200-6319-9UN-1900
Active3M
CONN SOCKET PGA ZIF 361POS GOLD
Deep-Dive with AI
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200-6319-9UN-1900
Active3M
CONN SOCKET PGA ZIF 361POS GOLD
Deep-Dive with AI
Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | 200-6319-9UN-1900 | 200 Series |
|---|---|---|
| Accessory Type | - | Plug |
| Contact Finish - Mating | Gold | Gold |
| Contact Finish - Post | Gold | Gold |
| Contact Finish Thickness - Mating | 30 Áin | 30 Áin |
| Contact Finish Thickness - Mating | 0.76 Ám | 0.76 Ám |
| Contact Finish Thickness - Post | 30 µin | 30 µin |
| Contact Finish Thickness - Post | 0.76 µm | 0.76 µm |
| Contact Material - Mating | Beryllium Copper | Beryllium Copper |
| Contact Material - Post | Beryllium Copper | Beryllium Copper |
| Current Rating (Amps) | 1 A | 1 A |
| For Use With/Related Products | - | 3M™ PGA Sockets |
| Housing Material | Polyethersulfone (PES) | Polyethersulfone (PES) |
| Material Flammability Rating | UL94 V-0 | UL94 V-0 |
| Mounting Type | Through Hole | Through Hole |
| Number of Positions or Pins (Grid) | 361 | 121 - 625 |
| Number of Positions or Pins (Grid) | - | 17 |
| Number of Positions or Pins (Grid) | - | 289 |
| Number of Positions or Pins (Grid) | - | 17 |
| Operating Temperature [Max] | 150 °C | 150 °C |
| Operating Temperature [Min] | -55 °C | -55 °C |
| Pitch - Mating | 0.1 in | 0.1 in |
| Pitch - Mating | 2.54 mm | 2.54 mm |
| Pitch - Post | 2.54 mm | 2.54 mm |
| Pitch - Post | 0.1 in | 0.1 in |
| Termination | Solder | Solder |
| Termination Post Length | 3.3 mm | 3.3 mm |
| Termination Post Length | 0.13 in | 0.13 in |
| Type | ZIF (ZIP), PGA | ZIF (ZIP), PGA |
200 Series
CONN SOCKET PGA ZIF 361POS GOLD
| Part | Contact Material - Post | Termination Post Length | Termination Post Length | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Mounting Type | Material Flammability Rating | Number of Positions or Pins (Grid) | Current Rating (Amps) | Contact Finish - Post | Housing Material | Operating Temperature [Min] | Operating Temperature [Max] | Pitch - Mating | Pitch - Mating | Contact Finish - Mating | Type | Contact Material - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Accessory Type | For Use With/Related Products |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Beryllium Copper | 3.3 mm | 0.13 in | 30 Áin | 0.76 Ám | Solder | Through Hole | UL94 V-0 | 361 | 1 A | Gold | Polyethersulfone (PES) | -55 °C | 150 °C | 0.1 in | 2.54 mm | Gold | PGA, ZIF (ZIP) | Beryllium Copper | 30 µin | 0.76 µm | 2.54 mm | 0.1 in | ||||||
Beryllium Copper | 3.3 mm | 0.13 in | 30 Áin | 0.76 Ám | Solder | Through Hole | UL94 V-0 | 169 | 1 A | Gold | Polyethersulfone (PES) | -55 °C | 150 °C | 0.1 in | 2.54 mm | Gold | PGA, ZIF (ZIP) | Beryllium Copper | 30 µin | 0.76 µm | 2.54 mm | 0.1 in | ||||||
Beryllium Copper | 3.3 mm | 0.13 in | 30 Áin | 0.76 Ám | Solder | Through Hole | UL94 V-0 | 1 A | Gold | Polyethersulfone (PES) | -55 °C | 150 °C | 0.1 in | 2.54 mm | Gold | PGA, ZIF (ZIP) | Beryllium Copper | 30 µin | 0.76 µm | 2.54 mm | 0.1 in | 17 | 289 | 17 | ||||
Beryllium Copper | 3.3 mm | 0.13 in | 30 Áin | 0.76 Ám | Solder | Through Hole | UL94 V-0 | 441 | 1 A | Gold | Polyethersulfone (PES) | -55 °C | 150 °C | 0.1 in | 2.54 mm | Gold | PGA, ZIF (ZIP) | Beryllium Copper | 30 µin | 0.76 µm | 2.54 mm | 0.1 in | ||||||
UL94 V-0 | -55 °C | 150 °C | Plug | 3M™ PGA Sockets | ||||||||||||||||||||||||
Beryllium Copper | 3.3 mm | 0.13 in | 30 Áin | 0.76 Ám | Solder | Through Hole | UL94 V-0 | 625 | 1 A | Gold | Polyethersulfone (PES) | -55 °C | 150 °C | 0.1 in | 2.54 mm | Gold | PGA, ZIF (ZIP) | Beryllium Copper | 30 µin | 0.76 µm | 2.54 mm | 0.1 in | ||||||
Beryllium Copper | 3.3 mm | 0.13 in | 30 Áin | 0.76 Ám | Solder | Through Hole | UL94 V-0 | 121 | 1 A | Gold | Polyethersulfone (PES) | -55 °C | 150 °C | 0.1 in | 2.54 mm | Gold | PGA, ZIF (ZIP) | Beryllium Copper | 30 µin | 0.76 µm | 2.54 mm | 0.1 in |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
Description
General part information
200 Series
361 (19 x 19) Pos PGA, ZIF (ZIP) Socket Gold Through Hole
Documents
Technical documentation and resources