248-1282-29-0602J
Active3M
IC & COMPONENT SOCKET, 48 CONTACTS, DIP SOCKET, 2.54 MM, 15.24 MM, BERYLLIUM COPPER
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248-1282-29-0602J
Active3M
IC & COMPONENT SOCKET, 48 CONTACTS, DIP SOCKET, 2.54 MM, 15.24 MM, BERYLLIUM COPPER
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Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | 248-1282-29-0602J | 248 Series |
|---|---|---|
| Contact Finish - Mating | Gold | Gold |
| Contact Finish - Post | Gold | Gold |
| Contact Finish Thickness - Mating | 30 Áin | 30 Áin |
| Contact Finish Thickness - Mating | 0.76 Ám | 0.76 Ám |
| Contact Finish Thickness - Post | 30 µin | 30 µin |
| Contact Finish Thickness - Post | 0.76 µm | 0.76 µm |
| Contact Material - Mating | Beryllium Copper | Beryllium Copper |
| Contact Material - Post | Beryllium Copper | Beryllium Copper |
| Contact Resistance | - | 25 mOhm |
| Convert From (Adapter End) | 15.24 mm | 15.24 mm |
| Convert From (Adapter End) | DIP | DIP |
| Convert From (Adapter End) | 0.6 in | 0.6 in |
| Convert To (Adapter End) | 0.6 in | 0.6 in |
| Convert To (Adapter End) | DIP | DIP |
| Convert To (Adapter End) | 15.24 mm | 15.24 mm |
| Current Rating (Amps) | 1 A | 1 A |
| Features | Closed Frame | Closed Frame |
| Housing Material | Polysulfone (PSU), Glass Filled | Polysulfone (PSU), Glass Filled, Polyethersulfone (PES) |
| Material Flammability Rating | UL94 V-0 | UL94 V-0 |
| Mounting Type | Through Hole | Through Hole |
| Number of Positions or Pins (Grid) | - | 48 |
| Operating Temperature [Max] | 125 °C | 125 °C |
| Operating Temperature [Min] | -55 °C | -55 °C |
| Pitch - Mating | 0.1 in | 0.02 - 0.1 in |
| Pitch - Mating | 2.54 mm | 0.5 - 2.54 mm |
| Pitch - Post | 2.54 mm | 2.54 mm |
| Pitch - Post | 0.1 in | 0.1 in |
| Termination | Solder | Solder, Wire Wrap |
| Termination Post Length | 3.3 mm | 3 - 3.3 mm |
| Termination Post Length | 0.13 in | 0.118 - 0.13 in |
| Termination Post Length | - | 0.62 in |
| Termination Post Length | - | 15.75 mm |
| Type | - | QFN |
248 Series
IC & COMPONENT SOCKET, 48 CONTACTS, DIP SOCKET, 2.54 MM, 248 SERIES, 15.24 MM, BERYLLIUM COPPER
| Part | Mounting Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Convert From (Adapter End) | Convert From (Adapter End) | Convert From (Adapter End) | Housing Material | Termination | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Post | Contact Material - Mating | Termination Post Length | Termination Post Length | Current Rating (Amps) | Features | Pitch - Post | Pitch - Post | Contact Finish - Mating | Convert To (Adapter End) | Convert To (Adapter End) | Convert To (Adapter End) | Material Flammability Rating | Pitch - Mating | Pitch - Mating | Contact Material - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Positions or Pins (Grid) | Contact Resistance | Type | Termination Post Length [x] | Termination Post Length [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Through Hole | 30 Áin | 0.76 Ám | 15.24 mm | DIP | 0.6 in | Polysulfone (PSU), Glass Filled | Solder | -55 °C | 125 °C | Gold | Beryllium Copper | 3.3 mm | 0.13 in | 1 A | Closed Frame | 2.54 mm | 0.1 in | Gold | 0.6 in | DIP | 15.24 mm | UL94 V-0 | 0.1 in | 2.54 mm | Beryllium Copper | 30 µin | 0.76 µm | ||||||
Through Hole | Polyethersulfone (PES) | Solder | Gold | Beryllium Copper | 3 mm | 0.118 in | Closed Frame | Gold | 0.02 in | 0.5 mm | Beryllium Copper | 48 | 25 mOhm | QFN | |||||||||||||||||||
Through Hole | Polyethersulfone (PES) | Solder | Gold | Beryllium Copper | 3 mm | 0.118 in | Closed Frame | Gold | 0.02 in | 0.5 mm | Beryllium Copper | 48 | 25 mOhm | QFN | |||||||||||||||||||
Through Hole | 30 Áin | 0.76 Ám | 15.24 mm | DIP | 0.6 in | Polysulfone (PSU), Glass Filled | Wire Wrap | -55 °C | 125 °C | Gold | Beryllium Copper | 1 A | Closed Frame | 2.54 mm | 0.1 in | Gold | 0.6 in | DIP | 15.24 mm | UL94 V-0 | 0.1 in | 2.54 mm | Beryllium Copper | 30 µin | 0.76 µm | 0.62 in | 15.75 mm | ||||||
Through Hole | 30 Áin | 0.76 Ám | 15.24 mm | DIP | 0.6 in | Polysulfone (PSU), Glass Filled | Solder | -55 °C | 125 °C | Gold | Beryllium Copper | 3.3 mm | 0.13 in | 1 A | Closed Frame | 2.54 mm | 0.1 in | Gold | 0.6 in | DIP | 15.24 mm | UL94 V-0 | 0.1 in | 2.54 mm | Beryllium Copper | 30 µin | 0.76 µm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
248 Series
IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
Documents
Technical documentation and resources