16-8300-610C

Active

Aries Electronics

IC & COMPONENT SOCKETS ELEV. SCKT .3 CENTER COLLET 16 PINS

16-8300-610C

Active

Aries Electronics

IC & COMPONENT SOCKETS ELEV. SCKT .3 CENTER COLLET 16 PINS

Description Specifications Series Pricing CAD Documents

Description

General part information

8 Series

IC & COMPONENT SOCKETS ELEV. SCKT .3 CENTER COLLET 16 PINS

Technical Specifications

Parameters and characteristics for this part

Specification	16-8300-610C

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 µin
Contact Finish Thickness - Post	10 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass
Features	Elevated, Closed Frame
Grid Columns	8
Grid Rows	2
Housing Material	Nylon 4/6, Glass Filled, PA46, Polyamide
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	16
Operating Temperature (Max)	105 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Row Spacing	0.6 in
Termination	Solder
Type	DIP, 0.6" (15.24mm) Row Spacing

8 Series

Part	Termination Post Length	Current Rating	Material Flammability Rating	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Contact Finish Thickness - Mating	Features	Operating Temperature (Min)	Operating Temperature (Max)	Pitch - Post	Contact Finish - Mating	Housing Material	Contact Finish Thickness - Post	Contact Material - Post	Mounting Type	Contact Finish - Post	Contact Material - Mating	Termination	Pitch - Mating	Row Spacing	Type
Aries Electronics 32-8540-610C	0.14 in	3 A	UL94 V-0	16	32	2	30 µin	Closed Frame Elevated	-55 °C	105 °C	0.1 in	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Brass	Through Hole	Gold	Beryllium Copper	Solder	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP
Aries Electronics 26-8350-310C	0.14 in	3 A	UL94 V-0	13	26	2	30 µin	Closed Frame Elevated	-55 °C	105 °C	0.1 in	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Brass	Through Hole	Gold	Beryllium Copper	Solder	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP
Aries Electronics 24-8700-610C				12	24	2	30 µin	Closed Frame Elevated	-55 °C	105 °C	0.1 in	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Brass	Through Hole	Gold	Beryllium Copper	Solder	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP
Aries Electronics 20-8300-310C	0.14 in	3 A	UL94 V-0	10	20	2	30 µin	Closed Frame Elevated	-55 °C	105 °C	0.1 in	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Brass	Through Hole	Gold	Beryllium Copper	Solder	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP
Aries Electronics 16-8300-610C				8	16	2	30 µin	Closed Frame Elevated	-55 °C	105 °C	0.1 in	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Brass	Through Hole	Gold	Beryllium Copper	Solder	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP
Aries Electronics 10-81250-310C				5	10	2	30 µin	Closed Frame Elevated	-55 °C	105 °C	0.1 in	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Brass	Through Hole	Gold	Beryllium Copper	Solder	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP
Aries Electronics 20-8385-310C	0.14 in	3 A	UL94 V-0	10	20	2	30 µin	Closed Frame Elevated	-55 °C	105 °C	0.1 in	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Brass	Through Hole	Gold	Beryllium Copper	Solder	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP
Aries Electronics 32-8600-610C	0.14 in	3 A	UL94 V-0	16	32	2	30 µin	Closed Frame Elevated	-55 °C	105 °C	0.1 in	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Brass	Through Hole	Gold	Beryllium Copper	Solder	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP
Aries Electronics 18-8560-610C	0.14 in	3 A	UL94 V-0	9	18	2	30 µin	Closed Frame Elevated	-55 °C	105 °C	0.1 in	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Brass	Through Hole	Gold	Beryllium Copper	Solder	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP
Aries Electronics 10-8433-610C				5	10	2	30 µin	Closed Frame Elevated	-55 °C	105 °C	0.1 in	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Brass	Through Hole	Gold	Beryllium Copper	Solder	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Create a free account to access distributor pricing data.

CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

16-8300-610C | Datasheet