CC2652RB1FRGZR

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Texas Instruments

SIMPLELINK™ 32-BIT ARM CORTEX-M4F MULTIPROTOCOL 2.4 GHZ WIRELESS MCU WITH CRYSTAL-LESS BAW RESONATOR

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Search across all available documentation for this part.

DocumentsCC2538, CC13xx, and CC26xx Serial Bootloader Interface (Rev. E)What's New in Zigbee 3.0 (Rev. A)+44

CC2652RB1FRGZR

Active

Texas Instruments

SIMPLELINK™ 32-BIT ARM CORTEX-M4F MULTIPROTOCOL 2.4 GHZ WIRELESS MCU WITH CRYSTAL-LESS BAW RESONATOR

Deep-Dive with AI

DocumentsCC2538, CC13xx, and CC26xx Serial Bootloader Interface (Rev. E)What's New in Zigbee 3.0 (Rev. A)+44

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	CC2652RB1FRGZR

Current - Receiving	7.3 mA
Current - Transmitting [Max]	10.2 mA
Current - Transmitting [Min]	7.9 mA
Data Rate (Max)	2 Mbps
Frequency [Max]	2.48 GHz
Frequency [Min]	2.4 GHz
GPIO	31
Memory Size [custom]	80 kB
Memory Size [custom]	352 kB
Mounting Type	Surface Mount
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Package / Case	48-VFQFN Exposed Pad
Power - Output	5 dBm
Protocol	Zigbee®, Thread, Bluetooth v5.0
RF Family/Standard	Bluetooth, 802.15.4
Sensitivity	-102 dBm
Serial Interfaces	I2C, I2S, SPI, UART, JTAG, GPIO, ADC
Supplier Device Package	48-VQFN (7x7)
Type	TxRx + MCU
Voltage - Supply [Max]	3.8 V
Voltage - Supply [Min]	1.8 V

CC2652RB Series

SimpleLink™ 32-bit Arm Cortex-M4F multiprotocol 2.4 GHz wireless MCU with crystal-less BAW resonator

Part	Power - Output	Frequency [Min]	Frequency [Max]	GPIO	Operating Temperature [Max]	Operating Temperature [Min]	Sensitivity	RF Family/Standard	Package / Case	Serial Interfaces	Current - Transmitting [Min]	Current - Transmitting [Max]	Protocol	Voltage - Supply [Min]	Voltage - Supply [Max]	Mounting Type	Supplier Device Package	Data Rate (Max)	Current - Receiving	Memory Size [custom]	Memory Size [custom]	Type
Texas Instruments CC2652RB1FRGZR	5 dBm	2.4 GHz	2.48 GHz	31	85 °C	-40 °C	-102 dBm	802.15.4, Bluetooth	48-VFQFN Exposed Pad	ADC, GPIO, I2C, I2S, JTAG, SPI, UART	7.9 mA	10.2 mA	Bluetooth v5.0, Thread, Zigbee®	1.8 V	3.8 V	Surface Mount	48-VQFN (7x7)	2 Mbps	7.3 mA	80 kB	352 kB	TxRx + MCU

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 6.75
		10	$ 6.03
		25	$ 5.43
		100	$ 4.94
		250	$ 4.46
		500	$ 4.00
		1000	$ 3.38
	Digi-Reel®	1	$ 6.75
		10	$ 6.03
		25	$ 5.43
		100	$ 4.94
		250	$ 4.46
		500	$ 4.00
		1000	$ 3.38
	Tape & Reel (TR)	2500	$ 3.21
Texas Instruments	LARGE T&R	1	$ 4.39
		100	$ 3.58
		250	$ 2.81
		1000	$ 2.39

Description

General part information

CC2652RB Series

The SimpleLink™CC2652RB device is the industry’s first multiprotocol 2.4 GHz wireless crystal-less microcontroller (MCU) with integrated TI Bulk Acoustic Wave (BAW) resonator technology supportingThread,Zigbee,Bluetooth5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, including the TI 15.4-Stack (2.4 GHz), andconcurrent multiprotocoloperation through the Dynamic Multiprotocol Manager (DMM) software driver. Integrated BAW resonator technologyeliminates the need for external crystalswithout compromising latency or frequency stability. The device is optimized for low-power wireless communication and advanced sensing inbuilding security systems,HVAC,medical,power tool,wired networking,portable electronics,home theater & entertainment, andconnected peripheralsmarkets.

The highlighted features of TI Bulk Acoustic Wave (BAW) resonator technology include:

The highlighted features of theSimpleLink™ MCU platforminclude:

Documents

Technical documentation and resources

CC2652RB1FRGZR

Deep-Dive with AI

CC2652RB1FRGZR

Deep-Dive with AI

Technical Specifications

CC2652RB Series

Pricing

Description

CC2652RB Series

Documents

CC2538, CC13xx, and CC26xx Serial Bootloader Interface (Rev. E)

What's New in Zigbee 3.0 (Rev. A)

CC2652RB SimpleLink™ Multiprotocol 2.4-GHz MCU Device Revision E Silicon Errata (Rev. A)

Antenna Impedance Measurement and Matching

VIDEO: TI Bulk Acoustic Wave (BAW) resonator technology with Bluetooth 5

Bluetooth® Low Energy Tree Structure Network

Use of Low-power Zigbee® and Thread With the SimpleLink™ Wireless MCU Family

Bluetooth Low Energy – Invalid Connection Request (SweynTooth) (Rev. A)

Configuring Bluetooth LE devices for Direct Test Mode

무선 연결 기술 선택 가이드 (Rev. B)

TI-15.4 Stack Frequency Hopping Mode FCC Compliance (Rev. A)

How to Certify Your Bluetooth Product (Rev. M)

Ultra-Low Power Designs With the CC13x2 and CC26x2 Sensor Controller

Back to basics: Exploring the benefits of affordable Bluetooth® Low Energy

Cloning Z-Stack Network Properties Using the SimpleLink Wireless MCU Family

Exploring Thread and Zigbee for home and building automation

Measuring CC13xx and CC26xx current consumption (Rev. D)

無線連線技術選擇指南 (Rev. B)

Ultra-Low Power Sensing Applications With CC13x2/CC26x2 (Rev. B)

Running Bluetooth® Low Energy on CC13x2/CC26xx Without a 32 kHz Crystal (Rev. C)

Exploring IoT wireless connectivity in mechanical shock and vibration environme

LP-CC2652RB quick start guide

Z-Stack Large Mesh Network Performance Using the SimpleLink™ Wireless MCU Family (Rev. B)

How Wi-Fi® and Bluetooth® Low Energy can coexist in building automation and medic

SimpleLink Crystal-Less Wireless MCU based on TI BAW technology

Cryptographic Performance and Energy Efficiency on SimpleLink CC13x2/CC26x2 MCUs

Bluetooth® Low Energy connectivity solutions for automotive applications

CC13xx/CC26xx Hardware Configuration and PCB Design Considerations (Rev. H)

Secure Boot in SimpleLink™ CC13x2/CC26x2 Wireless MCUs

Dynamic Multi-protocol Manager (DMM) Tech Note (Rev. A)

Going crystal-less is easy with the world's first crystal-less, wireless SimpleLin

Connect One TI 15.4 Stack Sensor to Multiple Gateways

Wireless Connectivity Technology Selection Guide (Rev. B)

CC2652RB SimpleLink™ Crystal-less BAW Multiprotocol 2.4 GHz Wireless MCU datasheet (Rev. D)

Leitfaden zur Auswahl drahtloser Kommunikationstechnologie (Rev. B)

CC13x2, CC26x2 SimpleLink Wireless MCU Technical Reference Manual (Rev. G)

Low-Power ADC Solution for CC13x2 and CC26x2

Dynamic Multi-Protocol (DMM) Performance

RF PCB Simulation Cookbook

Top 5 things to know about TI BAW resonator technology

Sensor Sequencing Using the CC13x2 and CC26x2 Sensor Controller

Debugging Communication Range (Rev. A)

Testing TI BAW resonator technology in mechanical shock and vibration environments

Hardware Migration From CC26x0 to CC26x2R (Rev. D)

Getting Started With CC2652RB for Crystal-less BAW Operation

Minimizing Frequency Error Due to Soldering Process on CC2652RB Crystal-Less MCU

Technical Specifications

CC2652RB Series