TEM-105-02-07.0-G-D

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Samtec Inc.

CONN SHROUDED HEADER (4 SIDES) HDR 10 POS 0.8MM SOLDER ST TOP ENTRY SMD TRAY

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TEM-105-02-07.0-G-D

Active

Samtec Inc.

CONN SHROUDED HEADER (4 SIDES) HDR 10 POS 0.8MM SOLDER ST TOP ENTRY SMD TRAY

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	TEM-105-02-07.0-G-D

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	3 µin
Contact Finish Thickness - Post	0.076 µm
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Amps)	2.9 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Material	Liquid Crystal Polymer (LCP)
Mated Stacking Heights	10 mm
Mounting Type	Surface Mount
Number of Positions	10
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.031 in
Pitch - Mating	0.8 mm
Row Spacing - Mating [x]	1.6 mm
Row Spacing - Mating [x]	0.063 in
Shrouding	Shrouded - 4 Wall
Termination	Solder

TEM-105 Series

Part	Number of Positions Loaded	Termination	Contact Type	Fastening Type	Contact Finish - Post	Contact Finish - Mating	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Current Rating (Amps)	Connector Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Mated Stacking Heights	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Insulation Color	Mounting Type	Number of Positions	Contact Shape	Shrouding	Contact Material	Number of Rows	Operating Temperature [Min]	Operating Temperature [Max]	Insulation Material	Features	Insulation Height	Insulation Height
Samtec Inc. TEM-105-02-07.0-G-D	All	Solder	Male Pin	Push-Pull	Gold	Gold	1.6 mm	0.063 in	2.9 A	Header	3 µin	0.076 µm	10 mm	10 çin	0.25 çm	0.031 in	0.8 mm	Black	Surface Mount	10	Square	Shrouded - 4 Wall	Phosphor Bronze	2	-55 °C	125 °C	Liquid Crystal Polymer (LCP)
Samtec Inc. TEM-105-02-07.0-H-D-A	All	Solder	Male Pin	Push-Pull	Gold	Gold	1.6 mm	0.063 in	2.9 A	Header	3 µin	0.076 µm	10 mm	30 Áin	0.76 Ám	0.031 in	0.8 mm	Black	Surface Mount	10	Square	Shrouded - 4 Wall	Phosphor Bronze	2	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Board Guide
Samtec Inc. TEM-105-02-07.0-H-D-LC-K-TR	All	Solder	Male Pin	Push-Pull	Gold	Gold	1.6 mm	0.063 in	2.9 A	Header	3 µin	0.076 µm	10 mm	30 Áin	0.76 Ám	0.031 in	0.8 mm	Black	Surface Mount	10	Square	Shrouded - 4 Wall	Phosphor Bronze	2	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Board Lock Pick and Place
Samtec Inc. TEM-105-02-07.0-H-D-A-TR	All	Solder	Male Pin	Push-Pull	Gold	Gold	1.6 mm	0.063 in	2.9 A	Header	3 µin	0.076 µm	10 mm	30 Áin	0.76 Ám	0.031 in	0.8 mm	Black	Surface Mount	10	Square	Shrouded - 4 Wall	Phosphor Bronze	2	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Board Guide
Samtec Inc. TEM-105-02-07.0-H-D-WT	All	Solder	Male Pin	Push-Pull	Gold	Gold	1.6 mm	0.063 in	2.9 A	Header	3 µin	0.076 µm	10 mm	30 Áin	0.76 Ám	0.031 in	0.8 mm	Black	Surface Mount	10	Square	Shrouded - 4 Wall	Phosphor Bronze	2	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Solder Retention
Samtec Inc. TEM-105-02-03.0-G-D-L1-K-TR	All	Solder	Male Pin	Latch Lock	Gold	Gold	1.6 mm	0.063 in	2.9 A	Header	3 µin	0.076 µm	6 mm	10 çin	0.25 çm	0.031 in	0.8 mm	Black	Surface Mount	10	Square	Shrouded - 4 Wall	Phosphor Bronze	2	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Pick and Place	5.6 mm	0.22 in
Samtec Inc. TEM-105-02-03.0-H-D-A-K	All	Solder	Male Pin	Push-Pull	Gold	Gold	1.6 mm	0.063 in	2.9 A	Header	3 µin	0.076 µm	6 mm	30 Áin	0.76 Ám	0.031 in	0.8 mm	Black	Surface Mount	10	Square	Shrouded - 4 Wall	Phosphor Bronze	2	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Board Guide Pick and Place	5.6 mm	0.22 in
Samtec Inc. TEM-105-02-04.0-H-D-WT-K-TR	All	Solder	Male Pin	Push-Pull	Gold	Gold	1.6 mm	0.063 in	2.9 A	Header	3 µin	0.076 µm	7 mm	30 Áin	0.76 Ám	0.031 in	0.8 mm	Black	Surface Mount	10	Square	Shrouded - 4 Wall	Phosphor Bronze	2	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Pick and Place Solder Retention	6.6 mm	0.26 in
Samtec Inc. TEM-105-02-03.0-G-D-A-K-TR	All	Solder	Male Pin	Push-Pull	Gold	Gold	1.6 mm	0.063 in	2.9 A	Header	3 µin	0.076 µm	6 mm	10 çin	0.25 çm	0.031 in	0.8 mm	Black	Surface Mount	10	Square	Shrouded - 4 Wall	Phosphor Bronze	2	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Board Guide Pick and Place	5.6 mm	0.22 in
Samtec Inc. TEM-105-02-03.0-G-D-WT	All	Solder	Male Pin	Push-Pull	Gold	Gold	1.6 mm	0.063 in	2.9 A	Header	3 µin	0.076 µm	6 mm	10 çin	0.25 çm	0.031 in	0.8 mm	Black	Surface Mount	10	Square	Shrouded - 4 Wall	Phosphor Bronze	2	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Solder Retention	5.6 mm	0.22 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	84	$ 3.08
LCSC	Piece	1	$ 8.54
		168	$ 3.41
		504	$ 3.30
		1008	$ 3.24

Description

General part information

TEM-105 Series

Connector Header Surface Mount 10 position 0.031" (0.80mm)

Documents

Technical documentation and resources

No documents available