484619-E

Active

TE Connectivity AMP Connectors

DRCQ 0,80 40 M * SMD M9 137 E009 176 GU-

484619-E

Active

TE Connectivity AMP Connectors

DRCQ 0,80 40 M * SMD M9 137 E009 176 GU-

Description Specifications Series Pricing CAD Documents

Description

General part information

ERNI MicroCon Series

PCB Mount Header, Vertical, Board-to-Board, 40 Position, .8 mm [.031 in] Centerline, Fully Shrouded, Gold (Au), Surface Mount, ERNI MicroCon

Technical Specifications

Parameters and characteristics for this part

Specification	484619-E

Connector Type	Array, Male Pins, Header
Contact Finish	Gold
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Post	157.5 Ąin
Contact Material	Copper Alloy
Contact Shape	Rectangular
Contact Type	Male Pin
Current Rating	2.3 A
Fastening Type	Push-Pull
Features	Board Guide, Solder Retention
Height Above Board	0.504 in
Insulation Color	Black
Insulation Height	0.504 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount
Number of Positions	40
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch	0.031 in
Pitch - Mating	0.031 in
Row Spacing - Mating	0.049 in
Shrouding	Shrouded - 4 Wall
Style	Board
Termination	Solder

ERNI MicroCon Series

Part	Contact Finish	Pitch	Features	Mounting Type	Height Above Board	Connector Type	Number of Rows	Number of Positions	Operating Temperature (Max)	Operating Temperature (Min)	Insulation Color	Contact Finish - Post	Style	Fastening Type	Contact Shape	Number of Positions Loaded	Insulation Material	Row Spacing - Mating	Pitch - Mating	Current Rating	Contact Type	Contact Finish - Mating	Contact Material	Termination	Insulation Height	Contact Finish Thickness - Post	Material Flammability Rating	Shrouding
TE Connectivity AMP Connectors 294009-E	Gold	0.031 in	Board Guide Pick and Place Solder Retention	Surface Mount	0.157 in	Array Female Sockets	2	100
TE Connectivity AMP Connectors 294257-E	Gold	0.031 in	Solder Retention	Right Angle Surface Mount		Array Female Sockets Receptacle	2	50	125 °C	-55 °C	Black	Tin	Board	Push-Pull	Rectangular	All	Liquid Crystal Polymer (LCP)	0.049 in	0.031 in	2.3 A	Female Socket	Gold	Copper Alloy	Solder	0.173 in	157.5 Ąin
TE Connectivity AMP Connectors 454925-E	Gold	0.031 in	Board Guide Pick and Place Solder Retention	Surface Mount	0.236 in	Array Female Sockets	2	16
TE Connectivity AMP Connectors 294133-E	Gold	0.031 in	Board Guide Pick and Place Solder Retention	Surface Mount	0.189 in	Array Male Pins	2	12
TE Connectivity AMP Connectors 484618-E	Gold	0.031 in	Board Guide Solder Retention	Surface Mount	0.543 in	Array Header Male Pins	2	40	125 °C	-55 °C	Black	Tin	Board	Push-Pull	Rectangular	All	Liquid Crystal Polymer (LCP)	0.049 in	0.031 in	2.3 A	Male Pin	Gold	Copper Alloy	Solder	0.543 in	157.5 Ąin	UL94 V-0	Shrouded - 4 Wall
TE Connectivity AMP Connectors 294151-E	Gold	0.031 in	Board Guide Pick and Place Solder Retention	Surface Mount	0.228 in	Array Male Pins	2	50
TE Connectivity AMP Connectors 484619-E	Gold	0.031 in	Board Guide Solder Retention	Surface Mount	0.504 in	Array Header Male Pins	2	40	125 °C	-55 °C	Black	Tin	Board	Push-Pull	Rectangular	All	Liquid Crystal Polymer (LCP)	0.049 in	0.031 in	2.3 A	Male Pin	Gold	Copper Alloy	Solder	0.504 in	157.5 Ąin	UL94 V-0	Shrouded - 4 Wall
TE Connectivity AMP Connectors 294256-E	Gold	0.031 in	Solder Retention	Right Angle Surface Mount		Array Female Sockets Receptacle	2	40	125 °C	-55 °C	Black	Tin	Board	Push-Pull	Rectangular	All	Liquid Crystal Polymer (LCP)	0.049 in	0.031 in	2.3 A	Female Socket	Gold	Copper Alloy	Solder	0.173 in	157.5 Ąin
TE Connectivity AMP Connectors 294150-E	Gold	0.031 in	Board Guide Pick and Place Solder Retention	Surface Mount	0.228 in	Array Male Pins	2	40
TE Connectivity AMP Connectors 294148-E	Gold	0.031 in	Board Guide Pick and Place Solder Retention	Surface Mount	0.228 in	Array Male Pins	2	26