294133-E

Active

TE Connectivity AMP Connectors

DRCQ 0,80 12 M 2 SMD M1 137 E009 176 GU-

294133-E

Active

TE Connectivity AMP Connectors

DRCQ 0,80 12 M 2 SMD M1 137 E009 176 GU-

Description Specifications Series Pricing CAD Documents

Description

General part information

ERNI MicroCon Series

PCB Mount Header, Vertical, Board-to-Board, 12 Position, .8 mm [.031 in] Centerline, Fully Shrouded, Gold (Au), Surface Mount, ERNI MicroCon

Technical Specifications

Parameters and characteristics for this part

Specification	294133-E

Connector Type	Array, Male Pins
Contact Finish	Gold
Features	Solder Retention, Pick and Place, Board Guide
Height Above Board	0.189 in
Mounting Type	Surface Mount
Number of Positions	12
Number of Rows	2
Pitch	0.031 in

ERNI MicroCon Series

Part	Contact Finish	Pitch	Features	Mounting Type	Height Above Board	Connector Type	Number of Rows	Number of Positions	Operating Temperature (Max)	Operating Temperature (Min)	Insulation Color	Contact Finish - Post	Style	Fastening Type	Contact Shape	Number of Positions Loaded	Insulation Material	Row Spacing - Mating	Pitch - Mating	Current Rating	Contact Type	Contact Finish - Mating	Contact Material	Termination	Insulation Height	Contact Finish Thickness - Post	Material Flammability Rating	Shrouding
TE Connectivity AMP Connectors 294009-E	Gold	0.031 in	Board Guide Pick and Place Solder Retention	Surface Mount	0.157 in	Array Female Sockets	2	100
TE Connectivity AMP Connectors 294257-E	Gold	0.031 in	Solder Retention	Right Angle Surface Mount		Array Female Sockets Receptacle	2	50	125 °C	-55 °C	Black	Tin	Board	Push-Pull	Rectangular	All	Liquid Crystal Polymer (LCP)	0.049 in	0.031 in	2.3 A	Female Socket	Gold	Copper Alloy	Solder	0.173 in	157.5 Ąin
TE Connectivity AMP Connectors 454925-E	Gold	0.031 in	Board Guide Pick and Place Solder Retention	Surface Mount	0.236 in	Array Female Sockets	2	16
TE Connectivity AMP Connectors 294133-E	Gold	0.031 in	Board Guide Pick and Place Solder Retention	Surface Mount	0.189 in	Array Male Pins	2	12
TE Connectivity AMP Connectors 484618-E	Gold	0.031 in	Board Guide Solder Retention	Surface Mount	0.543 in	Array Header Male Pins	2	40	125 °C	-55 °C	Black	Tin	Board	Push-Pull	Rectangular	All	Liquid Crystal Polymer (LCP)	0.049 in	0.031 in	2.3 A	Male Pin	Gold	Copper Alloy	Solder	0.543 in	157.5 Ąin	UL94 V-0	Shrouded - 4 Wall
TE Connectivity AMP Connectors 294151-E	Gold	0.031 in	Board Guide Pick and Place Solder Retention	Surface Mount	0.228 in	Array Male Pins	2	50
TE Connectivity AMP Connectors 484619-E	Gold	0.031 in	Board Guide Solder Retention	Surface Mount	0.504 in	Array Header Male Pins	2	40	125 °C	-55 °C	Black	Tin	Board	Push-Pull	Rectangular	All	Liquid Crystal Polymer (LCP)	0.049 in	0.031 in	2.3 A	Male Pin	Gold	Copper Alloy	Solder	0.504 in	157.5 Ąin	UL94 V-0	Shrouded - 4 Wall
TE Connectivity AMP Connectors 294256-E	Gold	0.031 in	Solder Retention	Right Angle Surface Mount		Array Female Sockets Receptacle	2	40	125 °C	-55 °C	Black	Tin	Board	Push-Pull	Rectangular	All	Liquid Crystal Polymer (LCP)	0.049 in	0.031 in	2.3 A	Female Socket	Gold	Copper Alloy	Solder	0.173 in	157.5 Ąin
TE Connectivity AMP Connectors 294150-E	Gold	0.031 in	Board Guide Pick and Place Solder Retention	Surface Mount	0.228 in	Array Male Pins	2	40
TE Connectivity AMP Connectors 294148-E	Gold	0.031 in	Board Guide Pick and Place Solder Retention	Surface Mount	0.228 in	Array Male Pins	2	26