SMS-101-02-S-S

Active

Samtec Inc.

HEADERS & WIRE HOUSINGS THROUGH-HOLE MICRO SOCKET, 0.050" X 0.100" PITCH

SMS-101-02-S-S

Active

Samtec Inc.

HEADERS & WIRE HOUSINGS THROUGH-HOLE MICRO SOCKET, 0.050" X 0.100" PITCH

Description Specifications Series Pricing CAD Documents

Description

General part information

SMS Series

1 Position Receptacle Connector Through Hole Gold

Technical Specifications

Parameters and characteristics for this part

Specification	SMS-101-02-S-S

Connector Type	Receptacle
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	30 µin
Contact Length - Post	0.19 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Forked
Current Rating (Per Contact)	5 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.335 in
Insulation Material	Liquid Crystal Polymer (LCP)
Mounting Type	Through Hole
Number of Positions	1
Number of Positions Loaded	All
Number of Rows	1
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Style	Board
Termination	Solder

SMS Series

...

Part	Insulation Color	Current Rating (Per Contact)	Pitch - Mating	Number of Positions	Contact Finish Thickness - Mating	Number of Rows	Connector Type	Row Spacing - Mating	Contact Type	Fastening Type	Insulation Height	Number of Positions Loaded	Operating Temperature (Max)	Operating Temperature (Min)	Style	Termination	Contact Length - Post	Contact Finish - Post	Mounting Type	Contact Finish - Mating	Insulation Material	Contact Material	Contact Shape	Contact Finish Thickness - Post
Samtec Inc. SMS-117-02-S-D	Black	5 A	0.05 in	34	30 µin	2	Receptacle	0.1 in	Forked	Push-Pull	0.335 in	All	125 °C	-55 °C	Board	Solder	0.19 in	Tin	Through Hole	Gold	Liquid Crystal Polymer (LCP)	Phosphor Bronze	Square
Samtec Inc. SMS-122-02-S-S	Black	5 A	0.05 in	22	30 µin	1	Receptacle		Forked	Push-Pull	0.335 in	All	125 °C	-55 °C	Board	Solder	0.19 in	Tin	Through Hole	Gold	Liquid Crystal Polymer (LCP)	Phosphor Bronze	Square
Samtec Inc. SMS-138-01-S-S	Black	5 A	0.05 in	38	30 µin	1	Receptacle		Forked	Push-Pull	0.335 in	All	125 °C	-55 °C	Board	Solder	0.1 in	Tin	Through Hole	Gold
Samtec Inc. SMS-115-01-S-D	Black	5 A	0.05 in	30	30 µin	2	Receptacle	0.1 in	Forked	Push-Pull	0.335 in	All	125 °C	-55 °C	Board	Solder	0.1 in	Tin	Through Hole	Gold	Liquid Crystal Polymer (LCP)	Phosphor Bronze	Square
Samtec Inc. SMS-140-02-L-D	Black	5 A	0.05 in	80	10 µin	2	Receptacle	0.1 in	Forked	Push-Pull	0.335 in	All	125 °C	-55 °C	Board	Solder	0.19 in	Tin	Through Hole	Gold
Samtec Inc. SMS-148-02-G-S	Black	5 A	0.05 in	48	10 µin	1	Receptacle		Forked	Push-Pull	0.335 in	All	125 °C	-55 °C	Board	Solder	0.19 in	Gold	Through Hole	Gold
Samtec Inc. SMS-112-01-G-D	Black	5 A	0.05 in	24 pos	10 µin	2	Receptacle	0.1 in	Forked	Push-Pull	0.335 in	All	125 °C	-55 °C	Board	Solder	0.1 in	Gold	Through Hole	Gold	Liquid Crystal Polymer (LCP)	Phosphor Bronze	Square	3 µin
Samtec Inc. SMS-101-02-S-S	Black	5 A		1	30 µin	1	Receptacle		Forked	Push-Pull	0.335 in	All	125 °C	-55 °C	Board	Solder	0.19 in	Tin	Through Hole	Gold	Liquid Crystal Polymer (LCP)	Phosphor Bronze	Square
Samtec Inc. SMS-111-01-S-D	Black	5 A	0.05 in	22	30 µin	2	Receptacle	0.1 in	Forked	Push-Pull	0.335 in	All	125 °C	-55 °C	Board	Solder	0.1 in	Tin	Through Hole	Gold	Liquid Crystal Polymer (LCP)	Phosphor Bronze	Square
Samtec Inc. SMS-107-01-F-D	Black	5 A	0.05 in	14	3 µin	2	Receptacle	0.1 in	Forked	Push-Pull	0.335 in	All	125 °C	-55 °C	Board	Solder	0.1 in	Tin	Through Hole	Gold

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Create a free account to access distributor pricing data.

CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Datasheet

SMS-101-02-S-S | Datasheet