248-5205-01

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IC & COMPONENT SOCKET, 48 CONTACTS, QFN TEST SOCKET, 0.5 MM, 248 SERIES, BERYLLIUM COPPER

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248-5205-01

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IC & COMPONENT SOCKET, 48 CONTACTS, QFN TEST SOCKET, 0.5 MM, 248 SERIES, BERYLLIUM COPPER

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Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 132.13
		10	$ 121.25
		25	$ 116.59
		50	$ 112.70
Newark	Each	1	$ 176.24

Description

General part information

248 Series

48 (4 x 12) Pos QFN Socket Gold Through Hole

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Technical documentation and resources

Datasheet

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	248-5205-01	248 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Gold	Gold
Contact Finish Thickness - Mating	-	30 Áin
Contact Finish Thickness - Mating	-	0.76 Ám
Contact Finish Thickness - Post	-	30 µin
Contact Finish Thickness - Post	-	0.76 µm
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post	Beryllium Copper	Beryllium Copper
Contact Resistance	25 mOhm	25 mOhm
Convert From (Adapter End)	-	15.24 mm
Convert From (Adapter End)	-	DIP
Convert From (Adapter End)	-	0.6 in
Convert To (Adapter End)	-	0.6 in
Convert To (Adapter End)	-	DIP
Convert To (Adapter End)	-	15.24 mm
Current Rating (Amps)	-	1 A
Features	Closed Frame	Closed Frame
Housing Material	Polyethersulfone (PES)	Polysulfone (PSU), Glass Filled, Polyethersulfone (PES)
Material Flammability Rating	-	UL94 V-0
Mounting Type	Through Hole	Through Hole
Number of Positions or Pins (Grid)	48	48
Operating Temperature	-	-55 °C
Operating Temperature	-	125 °C
Pitch - Mating	0.02 in	0.02 - 0.1 in
Pitch - Mating	0.5 mm	0.5 - 2.54 mm
Pitch - Post	-	2.54 mm
Pitch - Post	-	0.1 in
Termination	Solder	Solder, Wire Wrap
Termination Post Length	0.118 in	0.118 - 0.13 in
Termination Post Length	3 mm	3 - 3.3 mm
Termination Post Length	-	0.62 in
Termination Post Length	-	15.75 mm
Type	QFN	QFN

248 Series

IC & COMPONENT SOCKET, 48 CONTACTS, DIP SOCKET, 2.54 MM, 248 SERIES, 15.24 MM, BERYLLIUM COPPER

Part	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Convert From (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Housing Material	Termination	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish - Post	Contact Material - Mating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Features	Pitch - Post	Pitch - Post	Contact Finish - Mating	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Material Flammability Rating	Pitch - Mating	Pitch - Mating	Contact Material - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid)	Contact Resistance	Type	Termination Post Length [x]	Termination Post Length [x]
3M 248-1282-09-0602J	Through Hole	30 Áin	0.76 Ám	15.24 mm	DIP	0.6 in	Polysulfone (PSU), Glass Filled	Solder	-55 °C	125 °C	Gold	Beryllium Copper	3.3 mm	0.13 in	1 A	Closed Frame	2.54 mm	0.1 in	Gold	0.6 in	DIP	15.24 mm	UL94 V-0	0.1 in	2.54 mm	Beryllium Copper	30 µin	0.76 µm
3M 248-5205-00	Through Hole						Polyethersulfone (PES)	Solder			Gold	Beryllium Copper	3 mm	0.118 in		Closed Frame			Gold					0.02 in	0.5 mm	Beryllium Copper			48	25 mOhm	QFN
3M 248-5205-01	Through Hole						Polyethersulfone (PES)	Solder			Gold	Beryllium Copper	3 mm	0.118 in		Closed Frame			Gold					0.02 in	0.5 mm	Beryllium Copper			48	25 mOhm	QFN
3M 248-1282-19-0602J	Through Hole	30 Áin	0.76 Ám	15.24 mm	DIP	0.6 in	Polysulfone (PSU), Glass Filled	Wire Wrap	-55 °C	125 °C	Gold	Beryllium Copper			1 A	Closed Frame	2.54 mm	0.1 in	Gold	0.6 in	DIP	15.24 mm	UL94 V-0	0.1 in	2.54 mm	Beryllium Copper	30 µin	0.76 µm				0.62 in	15.75 mm
3M 248-1282-29-0602J	Through Hole	30 Áin	0.76 Ám	15.24 mm	DIP	0.6 in	Polysulfone (PSU), Glass Filled	Solder	-55 °C	125 °C	Gold	Beryllium Copper	3.3 mm	0.13 in	1 A	Closed Frame	2.54 mm	0.1 in	Gold	0.6 in	DIP	15.24 mm	UL94 V-0	0.1 in	2.54 mm	Beryllium Copper	30 µin	0.76 µm