29-0518 Series

Catalog

CONN SOCKET SIP 29POS GOLD

Part	Contact Finish - Post	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Type	Material Flammability Rating	Termination Post Length [x]	Termination Post Length [x]	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Mounting Type	Contact Finish - Mating	Contact Material - Post [custom]	Number of Positions or Pins (Grid)	Housing Material	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post	Current Rating (Amps)	Termination Post Length	Termination Post Length
Aries Electronics 29-0518-00	Tin	Solder	200 µin	5.08 µm	Beryllium Copper	SIP	UL94 V-0	0.046 in	1.17 mm	Open Frame	10 çin	0.25 çm	Surface Mount	Gold	Brass	29	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	2.54 mm	0.1 in	3 A
Aries Electronics 29-0518-10T	Tin	Solder	200 µin	5.08 µm	Beryllium Copper	SIP	UL94 V-0			Open Frame	10 çin	0.25 çm	Through Hole	Gold	Brass	29	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	2.54 mm	0.1 in	3 A	3.18 mm	0.125 in
Aries Electronics 29-0518-11	Gold	Solder	10 çin	0.25 çm	Beryllium Copper	SIP	UL94 V-0			Open Frame	10 çin	0.25 çm	Through Hole	Gold	Brass	29	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	2.54 mm	0.1 in	3 A	3.18 mm	0.125 in
Aries Electronics 29-0518-10	Tin	Solder	200 µin	5.08 µm	Beryllium Copper	SIP	UL94 V-0			Open Frame	10 çin	0.25 çm	Through Hole	Gold	Brass	29	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	2.54 mm	0.1 in	3 A	3.18 mm	0.125 in
Aries Electronics 29-0518-11H	Gold	Solder	10 çin	0.25 çm	Beryllium Copper	SIP	UL94 V-0			Open Frame	10 çin	0.25 çm	Through Hole	Gold	Brass	29	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	2.54 mm	0.1 in	3 A	3.18 mm	0.125 in