CQ100GE 250G

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Chip Quik Inc.

GERMANIUM DOPED SOLDER PASTE NO-

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Chip Quik Inc.

GERMANIUM DOPED SOLDER PASTE NO-

Technical Specifications

Parameters and characteristics for this part

Specification	CQ100GE 250G

Composition	99.244, 0.05, 0.7, 0.006
Flux Type	No-Clean
Form	Jar, 8.8 oz (250g)
Melting Point [custom]	441 °F
Melting Point [custom]	227 °C
Mesh Type [custom]	4
Shelf Life	6 Months
Shelf Life Start	Date of Manufacture
Shipping Info	Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Type	Solder Paste

Part	Melting Point [custom]	Melting Point [custom]	Mesh Type [custom]	Type	Shelf Life	Composition	Form	Flux Type	Shipping Info	Shelf Life Start	Diameter [diameter]	Diameter [diameter]	Form	Form	Form
Chip Quik Inc. CQ100GE 250G	441 °F	227 °C	4	Solder Paste	6 Months	0.006 0.05 0.7 99.244	Jar 8.8 oz (250g)	No-Clean	Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended.	Date of Manufacture
Chip Quik Inc. CQ100GE.031 1LB	441 °F	227 °C		Wire Solder		0.006 0.05 0.7 99.244	Spool 1 lb (454 g)	No-Clean
Chip Quik Inc. CQ100GE.020 1LB	441 °F	227 °C		Wire Solder		0.006 0.05 0.7 99.244	Spool 1 lb (454 g)	No-Clean			0.51 mm	0.02 in
Chip Quik Inc. CQ100GE	441 °F	227 °C		Bar Solder		0.006 0.05 0.7 99.244	Bar						1 lb	454 g
Chip Quik Inc. CQ100GE 35G	441 °F	227 °C	4	Solder Paste	6 Months	0.006 0.05 0.7 99.244	Syringe	No-Clean		Date of Manufacture			1.23 oz	35 g	10 cc

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 58.95

General part information

Lead Free No-Clean Solder Paste Sn99.244Cu0.7 (Ni0.05/Ge0.006) Jar, 8.8 oz (250g)

Technical documentation and resources