LDBAA Series

Manufacturer: KEMET

Catalog

CAP FILM 0.039UF 5% 16VDC 1206

Part	Mounting Type	Termination	Size / Dimension [y]	Size / Dimension [x]	Size / Dimension [x]	Size / Dimension [y]	Applications	Operating Temperature [Min]	Operating Temperature [Max]	Package / Case	Capacitance	Height - Seated (Max) [Max]	Height - Seated (Max) [Max]	Tolerance	Voltage Rating - DC	Dielectric Material	Height - Seated (Max) [Max] [z]	Height - Seated (Max) [Max] [z]
KEMET LDBAA2390JC5N0	Surface Mount	Solder Pads	1.7 mm	3.3 mm	0.13 in	0.067 in	General Purpose	-55 °C	125 °C	1206 (3216 Metric)	0.039 µF	1.2 mm	0.047 in	5 %	16 V	Polyphenylene Sulfide (PPS) Metallized - Stacked
KEMET LDBAA2330GC5N0	Surface Mount	Solder Pads	1.7 mm	3.3 mm	0.13 in	0.067 in	General Purpose	-55 °C	125 °C	1206 (3216 Metric)	0.033 çF			2 %	16 V	Polyphenylene Sulfide (PPS) Metallized - Stacked	0.043 in	1.1 mm
KEMET LDBAA2220JC5N0	Surface Mount	Solder Pads	1.7 mm	3.3 mm	0.13 in	0.067 in	General Purpose	-55 °C	125 °C	1206 (3216 Metric)	0.022 µF			5 %	16 V	Polyphenylene Sulfide (PPS) Metallized - Stacked	0.043 in	1.1 mm
KEMET LDBAA2270JC5N0	Surface Mount	Solder Pads	1.7 mm	3.3 mm	0.13 in	0.067 in	General Purpose	-55 °C	125 °C	1206 (3216 Metric)	0.027 µF			5 %	16 V	Polyphenylene Sulfide (PPS) Metallized - Stacked	0.043 in	1.1 mm
KEMET LDBAA2220GC5N0	Surface Mount	Solder Pads	1.7 mm	3.3 mm	0.13 in	0.067 in	General Purpose	-55 °C	125 °C	1206 (3216 Metric)	0.022 µF			2 %	16 V	Polyphenylene Sulfide (PPS) Metallized - Stacked	0.043 in	1.1 mm
KEMET LDBAA2270GC5N0	Surface Mount	Solder Pads	1.7 mm	3.3 mm	0.13 in	0.067 in	General Purpose	-55 °C	125 °C	1206 (3216 Metric)	0.027 µF			2 %	16 V	Polyphenylene Sulfide (PPS) Metallized - Stacked	0.043 in	1.1 mm
KEMET LDBAA2120JC5N0	Surface Mount	Solder Pads	1.7 mm	3.3 mm	0.13 in	0.067 in	General Purpose	-55 °C	125 °C	1206 (3216 Metric)	0.012 µF			5 %	16 V	Polyphenylene Sulfide (PPS) Metallized - Stacked	0.043 in	1.1 mm