How to Use LTspice® Models: Tips for Improving Convergence
Notes for Calculating Power Consumption:Static Operation
RFN5BGE6S ESD Data
Diode Types and Applications
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Moisture Sensitivity Level - Diodes
About Flammability of Materials
Judgment Criteria of Thermal Evaluation
How to Select Rectifier Diodes
Basics of Thermal Resistance and Heat Dissipation
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Impedance Characteristics of Bypass Capacitor
Notes for Temperature Measurement Using Forward Voltage of PN Junction
What Is Thermal Design
θ<sub>JA</sub> and Ψ<sub>JT</sub>
About Export Regulations
How to Select Reverse Current Protection Diodes for LDO Regulators
Anti-Whisker formation - Diodes
Compliance of the RoHS directive
Importance of Probe Calibration When Measuring Power: Deskew
What is a Thermal Model? (Diode)
Notes for Temperature Measurement Using Thermocouples
PCB Layout Thermal Design Guide
Absolute Maximum Rating and Electrical Characteristics of Diodes
Two-Resistor Model for Thermal Simulation
How to Use LTspice® Models
Method for Monitoring Switching Waveform
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
Part Explanation
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Measurement Method and Usage of Thermal Resistance RthJC
Report of SVHC under REACH Regulation
Precautions When Measuring the Rear of the Package with a Thermocouple
Reliability Test Result
List of Diode Package Thermal Resistance
