SDL-127 Series
Manufacturer: Samtec Inc.
CONN RCPT .100" 54POS DUAL GOLD
| Part | Operating Temperature (Max) | Operating Temperature (Min) | Contact Length - Post | Insulation Color | Contact Type | Mounting Type | Pitch - Mating | Number of Rows | Contact Finish Thickness - Mating | Number of Positions | Contact Finish - Mating | Style | Row Spacing - Mating | Connector Type | Contact Finish - Post | Number of Positions Loaded | Fastening Type | Insulation Height | Termination | Contact Finish Thickness - Post | Contact Material | Insulation Material | Contact Shape |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 125 °C | -55 °C | 0.095 in | Black | Female Socket | Through Hole | 0.1 in | 2 | 30 µin | 54 | Gold | Board | 0.1 in | Receptacle | Gold | All | Push-Pull | 0.095 in | Solder | 10 µin | Beryllium Copper | Liquid Crystal Polymer (LCP) | Circular |
Samtec Inc. | 105 °C | -55 °C | 0.108 in | Black | Female Socket | Through Hole | 0.1 in | 2 | 54 | Tin | Board | 0.1 in | Receptacle | Tin | All | Push-Pull | 0.122 in | Solder | Beryllium Copper | Liquid Crystal Polymer (LCP) | Circular | ||
Samtec Inc. | 125 °C | -55 °C | 0.108 in | Black | Female Socket | Through Hole | 0.1 in | 2 | 30 µin | 54 | Gold | Board | 0.1 in | Receptacle | All | Push-Pull | 0.122 in | Solder | Beryllium Copper | Liquid Crystal Polymer (LCP) | Circular | ||
Samtec Inc. | 125 °C | -55 °C | 0.082 in | Black | Female Socket | Through Hole | 0.1 in | 2 | 30 µin | 54 | Gold | Board | 0.1 in | Receptacle | Gold | All | Push-Pull | 0.083 in | Solder | 10 µin | Beryllium Copper | Liquid Crystal Polymer (LCP) | Circular |
Samtec Inc. | 105 °C | -55 °C | 0.095 in | Black | Female Socket | Through Hole | 0.1 in | 2 | 54 | Tin | Board | 0.1 in | Receptacle | Tin | All | Push-Pull | 0.095 in | Solder | Beryllium Copper | Liquid Crystal Polymer (LCP) | Circular | ||
Samtec Inc. | 125 °C | -55 °C | 0.108 in | Black | Female Socket | Through Hole | 0.1 in | 2 | 30 µin | 54 | Gold | Board | 0.1 in | Receptacle | All | Push-Pull | 0.132 in | Solder | Beryllium Copper | Liquid Crystal Polymer (LCP) | Circular | ||
Samtec Inc. | 125 °C | -55 °C | 0.108 in | Black | Female Socket | Through Hole | 0.1 in | 2 | 30 µin | 54 | Gold | Board | 0.1 in | Receptacle | Gold | All | Push-Pull | 0.122 in | Solder | 10 µin | Beryllium Copper | Liquid Crystal Polymer (LCP) | Circular |
Samtec Inc. | 125 °C | -55 °C | 0.095 in | Black | Female Socket | Through Hole | 0.1 in | 2 | 30 µin | 54 | Gold | Board | 0.1 in | Receptacle | All | Push-Pull | 0.095 in | Solder | Beryllium Copper | Liquid Crystal Polymer (LCP) | Circular |