X518 Series

Catalog

IC & COMPONENT SOCKETS SURFACE MOUNT COLLET DUAL ROW 36 PINS

Part	Termination Post Length	Current Rating	Material Flammability Rating	Grid Rows	Grid Columns	Number of Positions or Pins (Grid)	Contact Material - Mating	Pitch - Mating	Housing Material	Features	Contact Finish Thickness - Post	Contact Finish - Post	Contact Finish - Mating	Row Spacing	Type	Contact Material - Post	Mounting Type	Pitch - Post	Contact Finish Thickness - Mating	Termination
Aries Electronics 36-1518-00	0.125 in	3 A	UL94 V-0	2	18	36	Beryllium Copper	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	Open Frame	200 µin	Tin	Gold	0.2 in	0.2" (5.08mm) Row Spacing DIP	Brass	Surface Mount	0.1 in	10 µin	Solder
Aries Electronics 15-0518-10T				1	15	15	Beryllium Copper	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	Open Frame	200 µin	Tin	Gold		SIP	Brass	Through Hole	0.1 in	10 µin	Solder
Aries Electronics 37-0518-00	0.046 in	3 A	UL94 V-0	1	37 count	37 count	Beryllium Copper	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	Open Frame	200 µin	Tin	Gold		SIP	Brass	Surface Mount	0.1 in	10 µin	Solder
Aries Electronics 15-0518-10H	0.125 in	3 A	UL94 V-0	1	15	15	Beryllium Copper	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	Open Frame	200 µin	Tin	Gold		SIP	Brass	Through Hole	0.1 in	10 µin	Solder
Aries Electronics 12-1518-10	0.125 in	3 A	UL94 V-0	2	6 count	12 count	Beryllium Copper	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	Open Frame	200 µin	Tin	Gold	0.2 in	0.2" (5.08mm) Row Spacing DIP	Brass	Through Hole	0.1 in	10 µin	Solder
Aries Electronics 18-0518-11	0.125 in	3 A	UL94 V-0	1	18	18	Beryllium Copper	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	Open Frame	10 µin	Gold	Gold		SIP	Brass	Through Hole	0.1 in	10 µin	Solder
Aries Electronics 06-0518-10T				1	6 count	6	Beryllium Copper	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	Open Frame	200 µin	Tin	Gold		SIP	Brass	Through Hole	0.1 in	10 µin	Solder
Aries Electronics 32-0518-10T	0.125 in	3 A	UL94 V-0	1	32	32	Beryllium Copper	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	Open Frame	200 µin	Tin	Gold		SIP	Brass	Through Hole	0.1 in	10 µin	Solder
Aries Electronics 42-1518-10T				2	21	42	Beryllium Copper	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	Open Frame	200 µin	Tin	Gold	0.2 in	0.2" (5.08mm) Row Spacing DIP	Brass	Through Hole	0.1 in	10 µin	Solder
Aries Electronics 11-0518-10H	0.125 in	3 A	UL94 V-0	1	11	11	Beryllium Copper	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	Open Frame	200 µin	Tin	Gold		SIP	Brass	Through Hole	0.1 in	10 µin	Solder