10018783-00113TLF

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Amphenol ICC (FCI)

CONN PCI EXP FMALE 164POS 0.039

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10018783-00113TLF

Active

Amphenol ICC (FCI)

CONN PCI EXP FMALE 164POS 0.039

Deep-Dive with AI

DocumentsDatasheet gs-12-233 Other Related Document

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	10018783-00113TLF

Card Thickness	0.062 in
Card Thickness	1.57 mm
Card Type	PCI Express™
Color	White
Contact Finish	Gold
Contact Finish Thickness	0.76 Ám
Contact Finish Thickness	30 Áin
Contact Material	Copper Alloy
Contact Type	Cantilever
Features	Locking Ramp, Board Guide
Gender	Female
Material - Insulation	Polyamide (PA), Glass Filled, Nylon
Mounting Type	Through Hole
Number of Positions	164
Number of Rows	2
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-55 °C
Pitch [x]	0.039 in
Pitch [x]	1 mm
Read Out	Dual
Termination	Solder, Staggered

10018783 Series

...

Part	Contact Type	Contact Finish	Features	Gender	Contact Material	Card Thickness	Card Thickness	Operating Temperature [Max]	Operating Temperature [Min]	Number of Positions	Pitch [x]	Pitch [x]	Material - Insulation	Color	Number of Rows	Contact Finish Thickness	Contact Finish Thickness	Read Out	Card Type	Termination	Mounting Type	Contact Finish Thickness	Number of Positions/Bay/Row [custom]	Number of Positions/Bay/Row [custom]
Amphenol ICC (FCI) 10018783-10100MLF	Cantilever	Gold	Board Guide Locking Ramp	Female	Copper Alloy	0.062 in	1.57 mm	85 °C	-55 °C	36	0.039 in	1 mm	Glass Filled Nylon Polyamide (PA)	Black	2	0.76 Ám	30 Áin	Dual	PCI Express™	Solder Staggered	Through Hole
Amphenol ICC (FCI) 10018783-10211TLF	Cantilever	Gold	Board Guide Locking Ramp	Female	Copper Alloy	0.062 in	1.57 mm	85 °C	-55 °C	64	0.039 in	1 mm	Glass Filled Nylon Polyamide (PA)	Black	2			Dual	PCI Express™	Solder Staggered	Through Hole	Flash	21	11
Amphenol ICC (FCI) 10018783-11222TLF	Cantilever	Gold	Board Lock Locking Ramp	Female	Copper Alloy	0.062 in	1.57 mm	85 °C	-55 °C	98	0.039 in	1 mm	Glass Filled Nylon Polyamide (PA)	Black	2			Dual	PCI Express™	Solder Staggered	Through Hole	Flash
Amphenol ICC (FCI) 10018783-10010TLF	Cantilever	Gold	Board Guide Locking Ramp	Female	Copper Alloy	0.062 in	1.57 mm	85 °C	-55 °C	36	0.039 in	1 mm	Glass Filled Nylon Polyamide (PA)	Black	2	0.76 Ám	30 Áin	Dual	PCI Express™	Solder Staggered	Through Hole
Amphenol ICC (FCI) 10018783-10002TLF	Cantilever	Gold	Board Guide Locking Ramp	Female	Copper Alloy	0.062 in	1.57 mm	85 °C	-55 °C	98	0.039 in	1 mm	Glass Filled Nylon Polyamide (PA)	Black	2	0.76 Ám	30 Áin	Dual	PCI Express™	Solder Staggered	Through Hole
Amphenol ICC (FCI) 10018783-10100TLF	Cantilever	Gold	Board Guide Locking Ramp	Female	Copper Alloy	0.062 in	1.57 mm	85 °C	-55 °C	36	0.039 in	1 mm	Glass Filled Nylon Polyamide (PA)	Black	2	0.38 µm	15 µin	Dual	PCI Express™	Solder Staggered	Through Hole
Amphenol ICC (FCI) 10018783-11203TLF	Cantilever	Gold	Board Guide Locking Ramp	Female	Copper Alloy	0.062 in	1.57 mm	85 °C	-55 °C	164	0.039 in	1 mm	Glass Filled Nylon Polyamide (PA)	Black	2	0.76 Ám	30 Áin	Dual	PCI Express™	Solder Staggered	Through Hole
Amphenol ICC (FCI) 10018783-12202TLF	Cantilever	Gold	Board Guide Locking Ramp	Female	Copper Alloy	0.062 in	1.57 mm	85 °C	-55 °C	98	0.039 in	1 mm	Glass Filled Nylon Polyamide (PA)	Black	2	0.76 Ám	30 Áin	Dual	PCI Express™	Solder Staggered	Through Hole
Amphenol ICC (FCI) 10018783-00203TLF	Cantilever	Gold	Board Guide Locking Ramp	Female	Copper Alloy	0.062 in	1.57 mm	85 °C	-55 °C	164	0.039 in	1 mm	Glass Filled Nylon Polyamide (PA)	White	2	0.76 Ám	30 Áin	Dual	PCI Express™	Solder Staggered	Through Hole
Amphenol ICC (FCI) 10018783-11212TLF	Cantilever	Gold	Board Lock Locking Ramp	Female	Copper Alloy	0.062 in	1.57 mm	85 °C	-55 °C	98	0.039 in	1 mm	Glass Filled Nylon Polyamide (PA)	Black	2			Dual	PCI Express™	Solder Staggered	Through Hole	Flash

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	20700	$ 1.20