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⌘K
SOCKET ADAPTER SOIC TO 8DIP 0.3
| Part | Material | Package Accepted | Board Thickness | Board Thickness | Board Thickness | Number of Positions | Proto Board Type | Size / Dimension [x] | Size / Dimension [x] | Size / Dimension [y] | Size / Dimension [y] | Pitch [x] | Pitch [x] | Contact Material - Post [custom] | Pitch - Post | Pitch - Post | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Pins | Termination Post Length | Termination Post Length | Convert From (Adapter End) | Board Material | Termination | Mounting Type | Convert To (Adapter End) | Convert To (Adapter End) | Convert To (Adapter End) | Contact Finish - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | FR4 Epoxy Glass | SOIC | 0.062 in | 0.0625 in | 1.57 mm | 8 | SMD to DIP | 20.32 mm | 0.8 " | 0.46 " | 11.68 mm | 0.05 in | 1.27 mm | ||||||||||||||||||
Aries Electronics | Brass | 2.54 mm | 0.1 in | 0.05 in | 1.27 mm | 200 µin | 5.08 µm | 8 | 3.18 mm | 0.125 in | SOIC | Polyimide (PI) | Solder | Through Hole | 0.3 in | DIP | 7.62 mm | Tin-Lead | |||||||||||||
Aries Electronics | FR4 Epoxy Glass | SOIC | 0.062 in | 0.0625 in | 1.57 mm | 8 | SMD to DIP | 20.32 mm | 0.8 " | 0.46 " | 11.68 mm | 0.05 in | 1.27 mm | ||||||||||||||||||
Aries Electronics | FR4 Epoxy Glass | SOIC | 0.062 in | 0.0625 in | 1.57 mm | 8 | SMD to DIP | 20.32 mm | 0.8 " | 0.46 " | 11.68 mm | 0.05 in | 1.27 mm |