TEM-105 Series

Catalog

CONN SHROUDED HEADER (4 SIDES) HDR 10 POS 0.8MM SOLDER ST TOP ENTRY SMD TRAY

Part	Number of Positions Loaded	Termination	Contact Type	Fastening Type	Contact Finish - Post	Contact Finish - Mating	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Current Rating (Amps)	Connector Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Mated Stacking Heights	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Insulation Color	Mounting Type	Number of Positions	Contact Shape	Shrouding	Contact Material	Number of Rows	Operating Temperature [Min]	Operating Temperature [Max]	Insulation Material	Features	Insulation Height	Insulation Height
Samtec Inc. TEM-105-02-07.0-G-D	All	Solder	Male Pin	Push-Pull	Gold	Gold	1.6 mm	0.063 in	2.9 A	Header	3 µin	0.076 µm	10 mm	10 çin	0.25 çm	0.031 in	0.8 mm	Black	Surface Mount	10	Square	Shrouded - 4 Wall	Phosphor Bronze	2	-55 °C	125 °C	Liquid Crystal Polymer (LCP)
Samtec Inc. TEM-105-02-07.0-H-D-A	All	Solder	Male Pin	Push-Pull	Gold	Gold	1.6 mm	0.063 in	2.9 A	Header	3 µin	0.076 µm	10 mm	30 Áin	0.76 Ám	0.031 in	0.8 mm	Black	Surface Mount	10	Square	Shrouded - 4 Wall	Phosphor Bronze	2	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Board Guide
Samtec Inc. TEM-105-02-07.0-H-D-LC-K-TR	All	Solder	Male Pin	Push-Pull	Gold	Gold	1.6 mm	0.063 in	2.9 A	Header	3 µin	0.076 µm	10 mm	30 Áin	0.76 Ám	0.031 in	0.8 mm	Black	Surface Mount	10	Square	Shrouded - 4 Wall	Phosphor Bronze	2	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Board Lock Pick and Place
Samtec Inc. TEM-105-02-07.0-H-D-A-TR	All	Solder	Male Pin	Push-Pull	Gold	Gold	1.6 mm	0.063 in	2.9 A	Header	3 µin	0.076 µm	10 mm	30 Áin	0.76 Ám	0.031 in	0.8 mm	Black	Surface Mount	10	Square	Shrouded - 4 Wall	Phosphor Bronze	2	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Board Guide
Samtec Inc. TEM-105-02-07.0-H-D-WT	All	Solder	Male Pin	Push-Pull	Gold	Gold	1.6 mm	0.063 in	2.9 A	Header	3 µin	0.076 µm	10 mm	30 Áin	0.76 Ám	0.031 in	0.8 mm	Black	Surface Mount	10	Square	Shrouded - 4 Wall	Phosphor Bronze	2	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Solder Retention
Samtec Inc. TEM-105-02-03.0-G-D-L1-K-TR	All	Solder	Male Pin	Latch Lock	Gold	Gold	1.6 mm	0.063 in	2.9 A	Header	3 µin	0.076 µm	6 mm	10 çin	0.25 çm	0.031 in	0.8 mm	Black	Surface Mount	10	Square	Shrouded - 4 Wall	Phosphor Bronze	2	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Pick and Place	5.6 mm	0.22 in
Samtec Inc. TEM-105-02-03.0-H-D-A-K	All	Solder	Male Pin	Push-Pull	Gold	Gold	1.6 mm	0.063 in	2.9 A	Header	3 µin	0.076 µm	6 mm	30 Áin	0.76 Ám	0.031 in	0.8 mm	Black	Surface Mount	10	Square	Shrouded - 4 Wall	Phosphor Bronze	2	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Board Guide Pick and Place	5.6 mm	0.22 in
Samtec Inc. TEM-105-02-04.0-H-D-WT-K-TR	All	Solder	Male Pin	Push-Pull	Gold	Gold	1.6 mm	0.063 in	2.9 A	Header	3 µin	0.076 µm	7 mm	30 Áin	0.76 Ám	0.031 in	0.8 mm	Black	Surface Mount	10	Square	Shrouded - 4 Wall	Phosphor Bronze	2	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Pick and Place Solder Retention	6.6 mm	0.26 in
Samtec Inc. TEM-105-02-03.0-G-D-A-K-TR	All	Solder	Male Pin	Push-Pull	Gold	Gold	1.6 mm	0.063 in	2.9 A	Header	3 µin	0.076 µm	6 mm	10 çin	0.25 çm	0.031 in	0.8 mm	Black	Surface Mount	10	Square	Shrouded - 4 Wall	Phosphor Bronze	2	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Board Guide Pick and Place	5.6 mm	0.22 in
Samtec Inc. TEM-105-02-03.0-G-D-WT	All	Solder	Male Pin	Push-Pull	Gold	Gold	1.6 mm	0.063 in	2.9 A	Header	3 µin	0.076 µm	6 mm	10 çin	0.25 çm	0.031 in	0.8 mm	Black	Surface Mount	10	Square	Shrouded - 4 Wall	Phosphor Bronze	2	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Solder Retention	5.6 mm	0.22 in