11-0518-10H

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Aries Electronics

IC & COMPONENT SOCKETS SINGLE ROW COLLET SOLDER TAIL 11 PINS

11-0518-10H

Active

Aries Electronics

IC & COMPONENT SOCKETS SINGLE ROW COLLET SOLDER TAIL 11 PINS

Description Specifications Series Pricing CAD Documents

Description

General part information

X518 Series

11 (1 x 11) Pos SIP Socket Gold Through Hole

Technical Specifications

Parameters and characteristics for this part

Specification	11-0518-10H

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	200 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass
Current Rating	3 A
Features	Open Frame
Grid Columns	11
Grid Rows	1
Housing Material	Nylon 4/6, Glass Filled, PA46, Polyamide
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	11
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.125 in
Type	SIP

X518 Series

Part	Termination Post Length	Current Rating	Material Flammability Rating	Grid Rows	Grid Columns	Number of Positions or Pins (Grid)	Contact Material - Mating	Pitch - Mating	Housing Material	Features	Contact Finish Thickness - Post	Contact Finish - Post	Contact Finish - Mating	Row Spacing	Type	Contact Material - Post	Mounting Type	Pitch - Post	Contact Finish Thickness - Mating	Termination
Aries Electronics 36-1518-00	0.125 in	3 A	UL94 V-0	2	18	36	Beryllium Copper	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	Open Frame	200 µin	Tin	Gold	0.2 in	0.2" (5.08mm) Row Spacing DIP	Brass	Surface Mount	0.1 in	10 µin	Solder
Aries Electronics 15-0518-10T				1	15	15	Beryllium Copper	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	Open Frame	200 µin	Tin	Gold		SIP	Brass	Through Hole	0.1 in	10 µin	Solder
Aries Electronics 37-0518-00	0.046 in	3 A	UL94 V-0	1	37 count	37 count	Beryllium Copper	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	Open Frame	200 µin	Tin	Gold		SIP	Brass	Surface Mount	0.1 in	10 µin	Solder
Aries Electronics 15-0518-10H	0.125 in	3 A	UL94 V-0	1	15	15	Beryllium Copper	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	Open Frame	200 µin	Tin	Gold		SIP	Brass	Through Hole	0.1 in	10 µin	Solder
Aries Electronics 12-1518-10	0.125 in	3 A	UL94 V-0	2	6 count	12 count	Beryllium Copper	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	Open Frame	200 µin	Tin	Gold	0.2 in	0.2" (5.08mm) Row Spacing DIP	Brass	Through Hole	0.1 in	10 µin	Solder
Aries Electronics 18-0518-11	0.125 in	3 A	UL94 V-0	1	18	18	Beryllium Copper	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	Open Frame	10 µin	Gold	Gold		SIP	Brass	Through Hole	0.1 in	10 µin	Solder
Aries Electronics 06-0518-10T				1	6 count	6	Beryllium Copper	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	Open Frame	200 µin	Tin	Gold		SIP	Brass	Through Hole	0.1 in	10 µin	Solder
Aries Electronics 32-0518-10T	0.125 in	3 A	UL94 V-0	1	32	32	Beryllium Copper	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	Open Frame	200 µin	Tin	Gold		SIP	Brass	Through Hole	0.1 in	10 µin	Solder
Aries Electronics 42-1518-10T				2	21	42	Beryllium Copper	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	Open Frame	200 µin	Tin	Gold	0.2 in	0.2" (5.08mm) Row Spacing DIP	Brass	Through Hole	0.1 in	10 µin	Solder
Aries Electronics 11-0518-10H	0.125 in	3 A	UL94 V-0	1	11	11	Beryllium Copper	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	Open Frame	200 µin	Tin	Gold		SIP	Brass	Through Hole	0.1 in	10 µin	Solder

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

11-0518-10H | Datasheet