36-0518 Series

Catalog

CONN SOCKET SIP 36POS GOLD

Part	Number of Positions or Pins (Grid) [custom]	Housing Material	Contact Material - Mating	Current Rating (Amps)	Contact Finish - Mating	Contact Finish - Post	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Mounting Type	Pitch - Post	Pitch - Post	Features	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Termination	Contact Material - Post [custom]	Termination Post Length	Termination Post Length	Termination Post Length [x]	Termination Post Length [x]
Aries Electronics 36-0518-10H	36	Glass Filled Nylon 4/6 Polyamide (PA46)	Beryllium Copper	3 A	Gold	Tin	SIP	200 µin	5.08 µm	Through Hole	2.54 mm	0.1 in	Open Frame	UL94 V-0	10 çin	0.25 çm	0.1 in	2.54 mm	Solder	Brass	3.18 mm	0.125 in
Aries Electronics 36-0518-10T	36	Glass Filled Nylon 4/6 Polyamide (PA46)	Beryllium Copper	3 A	Gold	Tin	SIP	200 µin	5.08 µm	Through Hole	2.54 mm	0.1 in	Open Frame	UL94 V-0	10 çin	0.25 çm	0.1 in	2.54 mm	Solder	Brass	3.18 mm	0.125 in
Aries Electronics 36-0518-11H	36	Glass Filled Nylon 4/6 Polyamide (PA46)	Beryllium Copper	3 A	Gold	Gold	SIP	10 çin	0.25 çm	Through Hole	2.54 mm	0.1 in	Open Frame	UL94 V-0	10 çin	0.25 çm	0.1 in	2.54 mm	Solder	Brass	3.18 mm	0.125 in
Aries Electronics 36-0518-00	36	Glass Filled Nylon 4/6 Polyamide (PA46)	Beryllium Copper	3 A	Gold	Tin	SIP	200 µin	5.08 µm	Surface Mount	2.54 mm	0.1 in	Open Frame	UL94 V-0	10 çin	0.25 çm	0.1 in	2.54 mm	Solder	Brass			0.046 in	1.17 mm
Aries Electronics 36-0518-11	36	Glass Filled Nylon 4/6 Polyamide (PA46)	Beryllium Copper	3 A	Gold	Gold	SIP	10 çin	0.25 çm	Through Hole	2.54 mm	0.1 in	Open Frame	UL94 V-0	10 çin	0.25 çm	0.1 in	2.54 mm	Solder	Brass	3.18 mm	0.125 in
Aries Electronics 36-0518-10	36	Glass Filled Nylon 4/6 Polyamide (PA46)	Beryllium Copper	3 A	Gold	Tin	SIP	200 µin	5.08 µm	Through Hole	2.54 mm	0.1 in	Open Frame	UL94 V-0	10 çin	0.25 çm	0.1 in	2.54 mm	Solder	Brass	3.18 mm	0.125 in