Beta
⌘K
CONN PCI EXP FMALE 36POS 0.039
| Part | Contact Type | Contact Finish | Features | Gender | Contact Material | Card Thickness | Card Thickness | Operating Temperature [Max] | Operating Temperature [Min] | Number of Positions | Pitch [x] | Pitch [x] | Material - Insulation | Color | Number of Rows | Contact Finish Thickness | Contact Finish Thickness | Read Out | Card Type | Termination | Mounting Type | Contact Finish Thickness | Number of Positions/Bay/Row [custom] | Number of Positions/Bay/Row [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Amphenol ICC (FCI) | Cantilever | Gold | Board Guide Locking Ramp | Female | Copper Alloy | 0.062 in | 1.57 mm | 85 °C | -55 °C | 36 | 0.039 in | 1 mm | Glass Filled Nylon Polyamide (PA) | Black | 2 | 0.76 Ám | 30 Áin | Dual | PCI Express™ | Solder Staggered | Through Hole | |||
Amphenol ICC (FCI) | Cantilever | Gold | Board Guide Locking Ramp | Female | Copper Alloy | 0.062 in | 1.57 mm | 85 °C | -55 °C | 64 | 0.039 in | 1 mm | Glass Filled Nylon Polyamide (PA) | Black | 2 | Dual | PCI Express™ | Solder Staggered | Through Hole | Flash | 21 | 11 | ||
Amphenol ICC (FCI) | Cantilever | Gold | Board Lock Locking Ramp | Female | Copper Alloy | 0.062 in | 1.57 mm | 85 °C | -55 °C | 98 | 0.039 in | 1 mm | Glass Filled Nylon Polyamide (PA) | Black | 2 | Dual | PCI Express™ | Solder Staggered | Through Hole | Flash | ||||
Amphenol ICC (FCI) | Cantilever | Gold | Board Guide Locking Ramp | Female | Copper Alloy | 0.062 in | 1.57 mm | 85 °C | -55 °C | 36 | 0.039 in | 1 mm | Glass Filled Nylon Polyamide (PA) | Black | 2 | 0.76 Ám | 30 Áin | Dual | PCI Express™ | Solder Staggered | Through Hole | |||
Amphenol ICC (FCI) | Cantilever | Gold | Board Guide Locking Ramp | Female | Copper Alloy | 0.062 in | 1.57 mm | 85 °C | -55 °C | 98 | 0.039 in | 1 mm | Glass Filled Nylon Polyamide (PA) | Black | 2 | 0.76 Ám | 30 Áin | Dual | PCI Express™ | Solder Staggered | Through Hole | |||
Amphenol ICC (FCI) | Cantilever | Gold | Board Guide Locking Ramp | Female | Copper Alloy | 0.062 in | 1.57 mm | 85 °C | -55 °C | 36 | 0.039 in | 1 mm | Glass Filled Nylon Polyamide (PA) | Black | 2 | 0.38 µm | 15 µin | Dual | PCI Express™ | Solder Staggered | Through Hole | |||
Amphenol ICC (FCI) | Cantilever | Gold | Board Guide Locking Ramp | Female | Copper Alloy | 0.062 in | 1.57 mm | 85 °C | -55 °C | 164 | 0.039 in | 1 mm | Glass Filled Nylon Polyamide (PA) | Black | 2 | 0.76 Ám | 30 Áin | Dual | PCI Express™ | Solder Staggered | Through Hole | |||
Amphenol ICC (FCI) | Cantilever | Gold | Board Guide Locking Ramp | Female | Copper Alloy | 0.062 in | 1.57 mm | 85 °C | -55 °C | 98 | 0.039 in | 1 mm | Glass Filled Nylon Polyamide (PA) | Black | 2 | 0.76 Ám | 30 Áin | Dual | PCI Express™ | Solder Staggered | Through Hole | |||
Amphenol ICC (FCI) | Cantilever | Gold | Board Guide Locking Ramp | Female | Copper Alloy | 0.062 in | 1.57 mm | 85 °C | -55 °C | 164 | 0.039 in | 1 mm | Glass Filled Nylon Polyamide (PA) | White | 2 | 0.76 Ám | 30 Áin | Dual | PCI Express™ | Solder Staggered | Through Hole | |||
Amphenol ICC (FCI) | Cantilever | Gold | Board Lock Locking Ramp | Female | Copper Alloy | 0.062 in | 1.57 mm | 85 °C | -55 °C | 98 | 0.039 in | 1 mm | Glass Filled Nylon Polyamide (PA) | Black | 2 | Dual | PCI Express™ | Solder Staggered | Through Hole | Flash |