08-3500 Series

Catalog

SOCKET ADAPTER SOIC TO 8DIP 0.3

Part	Proto Board Type	Number of Positions	Material	Board Thickness	Package Accepted	Size / Dimension Width	Size / Dimension Length	Pitch	Mounting Type	Termination	Contact Finish - Mating	Convert From (Adapter End)	Convert To (Adapter End) Size	Convert To (Adapter End) Type	Contact Finish Thickness - Post	Number of Pins	Board Material	Pitch - Post	Contact Material - Post	Termination Post Length	Pitch - Mating	Contact Finish - Post
Aries Electronics 08-350000-10	DIP SMD	8	FR4 Epoxy Glass	0.062 in	SOIC	0.46 in	0.8 in	0.05 in
Aries Electronics 08-350000-10-HT	DIP	8	FR4 Epoxy Glass	0.062 in	SOIC			0.05 in	Through Hole	Solder	Tin	SOIC	0.3 in	DIP Row Spacing	200 µin	8	Polyimide (PI)	0.1 in	Brass	0.125 in	0.05 in	Tin-Lead
Aries Electronics 08-350000-11-RC-P	DIP SMD	8	FR4 Epoxy Glass	0.062 in	SOIC	0.46 in	0.8 in	0.05 in
Aries Electronics 08-350000-10-P	DIP SMD	8	FR4 Epoxy Glass	0.062 in	SOIC	0.46 in	0.8 in	0.05 in
Aries Electronics 08-350000-11-RC	DIP SMD	8	FR4 Epoxy Glass	0.062 in	SOIC	0.46 in	0.8 in	0.05 in