248-1282-19-0602J

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RECEPTACLE DIP SOCKET 48POS .6"

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248-1282-19-0602J

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RECEPTACLE DIP SOCKET 48POS .6"

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	248-1282-19-0602J	248 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Gold	Gold
Contact Finish Thickness - Mating	30 Áin	30 Áin
Contact Finish Thickness - Mating	0.76 Ám	0.76 Ám
Contact Finish Thickness - Post	30 µin	30 µin
Contact Finish Thickness - Post	0.76 µm	0.76 µm
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post	Beryllium Copper	Beryllium Copper
Contact Resistance	-	25 mOhm
Convert From (Adapter End)	15.24 mm	15.24 mm
Convert From (Adapter End)	DIP	DIP
Convert From (Adapter End)	0.6 in	0.6 in
Convert To (Adapter End)	0.6 in	0.6 in
Convert To (Adapter End)	DIP	DIP
Convert To (Adapter End)	15.24 mm	15.24 mm
Current Rating (Amps)	1 A	1 A
Features	Closed Frame	Closed Frame
Housing Material	Polysulfone (PSU), Glass Filled	Polysulfone (PSU), Glass Filled, Polyethersulfone (PES)
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole
Number of Positions or Pins (Grid)	-	48
Operating Temperature [Max]	125 °C	125 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch - Mating	0.1 in	0.02 - 0.1 in
Pitch - Mating	2.54 mm	0.5 - 2.54 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Wire Wrap	Solder, Wire Wrap
Termination Post Length	-	3 - 3.3 mm
Termination Post Length	-	0.118 - 0.13 in
Termination Post Length [x]	0.62 in	0.62 in
Termination Post Length [x]	15.75 mm	15.75 mm
Type	-	QFN

248 Series

IC & COMPONENT SOCKET, 48 CONTACTS, DIP SOCKET, 2.54 MM, 248 SERIES, 15.24 MM, BERYLLIUM COPPER

Part	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Convert From (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Housing Material	Termination	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish - Post	Contact Material - Mating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Features	Pitch - Post	Pitch - Post	Contact Finish - Mating	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Material Flammability Rating	Pitch - Mating	Pitch - Mating	Contact Material - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid)	Contact Resistance	Type	Termination Post Length [x]	Termination Post Length [x]
3M 248-1282-09-0602J	Through Hole	30 Áin	0.76 Ám	15.24 mm	DIP	0.6 in	Polysulfone (PSU), Glass Filled	Solder	-55 °C	125 °C	Gold	Beryllium Copper	3.3 mm	0.13 in	1 A	Closed Frame	2.54 mm	0.1 in	Gold	0.6 in	DIP	15.24 mm	UL94 V-0	0.1 in	2.54 mm	Beryllium Copper	30 µin	0.76 µm
3M 248-5205-00	Through Hole						Polyethersulfone (PES)	Solder			Gold	Beryllium Copper	3 mm	0.118 in		Closed Frame			Gold					0.02 in	0.5 mm	Beryllium Copper			48	25 mOhm	QFN
3M 248-5205-01	Through Hole						Polyethersulfone (PES)	Solder			Gold	Beryllium Copper	3 mm	0.118 in		Closed Frame			Gold					0.02 in	0.5 mm	Beryllium Copper			48	25 mOhm	QFN
3M 248-1282-19-0602J	Through Hole	30 Áin	0.76 Ám	15.24 mm	DIP	0.6 in	Polysulfone (PSU), Glass Filled	Wire Wrap	-55 °C	125 °C	Gold	Beryllium Copper			1 A	Closed Frame	2.54 mm	0.1 in	Gold	0.6 in	DIP	15.24 mm	UL94 V-0	0.1 in	2.54 mm	Beryllium Copper	30 µin	0.76 µm				0.62 in	15.75 mm
3M 248-1282-29-0602J	Through Hole	30 Áin	0.76 Ám	15.24 mm	DIP	0.6 in	Polysulfone (PSU), Glass Filled	Solder	-55 °C	125 °C	Gold	Beryllium Copper	3.3 mm	0.13 in	1 A	Closed Frame	2.54 mm	0.1 in	Gold	0.6 in	DIP	15.24 mm	UL94 V-0	0.1 in	2.54 mm	Beryllium Copper	30 µin	0.76 µm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

248 Series

IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole

Documents

Technical documentation and resources