10018783 Series
Manufacturer: Amphenol ICC (FCI)
Beta
⌘K
CONN PCI EXP FMALE 36POS 0.039
| Part | Material - Insulation | Number of Rows | Mounting Type | Contact Finish Thickness | Gender | Card Type | Features | Color | Operating Temperature (Min) | Operating Temperature (Max) | Read Out | Contact Material | Contact Finish | Pitch | Number of Positions | Card Thickness | Termination | Contact Type | Number of Bay | Contact Finish Thickness (string set options) | Contact Finish Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Amphenol ICC (FCI) | Glass Filled Nylon PA Polyamide | 2 | Through Hole | 30 µin | Female | PCI Express™ | Board Guide Locking Ramp | Black | -55 °C | 85 °C | Dual | Copper Alloy | Gold | 0.039 in | 36 | 0.062 in | Solder Staggered | Cantilever | |||
 Amphenol ICC (FCI) | Glass Filled Nylon PA Polyamide | 2 | Through Hole | 0 | Female | PCI Express™ | Board Guide Locking Ramp | Black | -55 °C | 85 °C | Dual | Copper Alloy | Gold | 0.039 in | 11 64 | 0.062 in | Solder Staggered | Cantilever | 21 | Flash | Flash |
 Amphenol ICC (FCI) | Glass Filled Nylon PA Polyamide | 2 | Through Hole | 0 | Female | PCI Express™ | Board Lock Locking Ramp | Black | -55 °C | 85 °C | Dual | Copper Alloy | Gold | 0.039 in | 98 | 0.062 in | Solder Staggered | Cantilever | Flash | Flash | |
 Amphenol ICC (FCI) | Glass Filled Nylon PA Polyamide | 2 | Through Hole | 30 µin | Female | PCI Express™ | Board Guide Locking Ramp | Black | -55 °C | 85 °C | Dual | Copper Alloy | Gold | 0.039 in | 36 | 0.062 in | Solder Staggered | Cantilever | |||
 Amphenol ICC (FCI) | Glass Filled Nylon PA Polyamide | 2 | Through Hole | 30 µin | Female | PCI Express™ | Board Guide Locking Ramp | Black | -55 °C | 85 °C | Dual | Copper Alloy | Gold | 0.039 in | 98 | 0.062 in | Solder Staggered | Cantilever | |||
 Amphenol ICC (FCI) | Glass Filled Nylon PA Polyamide | 2 | Through Hole | 15 µin | Female | PCI Express™ | Board Guide Locking Ramp | Black | -55 °C | 85 °C | Dual | Copper Alloy | Gold | 0.039 in | 36 | 0.062 in | Solder Staggered | Cantilever | |||
 Amphenol ICC (FCI) | Glass Filled Nylon PA Polyamide | 2 | Through Hole | 30 µin | Female | PCI Express™ | Board Guide Locking Ramp | Black | -55 °C | 85 °C | Dual | Copper Alloy | Gold | 0.039 in | 164 | 0.062 in | Solder Staggered | Cantilever | |||
Amphenol ICC (FCI) | Glass Filled Nylon PA Polyamide | 2 | Through Hole | 30 µin | Female | PCI Express™ | Board Guide Locking Ramp | Black | -55 °C | 85 °C | Dual | Copper Alloy | Gold | 0.039 in | 98 | 0.062 in | Solder Staggered | Cantilever | |||
Amphenol ICC (FCI) | Glass Filled Nylon PA Polyamide | 2 | Through Hole | 30 µin | Female | PCI Express™ | Board Guide Locking Ramp | Black | -55 °C | 85 °C | Dual | Copper Alloy | Gold | 0.039 in | 98 | 0.062 in | Solder Staggered | Cantilever | |||
 Amphenol ICC (FCI) | Glass Filled Nylon PA Polyamide | 2 | Through Hole | 30 µin | Female | PCI Express™ | Board Guide Locking Ramp | White | -55 °C | 85 °C | Dual | Copper Alloy | Gold | 0.039 in | 164 | 0.062 in | Solder Staggered | Cantilever |