24-8700-610C

Active

Aries Electronics

IC & COMPONENT SOCKETS ELEV. SCKT .3 CENTER COLLET 24 PINS

24-8700-610C

Active

Aries Electronics

IC & COMPONENT SOCKETS ELEV. SCKT .3 CENTER COLLET 24 PINS

Description Specifications Series Pricing CAD Documents

Description

General part information

8 Series

IC & COMPONENT SOCKETS ELEV. SCKT .3 CENTER COLLET 24 PINS

Technical Specifications

Parameters and characteristics for this part

Specification	24-8700-610C

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 µin
Contact Finish Thickness - Post	10 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass
Features	Elevated, Closed Frame
Grid Columns	12
Grid Rows	2
Housing Material	Nylon 4/6, Glass Filled, PA46, Polyamide
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	24
Operating Temperature (Max)	105 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Row Spacing	0.6 in
Termination	Solder
Type	DIP, 0.6" (15.24mm) Row Spacing

8 Series

Part	Termination Post Length	Current Rating	Material Flammability Rating	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Contact Finish Thickness - Mating	Features	Operating Temperature (Min)	Operating Temperature (Max)	Pitch - Post	Contact Finish - Mating	Housing Material	Contact Finish Thickness - Post	Contact Material - Post	Mounting Type	Contact Finish - Post	Contact Material - Mating	Termination	Pitch - Mating	Row Spacing	Type
Aries Electronics 32-8540-610C	0.14 in	3 A	UL94 V-0	16	32	2	30 µin	Closed Frame Elevated	-55 °C	105 °C	0.1 in	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Brass	Through Hole	Gold	Beryllium Copper	Solder	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP
Aries Electronics 26-8350-310C	0.14 in	3 A	UL94 V-0	13	26	2	30 µin	Closed Frame Elevated	-55 °C	105 °C	0.1 in	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Brass	Through Hole	Gold	Beryllium Copper	Solder	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP
Aries Electronics 24-8700-610C				12	24	2	30 µin	Closed Frame Elevated	-55 °C	105 °C	0.1 in	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Brass	Through Hole	Gold	Beryllium Copper	Solder	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP
Aries Electronics 20-8300-310C	0.14 in	3 A	UL94 V-0	10	20	2	30 µin	Closed Frame Elevated	-55 °C	105 °C	0.1 in	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Brass	Through Hole	Gold	Beryllium Copper	Solder	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP
Aries Electronics 16-8300-610C				8	16	2	30 µin	Closed Frame Elevated	-55 °C	105 °C	0.1 in	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Brass	Through Hole	Gold	Beryllium Copper	Solder	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP
Aries Electronics 10-81250-310C				5	10	2	30 µin	Closed Frame Elevated	-55 °C	105 °C	0.1 in	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Brass	Through Hole	Gold	Beryllium Copper	Solder	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP
Aries Electronics 20-8385-310C	0.14 in	3 A	UL94 V-0	10	20	2	30 µin	Closed Frame Elevated	-55 °C	105 °C	0.1 in	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Brass	Through Hole	Gold	Beryllium Copper	Solder	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP
Aries Electronics 32-8600-610C	0.14 in	3 A	UL94 V-0	16	32	2	30 µin	Closed Frame Elevated	-55 °C	105 °C	0.1 in	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Brass	Through Hole	Gold	Beryllium Copper	Solder	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP
Aries Electronics 18-8560-610C	0.14 in	3 A	UL94 V-0	9	18	2	30 µin	Closed Frame Elevated	-55 °C	105 °C	0.1 in	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Brass	Through Hole	Gold	Beryllium Copper	Solder	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP
Aries Electronics 10-8433-610C				5	10	2	30 µin	Closed Frame Elevated	-55 °C	105 °C	0.1 in	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Brass	Through Hole	Gold	Beryllium Copper	Solder	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

24-8700-610C | Datasheet