8 Series

Catalog

IC & COMPONENT SOCKETS ELEV. SCKT .3 CENTER COLLET 32 PINS

Part	Termination Post Length	Current Rating	Material Flammability Rating	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Contact Finish Thickness - Mating	Features	Operating Temperature (Min)	Operating Temperature (Max)	Pitch - Post	Contact Finish - Mating	Housing Material	Contact Finish Thickness - Post	Contact Material - Post	Mounting Type	Contact Finish - Post	Contact Material - Mating	Termination	Pitch - Mating	Row Spacing	Type
Aries Electronics 32-8540-610C	0.14 in	3 A	UL94 V-0	16	32	2	30 µin	Closed Frame Elevated	-55 °C	105 °C	0.1 in	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Brass	Through Hole	Gold	Beryllium Copper	Solder	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP
Aries Electronics 26-8350-310C	0.14 in	3 A	UL94 V-0	13	26	2	30 µin	Closed Frame Elevated	-55 °C	105 °C	0.1 in	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Brass	Through Hole	Gold	Beryllium Copper	Solder	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP
Aries Electronics 24-8700-610C				12	24	2	30 µin	Closed Frame Elevated	-55 °C	105 °C	0.1 in	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Brass	Through Hole	Gold	Beryllium Copper	Solder	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP
Aries Electronics 20-8300-310C	0.14 in	3 A	UL94 V-0	10	20	2	30 µin	Closed Frame Elevated	-55 °C	105 °C	0.1 in	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Brass	Through Hole	Gold	Beryllium Copper	Solder	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP
Aries Electronics 16-8300-610C				8	16	2	30 µin	Closed Frame Elevated	-55 °C	105 °C	0.1 in	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Brass	Through Hole	Gold	Beryllium Copper	Solder	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP
Aries Electronics 10-81250-310C				5	10	2	30 µin	Closed Frame Elevated	-55 °C	105 °C	0.1 in	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Brass	Through Hole	Gold	Beryllium Copper	Solder	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP
Aries Electronics 20-8385-310C	0.14 in	3 A	UL94 V-0	10	20	2	30 µin	Closed Frame Elevated	-55 °C	105 °C	0.1 in	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Brass	Through Hole	Gold	Beryllium Copper	Solder	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP
Aries Electronics 32-8600-610C	0.14 in	3 A	UL94 V-0	16	32	2	30 µin	Closed Frame Elevated	-55 °C	105 °C	0.1 in	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Brass	Through Hole	Gold	Beryllium Copper	Solder	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP
Aries Electronics 18-8560-610C	0.14 in	3 A	UL94 V-0	9	18	2	30 µin	Closed Frame Elevated	-55 °C	105 °C	0.1 in	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Brass	Through Hole	Gold	Beryllium Copper	Solder	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP
Aries Electronics 10-8433-610C				5	10	2	30 µin	Closed Frame Elevated	-55 °C	105 °C	0.1 in	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Brass	Through Hole	Gold	Beryllium Copper	Solder	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP