IC & COMPONENT SOCKET, 48 CONTACTS, DIP SOCKET, 2.54 MM, 248 SERIES, 15.24 MM, BERYLLIUM COPPER
| Part | Mounting Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Convert From (Adapter End) | Convert From (Adapter End) | Convert From (Adapter End) | Housing Material | Termination | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Post | Contact Material - Mating | Termination Post Length | Termination Post Length | Current Rating (Amps) | Features | Pitch - Post | Pitch - Post | Contact Finish - Mating | Convert To (Adapter End) | Convert To (Adapter End) | Convert To (Adapter End) | Material Flammability Rating | Pitch - Mating | Pitch - Mating | Contact Material - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Positions or Pins (Grid) | Contact Resistance | Type | Termination Post Length [x] | Termination Post Length [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Through Hole | 30 Áin | 0.76 Ám | 15.24 mm | DIP | 0.6 in | Polysulfone (PSU), Glass Filled | Solder | -55 °C | 125 °C | Gold | Beryllium Copper | 3.3 mm | 0.13 in | 1 A | Closed Frame | 2.54 mm | 0.1 in | Gold | 0.6 in | DIP | 15.24 mm | UL94 V-0 | 0.1 in | 2.54 mm | Beryllium Copper | 30 µin | 0.76 µm | ||||||
Through Hole | Polyethersulfone (PES) | Solder | Gold | Beryllium Copper | 3 mm | 0.118 in | Closed Frame | Gold | 0.02 in | 0.5 mm | Beryllium Copper | 48 | 25 mOhm | QFN | |||||||||||||||||||
Through Hole | Polyethersulfone (PES) | Solder | Gold | Beryllium Copper | 3 mm | 0.118 in | Closed Frame | Gold | 0.02 in | 0.5 mm | Beryllium Copper | 48 | 25 mOhm | QFN | |||||||||||||||||||
Through Hole | 30 Áin | 0.76 Ám | 15.24 mm | DIP | 0.6 in | Polysulfone (PSU), Glass Filled | Wire Wrap | -55 °C | 125 °C | Gold | Beryllium Copper | 1 A | Closed Frame | 2.54 mm | 0.1 in | Gold | 0.6 in | DIP | 15.24 mm | UL94 V-0 | 0.1 in | 2.54 mm | Beryllium Copper | 30 µin | 0.76 µm | 0.62 in | 15.75 mm | ||||||
Through Hole | 30 Áin | 0.76 Ám | 15.24 mm | DIP | 0.6 in | Polysulfone (PSU), Glass Filled | Solder | -55 °C | 125 °C | Gold | Beryllium Copper | 3.3 mm | 0.13 in | 1 A | Closed Frame | 2.54 mm | 0.1 in | Gold | 0.6 in | DIP | 15.24 mm | UL94 V-0 | 0.1 in | 2.54 mm | Beryllium Copper | 30 µin | 0.76 µm |