08-350000-10

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Aries Electronics

SOCKET ADAPTER SOIC TO 8DIP 0.3

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Aries Electronics

SOCKET ADAPTER SOIC TO 8DIP 0.3

Technical Specifications

Parameters and characteristics for this part

Part	Material	Package Accepted	Board Thickness	Board Thickness	Board Thickness	Number of Positions	Proto Board Type	Size / Dimension [x]	Size / Dimension [x]	Size / Dimension [y]	Size / Dimension [y]	Pitch [x]	Pitch [x]	Contact Material - Post [custom]	Pitch - Post	Pitch - Post	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Pins	Termination Post Length	Termination Post Length	Convert From (Adapter End)	Board Material	Termination	Mounting Type	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Contact Finish - Post
Aries Electronics 08-350000-10	FR4 Epoxy Glass	SOIC	0.062 in	0.0625 in	1.57 mm	8	SMD to DIP	20.32 mm	0.8 "	0.46 "	11.68 mm	0.05 in	1.27 mm
Aries Electronics 08-350000-10-HT														Brass	2.54 mm	0.1 in	0.05 in	1.27 mm	200 µin	5.08 µm	8	3.18 mm	0.125 in	SOIC	Polyimide (PI)	Solder	Through Hole	0.3 in	DIP	7.62 mm	Tin-Lead
Aries Electronics 08-350000-11-RC-P	FR4 Epoxy Glass	SOIC	0.062 in	0.0625 in	1.57 mm	8	SMD to DIP	20.32 mm	0.8 "	0.46 "	11.68 mm	0.05 in	1.27 mm
Aries Electronics 08-350000-11-RC	FR4 Epoxy Glass	SOIC	0.062 in	0.0625 in	1.57 mm	8	SMD to DIP	20.32 mm	0.8 "	0.46 "	11.68 mm	0.05 in	1.27 mm

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly