CONN RCPT 12POS 0.05 GOLD PCB
| Part | Pitch - Mating | Pitch - Mating | Contact Material | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Insulation Height | Insulation Height | Contact Shape | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions | Insulation Color | Contact Type | Insulation Material | Termination | Current Rating (Amps) | Contact Finish - Post | Number of Positions Loaded | Contact Finish - Mating | Connector Type | Operating Temperature [Min] | Operating Temperature [Max] | Fastening Type | Contact Length - Post | Contact Length - Post | Mounting Type | Number of Rows |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 0.05 in | 1.27 mm | Phosphor Bronze | 2.54 mm | 0.1 in | 0.335 " | 8.51 mm | Square | 10 çin | 0.25 çm | 12 | Black | Forked | Liquid Crystal Polymer (LCP) | Solder | 5 A | Tin | All | Gold | Receptacle | -55 °C | 125 °C | Push-Pull | 2.54 mm | 0.1 in | Through Hole | 2 |
Samtec Inc. | 0.05 in | 1.27 mm | Phosphor Bronze | 0.335 " | 8.51 mm | Square | 30 Áin | 0.76 Ám | 6 | Black | Forked | Liquid Crystal Polymer (LCP) | Solder | 5 A | Tin | All | Gold | Receptacle | -55 °C | 125 °C | Push-Pull | 2.54 mm | 0.1 in | Through Hole | 1 | ||
Samtec Inc. | 0.05 in | 1.27 mm | Phosphor Bronze | 2.54 mm | 0.1 in | 0.335 " | 8.51 mm | Square | 30 Áin | 0.76 Ám | 12 | Black | Forked | Liquid Crystal Polymer (LCP) | Solder | 5 A | Tin | All | Gold | Receptacle | -55 °C | 125 °C | Push-Pull | 2.54 mm | 0.1 in | Through Hole | 2 |