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TEM-105-02-07.0-H-D-A - TEM-105-02-07.0-H-D-A

TEM-105-02-07.0-H-D-A

Active
Samtec Inc.

2 GOLD 1.6MM -55℃~+125℃ PHOSPHOR BRONZE VERTICAL WELDING SMD WIRE TO BOARD CONNECTOR ROHS

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Search across all available documentation for this part.

DocumentsMicro Tiger Eye™ Header Strip, 0.80 mm pitchSEM Series Other Related Documents 03+1
TEM-105-02-07.0-H-D-A - TEM-105-02-07.0-H-D-A

TEM-105-02-07.0-H-D-A

Active
Samtec Inc.

2 GOLD 1.6MM -55℃~+125℃ PHOSPHOR BRONZE VERTICAL WELDING SMD WIRE TO BOARD CONNECTOR ROHS

Deep-Dive with AI

DocumentsMicro Tiger Eye™ Header Strip, 0.80 mm pitchSEM Series Other Related Documents 03+1

Technical Specifications

Parameters and characteristics for this part

SpecificationTEM-105-02-07.0-H-D-A
Connector TypeHeader
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating30 Áin
Contact Finish Thickness - Mating0.76 Ám
Contact Finish Thickness - Post3 µin
Contact Finish Thickness - Post0.076 µm
Contact MaterialPhosphor Bronze
Contact ShapeSquare
Contact TypeMale Pin
Current Rating (Amps)2.9 A
Fastening TypePush-Pull
FeaturesBoard Guide
Insulation ColorBlack
Insulation MaterialLiquid Crystal Polymer (LCP)
Mated Stacking Heights10 mm
Mounting TypeSurface Mount
Number of Positions10
Number of Positions LoadedAll
Number of Rows2
Operating Temperature [Max]125 °C
Operating Temperature [Min]-55 °C
Pitch - Mating0.031 in
Pitch - Mating0.8 mm
Row Spacing - Mating [x]1.6 mm
Row Spacing - Mating [x]0.063 in
ShroudingShrouded - 4 Wall
TerminationSolder

TEM-105 Series

PartNumber of Positions LoadedTerminationContact TypeFastening TypeContact Finish - PostContact Finish - MatingRow Spacing - Mating [x]Row Spacing - Mating [x]Current Rating (Amps)Connector TypeContact Finish Thickness - PostContact Finish Thickness - PostMated Stacking HeightsContact Finish Thickness - MatingContact Finish Thickness - MatingPitch - MatingPitch - MatingInsulation ColorMounting TypeNumber of PositionsContact ShapeShroudingContact MaterialNumber of RowsOperating Temperature [Min]Operating Temperature [Max]Insulation MaterialFeaturesInsulation HeightInsulation Height
Samtec Inc.
TEM-105-02-07.0-G-D
All
Solder
Male Pin
Push-Pull
Gold
Gold
1.6 mm
0.063 in
2.9 A
Header
3 µin
0.076 µm
10 mm
10 çin
0.25 çm
0.031 in
0.8 mm
Black
Surface Mount
10
Square
Shrouded - 4 Wall
Phosphor Bronze
2
-55 °C
125 °C
Liquid Crystal Polymer (LCP)
Samtec Inc.
TEM-105-02-07.0-H-D-A
All
Solder
Male Pin
Push-Pull
Gold
Gold
1.6 mm
0.063 in
2.9 A
Header
3 µin
0.076 µm
10 mm
30 Áin
0.76 Ám
0.031 in
0.8 mm
Black
Surface Mount
10
Square
Shrouded - 4 Wall
Phosphor Bronze
2
-55 °C
125 °C
Liquid Crystal Polymer (LCP)
Board Guide
Samtec Inc.
TEM-105-02-07.0-H-D-LC-K-TR
All
Solder
Male Pin
Push-Pull
Gold
Gold
1.6 mm
0.063 in
2.9 A
Header
3 µin
0.076 µm
10 mm
30 Áin
0.76 Ám
0.031 in
0.8 mm
Black
Surface Mount
10
Square
Shrouded - 4 Wall
Phosphor Bronze
2
-55 °C
125 °C
Liquid Crystal Polymer (LCP)
Board Lock
Pick and Place
Samtec Inc.
TEM-105-02-07.0-H-D-A-TR
All
Solder
Male Pin
Push-Pull
Gold
Gold
1.6 mm
0.063 in
2.9 A
Header
3 µin
0.076 µm
10 mm
30 Áin
0.76 Ám
0.031 in
0.8 mm
Black
Surface Mount
10
Square
Shrouded - 4 Wall
Phosphor Bronze
2
-55 °C
125 °C
Liquid Crystal Polymer (LCP)
Board Guide
Samtec Inc.
TEM-105-02-07.0-H-D-WT
All
Solder
Male Pin
Push-Pull
Gold
Gold
1.6 mm
0.063 in
2.9 A
Header
3 µin
0.076 µm
10 mm
30 Áin
0.76 Ám
0.031 in
0.8 mm
Black
Surface Mount
10
Square
Shrouded - 4 Wall
Phosphor Bronze
2
-55 °C
125 °C
Liquid Crystal Polymer (LCP)
Solder Retention
Samtec Inc.
TEM-105-02-03.0-G-D-L1-K-TR
All
Solder
Male Pin
Latch Lock
Gold
Gold
1.6 mm
0.063 in
2.9 A
Header
3 µin
0.076 µm
6 mm
10 çin
0.25 çm
0.031 in
0.8 mm
Black
Surface Mount
10
Square
Shrouded - 4 Wall
Phosphor Bronze
2
-55 °C
125 °C
Liquid Crystal Polymer (LCP)
Pick and Place
5.6 mm
0.22 in
Samtec Inc.
TEM-105-02-03.0-H-D-A-K
All
Solder
Male Pin
Push-Pull
Gold
Gold
1.6 mm
0.063 in
2.9 A
Header
3 µin
0.076 µm
6 mm
30 Áin
0.76 Ám
0.031 in
0.8 mm
Black
Surface Mount
10
Square
Shrouded - 4 Wall
Phosphor Bronze
2
-55 °C
125 °C
Liquid Crystal Polymer (LCP)
Board Guide
Pick and Place
5.6 mm
0.22 in
Samtec Inc.
TEM-105-02-04.0-H-D-WT-K-TR
All
Solder
Male Pin
Push-Pull
Gold
Gold
1.6 mm
0.063 in
2.9 A
Header
3 µin
0.076 µm
7 mm
30 Áin
0.76 Ám
0.031 in
0.8 mm
Black
Surface Mount
10
Square
Shrouded - 4 Wall
Phosphor Bronze
2
-55 °C
125 °C
Liquid Crystal Polymer (LCP)
Pick and Place
Solder Retention
6.6 mm
0.26 in
Samtec Inc.
TEM-105-02-03.0-G-D-A-K-TR
All
Solder
Male Pin
Push-Pull
Gold
Gold
1.6 mm
0.063 in
2.9 A
Header
3 µin
0.076 µm
6 mm
10 çin
0.25 çm
0.031 in
0.8 mm
Black
Surface Mount
10
Square
Shrouded - 4 Wall
Phosphor Bronze
2
-55 °C
125 °C
Liquid Crystal Polymer (LCP)
Board Guide
Pick and Place
5.6 mm
0.22 in
Samtec Inc.
TEM-105-02-03.0-G-D-WT
All
Solder
Male Pin
Push-Pull
Gold
Gold
1.6 mm
0.063 in
2.9 A
Header
3 µin
0.076 µm
6 mm
10 çin
0.25 çm
0.031 in
0.8 mm
Black
Surface Mount
10
Square
Shrouded - 4 Wall
Phosphor Bronze
2
-55 °C
125 °C
Liquid Crystal Polymer (LCP)
Solder Retention
5.6 mm
0.22 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTray 84$ 3.33
168$ 3.31
LCSCPiece 1$ 7.74
168$ 3.09
504$ 2.98
1008$ 2.93

Description

General part information

TEM-105 Series

Connector Header Surface Mount 10 position 0.031" (0.80mm)