08-3500 Series

Part	Proto Board Type	Number of Positions	Material	Board Thickness	Package Accepted	Size / Dimension Width	Size / Dimension Length	Pitch	Mounting Type	Termination	Contact Finish - Mating	Convert From (Adapter End)	Convert To (Adapter End) Size	Convert To (Adapter End) Type	Contact Finish Thickness - Post	Number of Pins	Board Material	Pitch - Post	Contact Material - Post	Termination Post Length	Pitch - Mating	Contact Finish - Post
Aries Electronics 08-350000-10	DIP SMD	8	FR4 Epoxy Glass	0.062 in	SOIC	0.46 in	0.8 in	0.05 in
Aries Electronics 08-350000-10-HT	DIP	8	FR4 Epoxy Glass	0.062 in	SOIC			0.05 in	Through Hole	Solder	Tin	SOIC	0.3 in	DIP Row Spacing	200 µin	8	Polyimide (PI)	0.1 in	Brass	0.125 in	0.05 in	Tin-Lead
Aries Electronics 08-350000-11-RC-P	DIP SMD	8	FR4 Epoxy Glass	0.062 in	SOIC	0.46 in	0.8 in	0.05 in
Aries Electronics 08-350000-10-P	DIP SMD	8	FR4 Epoxy Glass	0.062 in	SOIC	0.46 in	0.8 in	0.05 in
Aries Electronics 08-350000-11-RC	DIP SMD	8	FR4 Epoxy Glass	0.062 in	SOIC	0.46 in	0.8 in	0.05 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Create a free account to access distributor pricing data.

3D models and CAD resources for this part

Technical documentation and resources