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Aries Electronics
Standalone parts(906)
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| Part | Row Spacing | Row Spacing | Pitch [x] | Pitch [x] | Contact Finish | Mounting Type | Number of Positions | Features | Color | Number of Rows | Termination | Connector Type | Type | Type | Type | Contact Material - Mating | Contact Finish - Post | Material Flammability Rating | Number of Positions or Pins (Grid) | Contact Material - Post | Pitch - Post | Pitch - Post | Pitch - Mating | Pitch - Mating | Housing Material | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Current Rating (Amps) | Contact Finish - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination Post Length | Termination Post Length | Contact Material - Post [custom] | Row Spacing [Max] | Row Spacing [Max] | Number of Positions | Contact Finish Thickness | Contact Finish Thickness | Type | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Cable Termination | Shielding | Usage | Length [x] | Length [x] | Pitch - Connector | Pitch - Connector | Pitch - Cable | Pitch - Cable | Contact Type |
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Aries Electronics | 0.3 in | 7.62 mm | 2.54 mm | 0.1 in | Gold | Through Hole | 12 | Programmable | Black | 2 | Solder | Header | ||||||||||||||||||||||||||||||||||||||||||
Aries Electronics | Through Hole | Closed Frame | Wire Wrap | 0.4 in | 10.16 mm | DIP | Phosphor Bronze | Gold | UL94 V-0 | 22 | Phosphor Bronze | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | Glass Filled Nylon 4/6 Polyamide (PA46) | -55 °C | 125 °C | 10 çin | 0.25 çm | 1.5 A | Gold | 10 çin | 0.25 çm | ||||||||||||||||||||||||||||||
Aries Electronics | Through Hole | Open Frame | Solder | 0.3 " | 7.62 mm | DIP | Beryllium Copper | Tin | UL94 V-0 | 24 | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | Glass Filled Nylon 4/6 Polyamide (PA46) | 10 çin | 0.25 çm | 3 A | Gold | 200 µin | 5.08 µm | 3.18 mm | 0.125 in | Brass | ||||||||||||||||||||||||||||||
Aries Electronics | 2.54 mm | 0.1 in | Gold | Through Hole | Black | 2 | Solder | DIL - Header DIP | 0.8 in | 20.32 mm | 16 | 10 Áin | 0.25 Ám | |||||||||||||||||||||||||||||||||||||||||
Aries Electronics | Through Hole | Closed Frame | Wire Wrap | 0.2 in | 5.08 mm | DIP | Beryllium Copper | Tin | UL94 V-0 | 8 | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | Polyamide (PA46) Nylon 4/6 | -55 °C | 105 ░C | 10 çin | 0.25 çm | 3 A | Gold | 200 µin | 5.08 µm | 12.7 mm | 0.5 in | Brass | ||||||||||||||||||||||||||||
Aries Electronics | Through Hole | Closed Frame | Solder | 0.3 in | DIP ZIF (ZIP) | Beryllium Copper | Gold | UL94 V-0 | Beryllium Copper | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | Polyphenylene Sulfide (PPS) Glass Filled | 10 çin | 0.25 çm | 1 A | Gold | 10 çin | 0.25 çm | 2.78 mm | 0.11 in | 7.62 mm | 2 x 16 | 32 | |||||||||||||||||||||||||||||
Aries Electronics | Through Hole | Closed Frame Elevated | Solder | 0.6 in | 15.24 mm | DIP | Beryllium Copper | Gold | UL94 V-0 | 18 | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | Glass Filled Nylon 4/6 Polyamide (PA46) | -55 °C | 105 ░C | 30 Áin | 0.76 Ám | 3 A | Gold | 10 çin | 0.25 çm | 3.56 mm | 0.14 in | Brass | ||||||||||||||||||||||||||||
Aries Electronics | Gold | 22 positions | Strain Relief | Multiple Ribbon | 2 | DIP to DIP | 10 Áin | 0.25 Ám | Solder | Unshielded | Board In Socket (0.1") | 3 ft | 914.4 mm | 0.1 in | 2.54 mm | 0.05 " | 1.27 mm | |||||||||||||||||||||||||||||||||||||
Aries Electronics | Gold | 22 positions | Multiple Ribbon | 2 | DIP to DIP Reversed | 10 Áin | 0.25 Ám | Solder | Unshielded | 2 ' | 609.6 mm | 0.1 in | 2.54 mm | 0.05 " | 1.27 mm | |||||||||||||||||||||||||||||||||||||||
Aries Electronics | 2.54 mm | 0.1 in | Tin | Through Hole | 21 | Black | 1 | Solder | Header Strip | 200 Áin | 5.08 Ám | Forked |