CQ100G Series
Manufacturer: Chip Quik Inc.
Beta
⌘K
GERMANIUM DOPED SOLDER PASTE NO-
| Part | Shipping Info | Type | Composition Elements | Composition Formula | Cu Composition | Sn Composition | Ni Composition | Mesh Type | Melting Point | Shelf Life | Process | Shelf Life Start | Form | Form Weight | Storage/Refrigeration Temperature (Maximum) | Storage/Refrigeration Temperature (Minimum) | Diameter | Form Volume |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Chip Quik Inc. | Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended. | Solder Paste | Cu Ge Ni Sn | Sn99.244Cu0.7 | 0.7 % | 99.244 % | 0.05 % | 4 | 441 °F | 6 Months | Lead Free | Date of Manufacture | Jar | 8.8 oz | 46 °F | 37 °F | ||
 Chip Quik Inc. | Wire Solder | Cu Ge Ni Sn | Sn99.244Cu0.7 | 0.7 % | 99.244 % | 0.05 % | 441 °F | Lead Free | Spool | 1 lb | 0.031 in | |||||||
 Chip Quik Inc. | Wire Solder | Cu Ge Ni Sn | Sn99.244Cu0.7 | 0.7 % | 99.244 % | 0.05 % | 441 °F | Lead Free | Spool | 1 lb | 0.02 in | |||||||
 Chip Quik Inc. | Bar Solder | Cu Ge Ni Sn | Sn99.244Cu0.7 | 0.7 % | 99.244 % | 0.05 % | 441 °F | Lead Free | Bar | 1 lb | ||||||||
 Chip Quik Inc. | Solder Paste | Cu Ge Ni Sn | Sn99.244Cu0.7 | 0.7 % | 99.244 % | 0.05 % | 4 | 441 °F | 6 Months | Lead Free | Date of Manufacture | Syringe | 1.23 oz | 46 °F | 37 °F | 10 cc |