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36-0518-10H

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Aries Electronics

CONN SOCKET SIP 36POS GOLD

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36-0518-10H

Active
Aries Electronics

CONN SOCKET SIP 36POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

Specification36-0518-10H
Contact Finish - MatingGold
Contact Finish - PostTin
Contact Finish Thickness - Mating10 çin
Contact Finish Thickness - Mating0.25 çm
Contact Finish Thickness - Post200 µin
Contact Finish Thickness - Post5.08 µm
Contact Material - MatingBeryllium Copper
Contact Material - Post [custom]Brass
Current Rating (Amps)3 A
FeaturesOpen Frame
Housing MaterialGlass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid) [custom]36
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Pitch - Post2.54 mm
Pitch - Post0.1 in
TerminationSolder
Termination Post Length3.18 mm
Termination Post Length0.125 in
TypeSIP

36-0518 Series

PartNumber of Positions or Pins (Grid) [custom]Housing MaterialContact Material - MatingCurrent Rating (Amps)Contact Finish - MatingContact Finish - PostTypeContact Finish Thickness - PostContact Finish Thickness - PostMounting TypePitch - PostPitch - PostFeaturesMaterial Flammability RatingContact Finish Thickness - MatingContact Finish Thickness - MatingPitch - MatingPitch - MatingTerminationContact Material - Post [custom]Termination Post LengthTermination Post LengthTermination Post Length [x]Termination Post Length [x]
Aries Electronics
36
Glass Filled
Nylon 4/6
Polyamide (PA46)
Beryllium Copper
3 A
Gold
Tin
SIP
200 µin
5.08 µm
Through Hole
2.54 mm
0.1 in
Open Frame
UL94 V-0
10 çin
0.25 çm
0.1 in
2.54 mm
Solder
Brass
3.18 mm
0.125 in
Aries Electronics
36
Glass Filled
Nylon 4/6
Polyamide (PA46)
Beryllium Copper
3 A
Gold
Tin
SIP
200 µin
5.08 µm
Through Hole
2.54 mm
0.1 in
Open Frame
UL94 V-0
10 çin
0.25 çm
0.1 in
2.54 mm
Solder
Brass
3.18 mm
0.125 in
Aries Electronics
36
Glass Filled
Nylon 4/6
Polyamide (PA46)
Beryllium Copper
3 A
Gold
Gold
SIP
10 çin
0.25 çm
Through Hole
2.54 mm
0.1 in
Open Frame
UL94 V-0
10 çin
0.25 çm
0.1 in
2.54 mm
Solder
Brass
3.18 mm
0.125 in
Aries Electronics
36
Glass Filled
Nylon 4/6
Polyamide (PA46)
Beryllium Copper
3 A
Gold
Tin
SIP
200 µin
5.08 µm
Surface Mount
2.54 mm
0.1 in
Open Frame
UL94 V-0
10 çin
0.25 çm
0.1 in
2.54 mm
Solder
Brass
0.046 in
1.17 mm
Aries Electronics
36
Glass Filled
Nylon 4/6
Polyamide (PA46)
Beryllium Copper
3 A
Gold
Gold
SIP
10 çin
0.25 çm
Through Hole
2.54 mm
0.1 in
Open Frame
UL94 V-0
10 çin
0.25 çm
0.1 in
2.54 mm
Solder
Brass
3.18 mm
0.125 in
Aries Electronics
36
Glass Filled
Nylon 4/6
Polyamide (PA46)
Beryllium Copper
3 A
Gold
Tin
SIP
200 µin
5.08 µm
Through Hole
2.54 mm
0.1 in
Open Frame
UL94 V-0
10 çin
0.25 çm
0.1 in
2.54 mm
Solder
Brass
3.18 mm
0.125 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 129$ 3.94

Description

General part information

36-0518 Series

36 (1 x 36) Pos SIP Socket Gold Through Hole

Documents

Technical documentation and resources