08-3518-00

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Aries Electronics

CONN IC DIP SOCKET 8POS GOLD

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Aries Electronics

CONN IC DIP SOCKET 8POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	08-3518-00

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Open Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount
Number of Positions or Pins (Grid)	8
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.18 mm
Termination Post Length	0.125 in
Type	0.3 "
Type	7.62 mm
Type	DIP

Part	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid)	Contact Material - Post [custom]	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post	Mounting Type	Termination	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Contact Material - Mating	Type	Type	Type	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Contact Finish - Post
Aries Electronics 08-3518-10E	Glass Filled Nylon 4/6 Polyamide (PA46)	200 µin	5.08 µm	8	Brass	0.1 in	2.54 mm	2.54 mm	0.1 in	Through Hole	Solder	3 A	UL94 V-0	3.18 mm	0.125 in	Beryllium Copper	0.3 "	7.62 mm	DIP	Open Frame	10 çin	0.25 çm	Gold	Tin
Aries Electronics 08-3518-11H	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	8	Brass	0.1 in	2.54 mm	2.54 mm	0.1 in	Through Hole	Solder	3 A	UL94 V-0	3.18 mm	0.125 in	Beryllium Copper	0.3 "	7.62 mm	DIP	Open Frame	10 çin	0.25 çm	Gold	Gold
Aries Electronics 08-3518-10	Glass Filled Nylon 4/6 Polyamide (PA46)	200 µin	5.08 µm	8	Brass	0.1 in	2.54 mm	2.54 mm	0.1 in	Through Hole	Solder	3 A	UL94 V-0	3.18 mm	0.125 in	Beryllium Copper	0.3 "	7.62 mm	DIP	Open Frame	10 çin	0.25 çm	Gold	Tin
Aries Electronics 08-3518-00	Glass Filled Nylon 4/6 Polyamide (PA46)	200 µin	5.08 µm	8	Brass	0.1 in	2.54 mm	2.54 mm	0.1 in	Surface Mount	Solder	3 A	UL94 V-0	3.18 mm	0.125 in	Beryllium Copper	0.3 "	7.62 mm	DIP	Open Frame	10 çin	0.25 çm	Gold	Tin

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

8 (2 x 4) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Surface Mount

Technical documentation and resources