SMS-112-01-G-D

Active

Samtec Inc.

HEADERS & WIRE HOUSINGS "THROUGH-HOLE MICRO SOCKET

SMS-112-01-G-D

Active

Samtec Inc.

HEADERS & WIRE HOUSINGS "THROUGH-HOLE MICRO SOCKET

Description Specifications Series Pricing CAD Documents

Description

General part information

SMS Series

24 Position Receptacle Connector 0.050" (1.27mm) Through Hole Gold

Technical Specifications

Parameters and characteristics for this part

Specification	SMS-112-01-G-D

Connector Type	Receptacle
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	3 µin
Contact Length - Post	0.1 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Forked
Current Rating (Per Contact)	5 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.335 in
Insulation Material	Liquid Crystal Polymer (LCP)
Mounting Type	Through Hole
Number of Positions	24 pos
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.05 in
Row Spacing - Mating	0.1 in
Style	Board
Termination	Solder

SMS Series

...

Part	Insulation Color	Current Rating (Per Contact)	Pitch - Mating	Number of Positions	Contact Finish Thickness - Mating	Number of Rows	Connector Type	Row Spacing - Mating	Contact Type	Fastening Type	Insulation Height	Number of Positions Loaded	Operating Temperature (Max)	Operating Temperature (Min)	Style	Termination	Contact Length - Post	Contact Finish - Post	Mounting Type	Contact Finish - Mating	Insulation Material	Contact Material	Contact Shape	Contact Finish Thickness - Post
Samtec Inc. SMS-117-02-S-D	Black	5 A	0.05 in	34	30 µin	2	Receptacle	0.1 in	Forked	Push-Pull	0.335 in	All	125 °C	-55 °C	Board	Solder	0.19 in	Tin	Through Hole	Gold	Liquid Crystal Polymer (LCP)	Phosphor Bronze	Square
Samtec Inc. SMS-122-02-S-S	Black	5 A	0.05 in	22	30 µin	1	Receptacle		Forked	Push-Pull	0.335 in	All	125 °C	-55 °C	Board	Solder	0.19 in	Tin	Through Hole	Gold	Liquid Crystal Polymer (LCP)	Phosphor Bronze	Square
Samtec Inc. SMS-138-01-S-S	Black	5 A	0.05 in	38	30 µin	1	Receptacle		Forked	Push-Pull	0.335 in	All	125 °C	-55 °C	Board	Solder	0.1 in	Tin	Through Hole	Gold
Samtec Inc. SMS-115-01-S-D	Black	5 A	0.05 in	30	30 µin	2	Receptacle	0.1 in	Forked	Push-Pull	0.335 in	All	125 °C	-55 °C	Board	Solder	0.1 in	Tin	Through Hole	Gold	Liquid Crystal Polymer (LCP)	Phosphor Bronze	Square
Samtec Inc. SMS-140-02-L-D	Black	5 A	0.05 in	80	10 µin	2	Receptacle	0.1 in	Forked	Push-Pull	0.335 in	All	125 °C	-55 °C	Board	Solder	0.19 in	Tin	Through Hole	Gold
Samtec Inc. SMS-148-02-G-S	Black	5 A	0.05 in	48	10 µin	1	Receptacle		Forked	Push-Pull	0.335 in	All	125 °C	-55 °C	Board	Solder	0.19 in	Gold	Through Hole	Gold
Samtec Inc. SMS-112-01-G-D	Black	5 A	0.05 in	24 pos	10 µin	2	Receptacle	0.1 in	Forked	Push-Pull	0.335 in	All	125 °C	-55 °C	Board	Solder	0.1 in	Gold	Through Hole	Gold	Liquid Crystal Polymer (LCP)	Phosphor Bronze	Square	3 µin
Samtec Inc. SMS-101-02-S-S	Black	5 A		1	30 µin	1	Receptacle		Forked	Push-Pull	0.335 in	All	125 °C	-55 °C	Board	Solder	0.19 in	Tin	Through Hole	Gold	Liquid Crystal Polymer (LCP)	Phosphor Bronze	Square
Samtec Inc. SMS-111-01-S-D	Black	5 A	0.05 in	22	30 µin	2	Receptacle	0.1 in	Forked	Push-Pull	0.335 in	All	125 °C	-55 °C	Board	Solder	0.1 in	Tin	Through Hole	Gold	Liquid Crystal Polymer (LCP)	Phosphor Bronze	Square
Samtec Inc. SMS-107-01-F-D	Black	5 A	0.05 in	14	3 µin	2	Receptacle	0.1 in	Forked	Push-Pull	0.335 in	All	125 °C	-55 °C	Board	Solder	0.1 in	Tin	Through Hole	Gold

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

SMS-112-01-G-D | Datasheet

Through-Hole Micro Socket, 0.050" x 0.100" Pitch

SMS Datasheet

Footprint Drawing (PDF)