CQ100GE

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GERMANIUM DOPED SUPER LOW DROSS

Active

GERMANIUM DOPED SUPER LOW DROSS

Description

General part information

Lead Free Bar Solder Sn99.244Cu0.7 (Ni0.05/Ge0.006) Bar, 1 lb (454g)

Parameters and characteristics for this part

Part	Shipping Info	Type	Composition Elements	Composition Formula	Cu Composition	Sn Composition	Ni Composition	Mesh Type	Melting Point	Shelf Life	Process	Shelf Life Start	Form	Form Weight	Storage/Refrigeration Temperature (Maximum)	Storage/Refrigeration Temperature (Minimum)	Diameter	Form Volume
Chip Quik Inc. CQ100GE 250G	Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended.	Solder Paste	Cu Ge Ni Sn	Sn99.244Cu0.7	0.7 %	99.244 %	0.05 %	4	441 °F	6 Months	Lead Free	Date of Manufacture	Jar	8.8 oz	46 °F	37 °F
Chip Quik Inc. CQ100GE.031 1LB		Wire Solder	Cu Ge Ni Sn	Sn99.244Cu0.7	0.7 %	99.244 %	0.05 %		441 °F		Lead Free		Spool	1 lb			0.031 in
Chip Quik Inc. CQ100GE.020 1LB		Wire Solder	Cu Ge Ni Sn	Sn99.244Cu0.7	0.7 %	99.244 %	0.05 %		441 °F		Lead Free		Spool	1 lb			0.02 in
Chip Quik Inc. CQ100GE		Bar Solder	Cu Ge Ni Sn	Sn99.244Cu0.7	0.7 %	99.244 %	0.05 %		441 °F		Lead Free		Bar	1 lb
Chip Quik Inc. CQ100GE 35G		Solder Paste	Cu Ge Ni Sn	Sn99.244Cu0.7	0.7 %	99.244 %	0.05 %	4	441 °F	6 Months	Lead Free	Date of Manufacture	Syringe	1.23 oz	46 °F	37 °F		10 cc

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