228-1371-00-0602J
Active3M
IC & COMPONENT SOCKET, 28 CONTACTS, DIP SOCKET, 2.54 MM, 228 SERIES, 11.43 MM, BERYLLIUM COPPER
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228-1371-00-0602J
Active3M
IC & COMPONENT SOCKET, 28 CONTACTS, DIP SOCKET, 2.54 MM, 228 SERIES, 11.43 MM, BERYLLIUM COPPER
Deep-Dive with AI
Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | 228-1371-00-0602J | 228 Series |
|---|---|---|
| Contact Finish - Mating | Gold | Gold |
| Contact Finish - Post | Gold | Gold |
| Contact Finish Thickness - Mating | 30 Áin | 30 Áin |
| Contact Finish Thickness - Mating | 0.76 Ám | 0.76 Ám |
| Contact Finish Thickness - Post | 30 µin | 30 µin |
| Contact Finish Thickness - Post | 0.76 µm | 0.76 µm |
| Contact Material - Mating | Beryllium Copper | Beryllium Copper |
| Contact Material - Post | Beryllium Copper | Beryllium Copper |
| Contact Resistance | 15 mOhm | 15 - 25 mOhm |
| Convert From (Adapter End) | - | 15.24 mm |
| Convert From (Adapter End) | - | DIP |
| Convert From (Adapter End) | - | 0.6 in |
| Convert To (Adapter End) | - | 0.4 - 0.6 in |
| Convert To (Adapter End) | - | DIP |
| Convert To (Adapter End) | - | 10.16 - 15.24 mm |
| Current Rating (Amps) | 1 A | 1 A |
| Features | Closed Frame | Closed Frame |
| Housing Material | Polysulfone (PSU), Glass Filled | Polysulfone (PSU), Glass Filled, Polyethersulfone (PES), Polyethersulfone (PES), Glass Filled |
| Material Flammability Rating | UL94 V-0 | UL94 V-0 |
| Mounting Type | Connector | Through Hole, Connector |
| Number of Pins | - | 28 |
| Number of Positions or Pins (Grid) | 28 | 28 |
| Number of Positions or Pins (Grid) | - | 4 |
| Number of Positions or Pins (Grid) | - | 7 |
| Operating Temperature [Max] | 125 °C | 125 - 150 °C |
| Operating Temperature [Min] | -55 °C | -55 °C |
| Pitch - Mating | 0.1 in | 0.02 - 0.1 in |
| Pitch - Mating | 2.54 mm | 0.5 - 2.54 mm |
| Pitch - Post | 2.54 mm | 1.78 - 2.54 mm |
| Pitch - Post | 0.1 in | 0.07 - 0.1 in |
| Termination | Press-Fit | Solder, Press-Fit |
| Termination Post Length | 0.11 in | 0.11 - 0.14 in |
| Termination Post Length | 2.78 mm | 2.78 - 3.56 mm |
| Type | 15.24 mm | 10.16 - 15.24 mm |
| Type | DIP, ZIF (ZIP) | QFN, DIP, ZIF (ZIP), SOIC, DIP, ZIP, ZIF |
| Type | 0.6 " | 0.6 " |
| Type | - | 0.4 in |
228 Series
SOCKET ADAPTER 28DIP TO 28DIP
| Part | Termination | Termination Post Length | Termination Post Length | Mounting Type | Current Rating (Amps) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Post | Convert To (Adapter End) | Convert To (Adapter End) | Convert To (Adapter End) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Mating | Material Flammability Rating | Number of Pins | Pitch - Mating | Pitch - Mating | Contact Finish - Mating | Pitch - Post | Pitch - Post | Housing Material | Contact Finish - Post | Convert From (Adapter End) | Convert From (Adapter End) | Convert From (Adapter End) | Operating Temperature [Min] | Operating Temperature [Max] | Contact Resistance | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Type | Type | Type | Features | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Solder | 3.3 mm | 0.13 in | Through Hole | 1 A | 30 Áin | 0.76 Ám | Beryllium Copper | 0.6 in | DIP | 15.24 mm | 30 µin | 0.76 µm | Beryllium Copper | UL94 V-0 | 28 | 0.1 in | 2.54 mm | Gold | 2.54 mm | 0.1 in | Polysulfone (PSU), Glass Filled | Gold | 15.24 mm | DIP | 0.6 in | -55 °C | 125 °C | ||||||||||
Solder | 3 mm | 0.118 in | Through Hole | Beryllium Copper | Beryllium Copper | 0.02 in | 0.5 mm | Gold | Polyethersulfone (PES) | Gold | 25 mOhm | 4 | 28 | 7 | QFN | ||||||||||||||||||||||
Solder | Through Hole | 1 A | 30 Áin | 0.76 Ám | Beryllium Copper | 0.6 in | DIP | 15.24 mm | 30 µin | 0.76 µm | Beryllium Copper | UL94 V-0 | 28 | 0.1 in | 2.54 mm | Gold | 2.54 mm | 0.1 in | Polysulfone (PSU), Glass Filled | Gold | 15.24 mm | DIP | 0.6 in | -55 °C | 125 °C | ||||||||||||
Solder | 3.3 mm | 0.13 in | Through Hole | 1 A | 30 Áin | 0.76 Ám | Beryllium Copper | 0.4 in | DIP | 10.16 mm | 30 µin | 0.76 µm | Beryllium Copper | UL94 V-0 | 28 | 0.1 in | 2.54 mm | Gold | 2.54 mm | 0.1 in | Polysulfone (PSU), Glass Filled | Gold | -55 °C | 125 °C | |||||||||||||
Press-Fit | 2.78 mm | 0.11 in | Connector | 1 A | 30 Áin | 0.76 Ám | Beryllium Copper | 30 µin | 0.76 µm | Beryllium Copper | UL94 V-0 | 0.1 in | 2.54 mm | Gold | 2.54 mm | 0.1 in | Polysulfone (PSU), Glass Filled | Gold | -55 °C | 125 °C | 15 mOhm | 28 | DIP, ZIF (ZIP) | 15.24 mm | 0.6 " | Closed Frame | |||||||||||
Solder | Through Hole | 1 A | 30 Áin | 0.76 Ám | Beryllium Copper | 0.6 in | DIP | 15.24 mm | 30 µin | 0.76 µm | Beryllium Copper | UL94 V-0 | 28 | 0.1 in | 2.54 mm | Gold | 2.54 mm | 0.1 in | Polysulfone (PSU), Glass Filled | Gold | 15.24 mm | DIP | 0.6 in | -55 °C | 125 °C | ||||||||||||
Solder | 3.56 mm | 0.14 in | Through Hole | 1 A | Beryllium Copper | 30 µin | 0.76 µm | Beryllium Copper | UL94 V-0 | Gold | Polyethersulfone (PES), Glass Filled | Gold | -55 °C | 150 °C | 28 | SOIC | Closed Frame | ||||||||||||||||||||
Press-Fit | 2.78 mm | 0.11 in | Connector | 1 A | 30 Áin | 0.76 Ám | Beryllium Copper | 30 µin | 0.76 µm | Beryllium Copper | UL94 V-0 | 0.1 in | 2.54 mm | Gold | 2.54 mm | 0.1 in | Polysulfone (PSU), Glass Filled | Gold | -55 °C | 125 °C | 15 mOhm | 28 | DIP, ZIF, ZIP | 10.16 mm | Closed Frame | 0.4 in | |||||||||||
Press-Fit | 2.78 mm | 0.11 in | Connector | 1 A | 30 Áin | 0.76 Ám | Beryllium Copper | 30 µin | 0.76 µm | Beryllium Copper | UL94 V-0 | 0.07 in | 1.78 mm | Gold | 2.54 mm | 0.1 in | Polysulfone (PSU), Glass Filled | Gold | -55 °C | 125 °C | 15 mOhm | 28 | DIP, ZIF (ZIP) | 15.24 mm | 0.6 " | Closed Frame | |||||||||||
Solder | 3.3 mm | 0.13 in | Through Hole | 1 A | 30 Áin | 0.76 Ám | Beryllium Copper | 0.4 in | DIP | 10.16 mm | 30 µin | 0.76 µm | Beryllium Copper | UL94 V-0 | 28 | 0.07 in | 1.78 mm | Gold | 1.78 mm | 0.07 in | Polysulfone (PSU), Glass Filled | Gold | -55 °C | 125 °C |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
228 Series
The 228-1371-00-0602J is a 28-way Textool™ Universal DIP Socket with gold-plated beryllium copper contacts, 2.54mm lead spacing. This socket is glass filled polysulfone insulated, lever actuated zero insertion force mechanism, extra wide contact zone allows insertion of DIP's with distance between rows from 7.62mm through 15.24mm.
Documents
Technical documentation and resources