ERNI MicroCon Series

Manufacturer: TE Connectivity AMP Connectors

Catalog

DRCB 0,80 100 F SMD F4 137 E009 094 GU-H

Part	Contact Finish	Pitch	Features	Mounting Type	Height Above Board	Connector Type	Number of Rows	Number of Positions	Operating Temperature (Max)	Operating Temperature (Min)	Insulation Color	Contact Finish - Post	Style	Fastening Type	Contact Shape	Number of Positions Loaded	Insulation Material	Row Spacing - Mating	Pitch - Mating	Current Rating	Contact Type	Contact Finish - Mating	Contact Material	Termination	Insulation Height	Contact Finish Thickness - Post	Material Flammability Rating	Shrouding
TE Connectivity AMP Connectors 294009-E	Gold	0.031 in	Board Guide Pick and Place Solder Retention	Surface Mount	0.157 in	Array Female Sockets	2	100
TE Connectivity AMP Connectors 294257-E	Gold	0.031 in	Solder Retention	Right Angle Surface Mount		Array Female Sockets Receptacle	2	50	125 °C	-55 °C	Black	Tin	Board	Push-Pull	Rectangular	All	Liquid Crystal Polymer (LCP)	0.049 in	0.031 in	2.3 A	Female Socket	Gold	Copper Alloy	Solder	0.173 in	157.5 Ąin
TE Connectivity AMP Connectors 454925-E	Gold	0.031 in	Board Guide Pick and Place Solder Retention	Surface Mount	0.236 in	Array Female Sockets	2	16
TE Connectivity AMP Connectors 294133-E	Gold	0.031 in	Board Guide Pick and Place Solder Retention	Surface Mount	0.189 in	Array Male Pins	2	12
TE Connectivity AMP Connectors 484618-E	Gold	0.031 in	Board Guide Solder Retention	Surface Mount	0.543 in	Array Header Male Pins	2	40	125 °C	-55 °C	Black	Tin	Board	Push-Pull	Rectangular	All	Liquid Crystal Polymer (LCP)	0.049 in	0.031 in	2.3 A	Male Pin	Gold	Copper Alloy	Solder	0.543 in	157.5 Ąin	UL94 V-0	Shrouded - 4 Wall
TE Connectivity AMP Connectors 294151-E	Gold	0.031 in	Board Guide Pick and Place Solder Retention	Surface Mount	0.228 in	Array Male Pins	2	50
TE Connectivity AMP Connectors 484619-E	Gold	0.031 in	Board Guide Solder Retention	Surface Mount	0.504 in	Array Header Male Pins	2	40	125 °C	-55 °C	Black	Tin	Board	Push-Pull	Rectangular	All	Liquid Crystal Polymer (LCP)	0.049 in	0.031 in	2.3 A	Male Pin	Gold	Copper Alloy	Solder	0.504 in	157.5 Ąin	UL94 V-0	Shrouded - 4 Wall
TE Connectivity AMP Connectors 294256-E	Gold	0.031 in	Solder Retention	Right Angle Surface Mount		Array Female Sockets Receptacle	2	40	125 °C	-55 °C	Black	Tin	Board	Push-Pull	Rectangular	All	Liquid Crystal Polymer (LCP)	0.049 in	0.031 in	2.3 A	Female Socket	Gold	Copper Alloy	Solder	0.173 in	157.5 Ąin
TE Connectivity AMP Connectors 294150-E	Gold	0.031 in	Board Guide Pick and Place Solder Retention	Surface Mount	0.228 in	Array Male Pins	2	40
TE Connectivity AMP Connectors 294148-E	Gold	0.031 in	Board Guide Pick and Place Solder Retention	Surface Mount	0.228 in	Array Male Pins	2	26