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228-1277-19-0602J - 228-1277-19-0602J

228-1277-19-0602J

Active
3M

JE150084125 228-1277-19-0602J=ZIPDIPRECEPTACLE-WIREWRAP ROHS COMPLIANT: YES

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228-1277-19-0602J - 228-1277-19-0602J

228-1277-19-0602J

Active
3M

JE150084125 228-1277-19-0602J=ZIPDIPRECEPTACLE-WIREWRAP ROHS COMPLIANT: YES

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Technical Specifications

Parameters and characteristics commom to parts in this series

Specification228-1277-19-0602J228 Series
Contact Finish - MatingGoldGold
Contact Finish - PostGoldGold
Contact Finish Thickness - Mating30 Áin30 Áin
Contact Finish Thickness - Mating0.76 Ám0.76 Ám
Contact Finish Thickness - Post30 µin30 µin
Contact Finish Thickness - Post0.76 µm0.76 µm
Contact Material - MatingBeryllium CopperBeryllium Copper
Contact Material - PostBeryllium CopperBeryllium Copper
Contact Resistance-15 - 25 mOhm
Convert From (Adapter End)15.24 mm15.24 mm
Convert From (Adapter End)DIPDIP
Convert From (Adapter End)0.6 in0.6 in
Convert To (Adapter End)0.6 in0.4 - 0.6 in
Convert To (Adapter End)DIPDIP
Convert To (Adapter End)15.24 mm10.16 - 15.24 mm
Current Rating (Amps)1 A1 A
Features-Closed Frame
Housing MaterialPolysulfone (PSU), Glass FilledPolysulfone (PSU), Glass Filled, Polyethersulfone (PES), Polyethersulfone (PES), Glass Filled
Material Flammability RatingUL94 V-0UL94 V-0
Mounting TypeThrough HoleThrough Hole, Connector
Number of Pins2828
Number of Positions or Pins (Grid)-4
Number of Positions or Pins (Grid)-28
Number of Positions or Pins (Grid)-7
Operating Temperature [Max]125 °C125 - 150 °C
Operating Temperature [Min]-55 °C-55 °C
Pitch - Mating0.1 in0.02 - 0.1 in
Pitch - Mating2.54 mm0.5 - 2.54 mm
Pitch - Post2.54 mm1.78 - 2.54 mm
Pitch - Post0.1 in0.07 - 0.1 in
TerminationSolderSolder, Press-Fit
Termination Post Length-2.78 - 3.56 mm
Termination Post Length-0.11 - 0.14 in
Type-QFN, DIP, ZIF (ZIP), SOIC, DIP, ZIP, ZIF
Type-10.16 - 15.24 mm
Type-0.6 "
Type-0.4 in

228 Series

SOCKET ADAPTER 28DIP TO 28DIP

PartTerminationTermination Post LengthTermination Post LengthMounting TypeCurrent Rating (Amps)Contact Finish Thickness - MatingContact Finish Thickness - MatingContact Material - PostConvert To (Adapter End)Convert To (Adapter End)Convert To (Adapter End)Contact Finish Thickness - PostContact Finish Thickness - PostContact Material - MatingMaterial Flammability RatingNumber of PinsPitch - MatingPitch - MatingContact Finish - MatingPitch - PostPitch - PostHousing MaterialContact Finish - PostConvert From (Adapter End)Convert From (Adapter End)Convert From (Adapter End)Operating Temperature [Min]Operating Temperature [Max]Contact ResistanceNumber of Positions or Pins (Grid) [custom]Number of Positions or Pins (Grid)Number of Positions or Pins (Grid) [custom]TypeTypeTypeFeaturesType
3M
228-1277-09-0602J
Solder
3.3 mm
0.13 in
Through Hole
1 A
30 Áin
0.76 Ám
Beryllium Copper
0.6 in
DIP
15.24 mm
30 µin
0.76 µm
Beryllium Copper
UL94 V-0
28
0.1 in
2.54 mm
Gold
2.54 mm
0.1 in
Polysulfone (PSU), Glass Filled
Gold
15.24 mm
DIP
0.6 in
-55 °C
125 °C
3M
228-5204-01
Solder
3 mm
0.118 in
Through Hole
Beryllium Copper
Beryllium Copper
0.02 in
0.5 mm
Gold
Polyethersulfone (PES)
Gold
25 mOhm
4
28
7
QFN
3M
228-1277-39-0602J
Solder
Through Hole
1 A
30 Áin
0.76 Ám
Beryllium Copper
0.6 in
DIP
15.24 mm
30 µin
0.76 µm
Beryllium Copper
UL94 V-0
28
0.1 in
2.54 mm
Gold
2.54 mm
0.1 in
Polysulfone (PSU), Glass Filled
Gold
15.24 mm
DIP
0.6 in
-55 °C
125 °C
3M
228-4817-09-0602J
Solder
3.3 mm
0.13 in
Through Hole
1 A
30 Áin
0.76 Ám
Beryllium Copper
0.4 in
DIP
10.16 mm
30 µin
0.76 µm
Beryllium Copper
UL94 V-0
28
0.1 in
2.54 mm
Gold
2.54 mm
0.1 in
Polysulfone (PSU), Glass Filled
Gold
-55 °C
125 °C
3M
228-1371-00-0602J
Press-Fit
2.78 mm
0.11 in
Connector
1 A
30 Áin
0.76 Ám
Beryllium Copper
30 µin
0.76 µm
Beryllium Copper
UL94 V-0
0.1 in
2.54 mm
Gold
2.54 mm
0.1 in
Polysulfone (PSU), Glass Filled
Gold
-55 °C
125 °C
15 mOhm
28
DIP, ZIF (ZIP)
15.24 mm
0.6 "
Closed Frame
3M
228-1277-19-0602J
Solder
Through Hole
1 A
30 Áin
0.76 Ám
Beryllium Copper
0.6 in
DIP
15.24 mm
30 µin
0.76 µm
Beryllium Copper
UL94 V-0
28
0.1 in
2.54 mm
Gold
2.54 mm
0.1 in
Polysulfone (PSU), Glass Filled
Gold
15.24 mm
DIP
0.6 in
-55 °C
125 °C
3M
228-7474-55-1902
Solder
3.56 mm
0.14 in
Through Hole
1 A
Beryllium Copper
30 µin
0.76 µm
Beryllium Copper
UL94 V-0
Gold
Polyethersulfone (PES), Glass Filled
Gold
-55 °C
150 °C
28
SOIC
Closed Frame
3M
228-4817-00-0602J
Press-Fit
2.78 mm
0.11 in
Connector
1 A
30 Áin
0.76 Ám
Beryllium Copper
30 µin
0.76 µm
Beryllium Copper
UL94 V-0
0.1 in
2.54 mm
Gold
2.54 mm
0.1 in
Polysulfone (PSU), Glass Filled
Gold
-55 °C
125 °C
15 mOhm
28
DIP, ZIF, ZIP
10.16 mm
Closed Frame
0.4 in
3M
228-1290-00-0602J
Press-Fit
2.78 mm
0.11 in
Connector
1 A
30 Áin
0.76 Ám
Beryllium Copper
30 µin
0.76 µm
Beryllium Copper
UL94 V-0
0.07 in
1.78 mm
Gold
2.54 mm
0.1 in
Polysulfone (PSU), Glass Filled
Gold
-55 °C
125 °C
15 mOhm
28
DIP, ZIF (ZIP)
15.24 mm
0.6 "
Closed Frame
3M
228-1290-09-0602J
Solder
3.3 mm
0.13 in
Through Hole
1 A
30 Áin
0.76 Ám
Beryllium Copper
0.4 in
DIP
10.16 mm
30 µin
0.76 µm
Beryllium Copper
UL94 V-0
28
0.07 in
1.78 mm
Gold
1.78 mm
0.07 in
Polysulfone (PSU), Glass Filled
Gold
-55 °C
125 °C

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBox 1$ 38.86
10$ 34.02
30$ 32.56
50$ 31.50
100$ 30.45
250$ 28.77

Description

General part information

228 Series

IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole

Documents

Technical documentation and resources

Datasheet

Datasheet