06-0518-10T

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Aries Electronics

IC & COMPONENT SOCKETS SINGLE ROW COLLET SOLDER TAIL 6 PINS

06-0518-10T

Active

Aries Electronics

IC & COMPONENT SOCKETS SINGLE ROW COLLET SOLDER TAIL 6 PINS

Description Specifications Series Pricing CAD Documents

Description

General part information

X518 Series

IC & COMPONENT SOCKETS SINGLE ROW COLLET SOLDER TAIL 6 PINS

Technical Specifications

Parameters and characteristics for this part

Specification	06-0518-10T

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	200 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass
Features	Open Frame
Grid Columns	6 count
Grid Rows	1
Housing Material	Nylon 4/6, Glass Filled, PA46, Polyamide
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	6
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Termination	Solder
Type	SIP

X518 Series

Part	Termination Post Length	Current Rating	Material Flammability Rating	Grid Rows	Grid Columns	Number of Positions or Pins (Grid)	Contact Material - Mating	Pitch - Mating	Housing Material	Features	Contact Finish Thickness - Post	Contact Finish - Post	Contact Finish - Mating	Row Spacing	Type	Contact Material - Post	Mounting Type	Pitch - Post	Contact Finish Thickness - Mating	Termination
Aries Electronics 36-1518-00	0.125 in	3 A	UL94 V-0	2	18	36	Beryllium Copper	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	Open Frame	200 µin	Tin	Gold	0.2 in	0.2" (5.08mm) Row Spacing DIP	Brass	Surface Mount	0.1 in	10 µin	Solder
Aries Electronics 15-0518-10T				1	15	15	Beryllium Copper	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	Open Frame	200 µin	Tin	Gold		SIP	Brass	Through Hole	0.1 in	10 µin	Solder
Aries Electronics 37-0518-00	0.046 in	3 A	UL94 V-0	1	37 count	37 count	Beryllium Copper	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	Open Frame	200 µin	Tin	Gold		SIP	Brass	Surface Mount	0.1 in	10 µin	Solder
Aries Electronics 15-0518-10H	0.125 in	3 A	UL94 V-0	1	15	15	Beryllium Copper	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	Open Frame	200 µin	Tin	Gold		SIP	Brass	Through Hole	0.1 in	10 µin	Solder
Aries Electronics 12-1518-10	0.125 in	3 A	UL94 V-0	2	6 count	12 count	Beryllium Copper	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	Open Frame	200 µin	Tin	Gold	0.2 in	0.2" (5.08mm) Row Spacing DIP	Brass	Through Hole	0.1 in	10 µin	Solder
Aries Electronics 18-0518-11	0.125 in	3 A	UL94 V-0	1	18	18	Beryllium Copper	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	Open Frame	10 µin	Gold	Gold		SIP	Brass	Through Hole	0.1 in	10 µin	Solder
Aries Electronics 06-0518-10T				1	6 count	6	Beryllium Copper	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	Open Frame	200 µin	Tin	Gold		SIP	Brass	Through Hole	0.1 in	10 µin	Solder
Aries Electronics 32-0518-10T	0.125 in	3 A	UL94 V-0	1	32	32	Beryllium Copper	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	Open Frame	200 µin	Tin	Gold		SIP	Brass	Through Hole	0.1 in	10 µin	Solder
Aries Electronics 42-1518-10T				2	21	42	Beryllium Copper	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	Open Frame	200 µin	Tin	Gold	0.2 in	0.2" (5.08mm) Row Spacing DIP	Brass	Through Hole	0.1 in	10 µin	Solder
Aries Electronics 11-0518-10H	0.125 in	3 A	UL94 V-0	1	11	11	Beryllium Copper	0.1 in	Glass Filled Nylon 4/6 PA46 Polyamide	Open Frame	200 µin	Tin	Gold		SIP	Brass	Through Hole	0.1 in	10 µin	Solder

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

06-0518-10T | Datasheet