200 Series
Manufacturer: 3M
Catalog
CONN SOCKET PGA ZIF 361POS GOLD
| Part | Contact Material - Post | Termination Post Length | Termination Post Length | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Mounting Type | Material Flammability Rating | Number of Positions or Pins (Grid) | Current Rating (Amps) | Contact Finish - Post | Housing Material | Operating Temperature [Min] | Operating Temperature [Max] | Pitch - Mating | Pitch - Mating | Contact Finish - Mating | Type | Contact Material - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Accessory Type | For Use With/Related Products |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Beryllium Copper | 3.3 mm | 0.13 in | 30 Áin | 0.76 Ám | Solder | Through Hole | UL94 V-0 | 361 | 1 A | Gold | Polyethersulfone (PES) | -55 °C | 150 °C | 0.1 in | 2.54 mm | Gold | PGA, ZIF (ZIP) | Beryllium Copper | 30 µin | 0.76 µm | 2.54 mm | 0.1 in | ||||||
Beryllium Copper | 3.3 mm | 0.13 in | 30 Áin | 0.76 Ám | Solder | Through Hole | UL94 V-0 | 169 | 1 A | Gold | Polyethersulfone (PES) | -55 °C | 150 °C | 0.1 in | 2.54 mm | Gold | PGA, ZIF (ZIP) | Beryllium Copper | 30 µin | 0.76 µm | 2.54 mm | 0.1 in | ||||||
Beryllium Copper | 3.3 mm | 0.13 in | 30 Áin | 0.76 Ám | Solder | Through Hole | UL94 V-0 | 1 A | Gold | Polyethersulfone (PES) | -55 °C | 150 °C | 0.1 in | 2.54 mm | Gold | PGA, ZIF (ZIP) | Beryllium Copper | 30 µin | 0.76 µm | 2.54 mm | 0.1 in | 17 | 289 | 17 | ||||
Beryllium Copper | 3.3 mm | 0.13 in | 30 Áin | 0.76 Ám | Solder | Through Hole | UL94 V-0 | 441 | 1 A | Gold | Polyethersulfone (PES) | -55 °C | 150 °C | 0.1 in | 2.54 mm | Gold | PGA, ZIF (ZIP) | Beryllium Copper | 30 µin | 0.76 µm | 2.54 mm | 0.1 in | ||||||
UL94 V-0 | -55 °C | 150 °C | Plug | 3M™ PGA Sockets | ||||||||||||||||||||||||
Beryllium Copper | 3.3 mm | 0.13 in | 30 Áin | 0.76 Ám | Solder | Through Hole | UL94 V-0 | 625 | 1 A | Gold | Polyethersulfone (PES) | -55 °C | 150 °C | 0.1 in | 2.54 mm | Gold | PGA, ZIF (ZIP) | Beryllium Copper | 30 µin | 0.76 µm | 2.54 mm | 0.1 in | ||||||
Beryllium Copper | 3.3 mm | 0.13 in | 30 Áin | 0.76 Ám | Solder | Through Hole | UL94 V-0 | 121 | 1 A | Gold | Polyethersulfone (PES) | -55 °C | 150 °C | 0.1 in | 2.54 mm | Gold | PGA, ZIF (ZIP) | Beryllium Copper | 30 µin | 0.76 µm | 2.54 mm | 0.1 in |