228-1290-09-0602J
Active3M
IC & COMPONENT SOCKET, 28 CONTACTS, DIP SOCKET, 1.78 MM, 10.16 MM, BERYLLIUM COPPER
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228-1290-09-0602J
Active3M
IC & COMPONENT SOCKET, 28 CONTACTS, DIP SOCKET, 1.78 MM, 10.16 MM, BERYLLIUM COPPER
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Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | 228-1290-09-0602J | 228 Series |
|---|---|---|
| Contact Finish - Mating | Gold | Gold |
| Contact Finish - Post | Gold | Gold |
| Contact Finish Thickness - Mating | 30 Áin | 30 Áin |
| Contact Finish Thickness - Mating | 0.76 Ám | 0.76 Ám |
| Contact Finish Thickness - Post | 30 µin | 30 µin |
| Contact Finish Thickness - Post | 0.76 µm | 0.76 µm |
| Contact Material - Mating | Beryllium Copper | Beryllium Copper |
| Contact Material - Post | Beryllium Copper | Beryllium Copper |
| Contact Resistance | - | 15 - 25 mOhm |
| Convert From (Adapter End) | - | 15.24 mm |
| Convert From (Adapter End) | - | DIP |
| Convert From (Adapter End) | - | 0.6 in |
| Convert To (Adapter End) | 0.4 in | 0.4 - 0.6 in |
| Convert To (Adapter End) | DIP | DIP |
| Convert To (Adapter End) | 10.16 mm | 10.16 - 15.24 mm |
| Current Rating (Amps) | 1 A | 1 A |
| Features | - | Closed Frame |
| Housing Material | Polysulfone (PSU), Glass Filled | Polysulfone (PSU), Glass Filled, Polyethersulfone (PES), Polyethersulfone (PES), Glass Filled |
| Material Flammability Rating | UL94 V-0 | UL94 V-0 |
| Mounting Type | Through Hole | Through Hole, Connector |
| Number of Pins | 28 | 28 |
| Number of Positions or Pins (Grid) | - | 4 |
| Number of Positions or Pins (Grid) | - | 28 |
| Number of Positions or Pins (Grid) | - | 7 |
| Operating Temperature [Max] | 125 °C | 125 - 150 °C |
| Operating Temperature [Min] | -55 °C | -55 °C |
| Pitch - Mating | 0.07 in | 0.02 - 0.1 in |
| Pitch - Mating | 1.78 mm | 0.5 - 2.54 mm |
| Pitch - Post | 0.07 in | 0.07 - 0.1 in |
| Pitch - Post | 1.78 mm | 1.78 - 2.54 mm |
| Termination | Solder | Solder, Press-Fit |
| Termination Post Length | 3.3 mm | 2.78 - 3.56 mm |
| Termination Post Length | 0.13 in | 0.11 - 0.14 in |
| Type | - | QFN, DIP, ZIF (ZIP), SOIC, DIP, ZIP, ZIF |
| Type | - | 10.16 - 15.24 mm |
| Type | - | 0.6 " |
| Type | - | 0.4 in |
228 Series
SOCKET ADAPTER 28DIP TO 28DIP
| Part | Termination | Termination Post Length | Termination Post Length | Mounting Type | Current Rating (Amps) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Post | Convert To (Adapter End) | Convert To (Adapter End) | Convert To (Adapter End) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Mating | Material Flammability Rating | Number of Pins | Pitch - Mating | Pitch - Mating | Contact Finish - Mating | Pitch - Post | Pitch - Post | Housing Material | Contact Finish - Post | Convert From (Adapter End) | Convert From (Adapter End) | Convert From (Adapter End) | Operating Temperature [Min] | Operating Temperature [Max] | Contact Resistance | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Type | Type | Type | Features | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Solder | 3.3 mm | 0.13 in | Through Hole | 1 A | 30 Áin | 0.76 Ám | Beryllium Copper | 0.6 in | DIP | 15.24 mm | 30 µin | 0.76 µm | Beryllium Copper | UL94 V-0 | 28 | 0.1 in | 2.54 mm | Gold | 2.54 mm | 0.1 in | Polysulfone (PSU), Glass Filled | Gold | 15.24 mm | DIP | 0.6 in | -55 °C | 125 °C | ||||||||||
Solder | 3 mm | 0.118 in | Through Hole | Beryllium Copper | Beryllium Copper | 0.02 in | 0.5 mm | Gold | Polyethersulfone (PES) | Gold | 25 mOhm | 4 | 28 | 7 | QFN | ||||||||||||||||||||||
Solder | Through Hole | 1 A | 30 Áin | 0.76 Ám | Beryllium Copper | 0.6 in | DIP | 15.24 mm | 30 µin | 0.76 µm | Beryllium Copper | UL94 V-0 | 28 | 0.1 in | 2.54 mm | Gold | 2.54 mm | 0.1 in | Polysulfone (PSU), Glass Filled | Gold | 15.24 mm | DIP | 0.6 in | -55 °C | 125 °C | ||||||||||||
Solder | 3.3 mm | 0.13 in | Through Hole | 1 A | 30 Áin | 0.76 Ám | Beryllium Copper | 0.4 in | DIP | 10.16 mm | 30 µin | 0.76 µm | Beryllium Copper | UL94 V-0 | 28 | 0.1 in | 2.54 mm | Gold | 2.54 mm | 0.1 in | Polysulfone (PSU), Glass Filled | Gold | -55 °C | 125 °C | |||||||||||||
Press-Fit | 2.78 mm | 0.11 in | Connector | 1 A | 30 Áin | 0.76 Ám | Beryllium Copper | 30 µin | 0.76 µm | Beryllium Copper | UL94 V-0 | 0.1 in | 2.54 mm | Gold | 2.54 mm | 0.1 in | Polysulfone (PSU), Glass Filled | Gold | -55 °C | 125 °C | 15 mOhm | 28 | DIP, ZIF (ZIP) | 15.24 mm | 0.6 " | Closed Frame | |||||||||||
Solder | Through Hole | 1 A | 30 Áin | 0.76 Ám | Beryllium Copper | 0.6 in | DIP | 15.24 mm | 30 µin | 0.76 µm | Beryllium Copper | UL94 V-0 | 28 | 0.1 in | 2.54 mm | Gold | 2.54 mm | 0.1 in | Polysulfone (PSU), Glass Filled | Gold | 15.24 mm | DIP | 0.6 in | -55 °C | 125 °C | ||||||||||||
Solder | 3.56 mm | 0.14 in | Through Hole | 1 A | Beryllium Copper | 30 µin | 0.76 µm | Beryllium Copper | UL94 V-0 | Gold | Polyethersulfone (PES), Glass Filled | Gold | -55 °C | 150 °C | 28 | SOIC | Closed Frame | ||||||||||||||||||||
Press-Fit | 2.78 mm | 0.11 in | Connector | 1 A | 30 Áin | 0.76 Ám | Beryllium Copper | 30 µin | 0.76 µm | Beryllium Copper | UL94 V-0 | 0.1 in | 2.54 mm | Gold | 2.54 mm | 0.1 in | Polysulfone (PSU), Glass Filled | Gold | -55 °C | 125 °C | 15 mOhm | 28 | DIP, ZIF, ZIP | 10.16 mm | Closed Frame | 0.4 in | |||||||||||
Press-Fit | 2.78 mm | 0.11 in | Connector | 1 A | 30 Áin | 0.76 Ám | Beryllium Copper | 30 µin | 0.76 µm | Beryllium Copper | UL94 V-0 | 0.07 in | 1.78 mm | Gold | 2.54 mm | 0.1 in | Polysulfone (PSU), Glass Filled | Gold | -55 °C | 125 °C | 15 mOhm | 28 | DIP, ZIF (ZIP) | 15.24 mm | 0.6 " | Closed Frame | |||||||||||
Solder | 3.3 mm | 0.13 in | Through Hole | 1 A | 30 Áin | 0.76 Ám | Beryllium Copper | 0.4 in | DIP | 10.16 mm | 30 µin | 0.76 µm | Beryllium Copper | UL94 V-0 | 28 | 0.07 in | 1.78 mm | Gold | 1.78 mm | 0.07 in | Polysulfone (PSU), Glass Filled | Gold | -55 °C | 125 °C |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
Description
General part information
228 Series
IC Socket Adapter DIP, 0.4" (10.16mm) Row Spacing To DIP, 0.4" (10.16mm) Row Spacing Through Hole
Documents
Technical documentation and resources