08-3518 Series

Catalog

CONN IC DIP SOCKET 8POS GOLD

Part	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid)	Contact Material - Post [custom]	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post	Mounting Type	Termination	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Contact Material - Mating	Type	Type	Type	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Contact Finish - Post
Aries Electronics 08-3518-10E	Glass Filled Nylon 4/6 Polyamide (PA46)	200 µin	5.08 µm	8	Brass	0.1 in	2.54 mm	2.54 mm	0.1 in	Through Hole	Solder	3 A	UL94 V-0	3.18 mm	0.125 in	Beryllium Copper	0.3 "	7.62 mm	DIP	Open Frame	10 çin	0.25 çm	Gold	Tin
Aries Electronics 08-3518-11H	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	8	Brass	0.1 in	2.54 mm	2.54 mm	0.1 in	Through Hole	Solder	3 A	UL94 V-0	3.18 mm	0.125 in	Beryllium Copper	0.3 "	7.62 mm	DIP	Open Frame	10 çin	0.25 çm	Gold	Gold
Aries Electronics 08-3518-10	Glass Filled Nylon 4/6 Polyamide (PA46)	200 µin	5.08 µm	8	Brass	0.1 in	2.54 mm	2.54 mm	0.1 in	Through Hole	Solder	3 A	UL94 V-0	3.18 mm	0.125 in	Beryllium Copper	0.3 "	7.62 mm	DIP	Open Frame	10 çin	0.25 çm	Gold	Tin
Aries Electronics 08-3518-00	Glass Filled Nylon 4/6 Polyamide (PA46)	200 µin	5.08 µm	8	Brass	0.1 in	2.54 mm	2.54 mm	0.1 in	Surface Mount	Solder	3 A	UL94 V-0	3.18 mm	0.125 in	Beryllium Copper	0.3 "	7.62 mm	DIP	Open Frame	10 çin	0.25 çm	Gold	Tin