248-5205-01
Active3M
IC & COMPONENT SOCKET, 48 CONTACTS, QFN TEST SOCKET, 0.5 MM, 248 SERIES, BERYLLIUM COPPER
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248-5205-01
Active3M
IC & COMPONENT SOCKET, 48 CONTACTS, QFN TEST SOCKET, 0.5 MM, 248 SERIES, BERYLLIUM COPPER
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Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | 248-5205-01 | 248 Series |
|---|---|---|
| Contact Finish - Mating | Gold | Gold |
| Contact Finish - Post | Gold | Gold |
| Contact Finish Thickness - Mating | - | 30 Áin |
| Contact Finish Thickness - Mating | - | 0.76 Ám |
| Contact Finish Thickness - Post | - | 30 µin |
| Contact Finish Thickness - Post | - | 0.76 µm |
| Contact Material - Mating | Beryllium Copper | Beryllium Copper |
| Contact Material - Post | Beryllium Copper | Beryllium Copper |
| Contact Resistance | 25 mOhm | 25 mOhm |
| Convert From (Adapter End) | - | 15.24 mm |
| Convert From (Adapter End) | - | DIP |
| Convert From (Adapter End) | - | 0.6 in |
| Convert To (Adapter End) | - | 0.6 in |
| Convert To (Adapter End) | - | DIP |
| Convert To (Adapter End) | - | 15.24 mm |
| Current Rating (Amps) | - | 1 A |
| Features | Closed Frame | Closed Frame |
| Housing Material | Polyethersulfone (PES) | Polysulfone (PSU), Glass Filled, Polyethersulfone (PES) |
| Material Flammability Rating | - | UL94 V-0 |
| Mounting Type | Through Hole | Through Hole |
| Number of Positions or Pins (Grid) | 48 | 48 |
| Operating Temperature | - | -55 °C |
| Operating Temperature | - | 125 °C |
| Pitch - Mating | 0.02 in | 0.02 - 0.1 in |
| Pitch - Mating | 0.5 mm | 0.5 - 2.54 mm |
| Pitch - Post | - | 2.54 mm |
| Pitch - Post | - | 0.1 in |
| Termination | Solder | Solder, Wire Wrap |
| Termination Post Length | 0.118 in | 0.118 - 0.13 in |
| Termination Post Length | 3 mm | 3 - 3.3 mm |
| Termination Post Length | - | 0.62 in |
| Termination Post Length | - | 15.75 mm |
| Type | QFN | QFN |
248 Series
IC & COMPONENT SOCKET, 48 CONTACTS, DIP SOCKET, 2.54 MM, 248 SERIES, 15.24 MM, BERYLLIUM COPPER
| Part | Mounting Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Convert From (Adapter End) | Convert From (Adapter End) | Convert From (Adapter End) | Housing Material | Termination | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Post | Contact Material - Mating | Termination Post Length | Termination Post Length | Current Rating (Amps) | Features | Pitch - Post | Pitch - Post | Contact Finish - Mating | Convert To (Adapter End) | Convert To (Adapter End) | Convert To (Adapter End) | Material Flammability Rating | Pitch - Mating | Pitch - Mating | Contact Material - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Positions or Pins (Grid) | Contact Resistance | Type | Termination Post Length [x] | Termination Post Length [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Through Hole | 30 Áin | 0.76 Ám | 15.24 mm | DIP | 0.6 in | Polysulfone (PSU), Glass Filled | Solder | -55 °C | 125 °C | Gold | Beryllium Copper | 3.3 mm | 0.13 in | 1 A | Closed Frame | 2.54 mm | 0.1 in | Gold | 0.6 in | DIP | 15.24 mm | UL94 V-0 | 0.1 in | 2.54 mm | Beryllium Copper | 30 µin | 0.76 µm | ||||||
Through Hole | Polyethersulfone (PES) | Solder | Gold | Beryllium Copper | 3 mm | 0.118 in | Closed Frame | Gold | 0.02 in | 0.5 mm | Beryllium Copper | 48 | 25 mOhm | QFN | |||||||||||||||||||
Through Hole | Polyethersulfone (PES) | Solder | Gold | Beryllium Copper | 3 mm | 0.118 in | Closed Frame | Gold | 0.02 in | 0.5 mm | Beryllium Copper | 48 | 25 mOhm | QFN | |||||||||||||||||||
Through Hole | 30 Áin | 0.76 Ám | 15.24 mm | DIP | 0.6 in | Polysulfone (PSU), Glass Filled | Wire Wrap | -55 °C | 125 °C | Gold | Beryllium Copper | 1 A | Closed Frame | 2.54 mm | 0.1 in | Gold | 0.6 in | DIP | 15.24 mm | UL94 V-0 | 0.1 in | 2.54 mm | Beryllium Copper | 30 µin | 0.76 µm | 0.62 in | 15.75 mm | ||||||
Through Hole | 30 Áin | 0.76 Ám | 15.24 mm | DIP | 0.6 in | Polysulfone (PSU), Glass Filled | Solder | -55 °C | 125 °C | Gold | Beryllium Copper | 3.3 mm | 0.13 in | 1 A | Closed Frame | 2.54 mm | 0.1 in | Gold | 0.6 in | DIP | 15.24 mm | UL94 V-0 | 0.1 in | 2.54 mm | Beryllium Copper | 30 µin | 0.76 µm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
248 Series
48 (4 x 12) Pos QFN Socket Gold Through Hole
Documents
Technical documentation and resources