Specification	LDBAA2270GC5N0

Applications	General Purpose
Capacitance	0.027 µF
Dielectric Material	Polyphenylene Sulfide (PPS), Metallized - Stacked
Height - Seated (Max)	0.043 in
Mounting Type	Surface Mount
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Package / Case	1206 (3216 Metric)
Size / Dimension Length	0.13 in
Size / Dimension Width	0.067 in
Termination	Solder Pads
Tolerance	2 %
Voltage Rating - DC	16 V

LDBAA Series

Part	Capacitance	Mounting Type	Operating Temperature (Max)	Operating Temperature (Min)	Termination	Tolerance	Dielectric Material	Package / Case	Applications	Voltage Rating - DC	Height - Seated (Max)	Size / Dimension Length	Size / Dimension Width
KEMET LDBAA2390JC5N0	0.039 µF	Surface Mount	125 °C	-55 °C	Solder Pads	5 %	Metallized - Stacked Polyphenylene Sulfide (PPS)	1206 (3216 Metric)	General Purpose	16 V	0.047 in	0.13 in	0.067 in
KEMET LDBAA2330GC5N0	0.033 µF	Surface Mount	125 °C	-55 °C	Solder Pads	2 %	Metallized - Stacked Polyphenylene Sulfide (PPS)	1206 (3216 Metric)	General Purpose	16 V	0.043 in	0.13 in	0.067 in
KEMET LDBAA2220JC5N0	0.022 µF	Surface Mount	125 °C	-55 °C	Solder Pads	5 %	Metallized - Stacked Polyphenylene Sulfide (PPS)	1206 (3216 Metric)	General Purpose	16 V	0.043 in	0.13 in	0.067 in
KEMET LDBAA2270JC5N0	0.027 µF	Surface Mount	125 °C	-55 °C	Solder Pads	5 %	Metallized - Stacked Polyphenylene Sulfide (PPS)	1206 (3216 Metric)	General Purpose	16 V	0.043 in	0.13 in	0.067 in
KEMET LDBAA2220GC5N0	0.022 µF	Surface Mount	125 °C	-55 °C	Solder Pads	2 %	Metallized - Stacked Polyphenylene Sulfide (PPS)	1206 (3216 Metric)	General Purpose	16 V	0.043 in	0.13 in	0.067 in
KEMET LDBAA2270GC5N0	0.027 µF	Surface Mount	125 °C	-55 °C	Solder Pads	2 %	Metallized - Stacked Polyphenylene Sulfide (PPS)	1206 (3216 Metric)	General Purpose	16 V	0.043 in	0.13 in	0.067 in
KEMET LDBAA2120JC5N0	0.012 µF	Surface Mount	125 °C	-55 °C	Solder Pads	5 %	Metallized - Stacked Polyphenylene Sulfide (PPS)	1206 (3216 Metric)	General Purpose	16 V	0.043 in	0.13 in	0.067 in

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