Specification	SDL-127-T-12

Connector Type	Receptacle
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	30 µin
Contact Length - Post	0.095 in
Contact Material	Beryllium Copper
Contact Shape	Circular
Contact Type	Female Socket
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.095 in
Insulation Material	Liquid Crystal Polymer (LCP)
Mounting Type	Through Hole
Number of Positions	54
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Row Spacing - Mating	0.1 in
Style	Board
Termination	Solder

SDL-127 Series

Part	Operating Temperature (Max)	Operating Temperature (Min)	Contact Length - Post	Insulation Color	Contact Type	Mounting Type	Pitch - Mating	Number of Rows	Contact Finish Thickness - Mating	Number of Positions	Contact Finish - Mating	Style	Row Spacing - Mating	Connector Type	Contact Finish - Post	Number of Positions Loaded	Fastening Type	Insulation Height	Termination	Contact Finish Thickness - Post	Contact Material	Insulation Material	Contact Shape
Samtec Inc. SDL-127-G-12	125 °C	-55 °C	0.095 in	Black	Female Socket	Through Hole	0.1 in	2	30 µin	54	Gold	Board	0.1 in	Receptacle	Gold	All	Push-Pull	0.095 in	Solder	10 µin	Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular
Samtec Inc. SDL-127-TT-10	105 °C	-55 °C	0.108 in	Black	Female Socket	Through Hole	0.1 in	2		54	Tin	Board	0.1 in	Receptacle	Tin	All	Push-Pull	0.122 in	Solder		Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular
Samtec Inc. SDL-127-T-10	125 °C	-55 °C	0.108 in	Black	Female Socket	Through Hole	0.1 in	2	30 µin	54	Gold	Board	0.1 in	Receptacle		All	Push-Pull	0.122 in	Solder		Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular
Samtec Inc. SDL-127-G-19	125 °C	-55 °C	0.082 in	Black	Female Socket	Through Hole	0.1 in	2	30 µin	54	Gold	Board	0.1 in	Receptacle	Gold	All	Push-Pull	0.083 in	Solder	10 µin	Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular
Samtec Inc. SDL-127-TT-12	105 °C	-55 °C	0.095 in	Black	Female Socket	Through Hole	0.1 in	2		54	Tin	Board	0.1 in	Receptacle	Tin	All	Push-Pull	0.095 in	Solder		Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular
Samtec Inc. SDL-127-T-11	125 °C	-55 °C	0.108 in	Black	Female Socket	Through Hole	0.1 in	2	30 µin	54	Gold	Board	0.1 in	Receptacle		All	Push-Pull	0.132 in	Solder		Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular
Samtec Inc. SDL-127-G-10	125 °C	-55 °C	0.108 in	Black	Female Socket	Through Hole	0.1 in	2	30 µin	54	Gold	Board	0.1 in	Receptacle	Gold	All	Push-Pull	0.122 in	Solder	10 µin	Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular
Samtec Inc. SDL-127-T-12	125 °C	-55 °C	0.095 in	Black	Female Socket	Through Hole	0.1 in	2	30 µin	54	Gold	Board	0.1 in	Receptacle		All	Push-Pull	0.095 in	Solder		Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular

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Datasheet

SDL-127-T-12 | Datasheet