627-W09 Series
Manufacturer: EDAC Inc.
Beta
⌘K
CONN D-SUB PLUG 9POS PNL MNT
| Part | Termination | Connector Style | Contact Finish | Current Rating (Per Contact) | Contact Finish Thickness | Contact Finish Thickness (string set options) | Contact Finish Thickness | Mounting Type | Contact Type | Connector Type | Shell Material | Finish | Flange Feature | Features | Shell Size | Connector Layout | Material Flammability Rating | Number of Rows | Number of Positions | Ingress Protection Description | Ingress Protection IP Rating | Dielectric Material | Operating Temperature (Max) | Operating Temperature (Min) | Contact Material | Color |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 EDAC Inc. | Solder Cup | D-Sub | Gold | 5 A | 0 | Flash | Flash | Free Hanging (In-Line) | Signal | Male Pins Plug | Steel | Nickel Plated | Board Side (4-40) | Grounding Indents | 1 | DE E | UL94 V-0 | 2 | 9 | Dust Tight Waterproof | IP67 | Glass Filled Polybutylene Terephthalate (PBT) | 85 °C | -25 °C | Copper Alloy | Black |
 EDAC Inc. | Solder | D-Sub | Gold | 5 A | 0 | Flash | Flash | Panel Mount Through Hole | Signal | Male Pins Plug | Steel | Nickel Plated | Board Side (4-40) | Grounding Indents | 1 | DE E | UL94 V-0 | 2 | 9 | Dust Tight Waterproof | IP67 | Glass Filled Polybutylene Terephthalate (PBT) | 85 °C | -25 °C | Copper Alloy | Black |
 EDAC Inc. | Solder | D-Sub | Gold | 5 A | 30 µin | Panel Mount Through Hole | Signal | Male Pins Plug | Steel | Nickel Plated | Board Side (4-40) | Grounding Indents | 1 | DE E | UL94 V-0 | 2 | 9 | Dust Tight Waterproof | IP67 | Glass Filled Polybutylene Terephthalate (PBT) | 85 °C | -25 °C | Copper Alloy | Black | ||
 EDAC Inc. | Solder Cup | D-Sub | Gold | 5 A | 30 µin | Free Hanging (In-Line) | Signal | Male Pins Plug | Steel | Nickel Plated | Board Side (4-40) | Grounding Indents | 1 | DE E | UL94 V-0 | 2 | 9 | Dust Tight Waterproof | IP67 | Glass Filled Polybutylene Terephthalate (PBT) | 85 °C | -25 °C | Copper Alloy | Black | ||
 EDAC Inc. | Solder | D-Sub | Gold | 5 A | 30 µin | Panel Mount Through Hole | Signal | Male Pins Plug | Steel | Nickel Plated | Board Side (4-40) | Grounding Indents | 1 | DE E | UL94 V-0 | 2 | 9 | Dust Tight Waterproof | IP67 | Glass Filled Polybutylene Terephthalate (PBT) | 85 °C | -25 °C | Copper Alloy | Black | ||
 EDAC Inc. | Solder | D-Sub | Gold | 5 A | 30 µin | Panel Mount Through Hole | Signal | Male Pins Plug | Steel | Nickel Plated | Board Side (4-40) | Board Lock Grounding Indents | 1 | DE E | UL94 V-0 | 2 | 9 | Dust Tight Waterproof | IP67 | Glass Filled Polybutylene Terephthalate (PBT) | 85 °C | -25 °C | Copper Alloy | Black | ||
 EDAC Inc. | Solder | D-Sub | Gold | 5 A | 15 µin | Panel Mount Through Hole | Signal | Male Pins Plug | Steel | Nickel Plated | Board Side (4-40) | Grounding Indents | 1 | DE E | UL94 V-0 | 2 | 9 | Dust Tight Waterproof | IP67 | Glass Filled Polybutylene Terephthalate (PBT) | 85 °C | -25 °C | Copper Alloy | Black | ||
 EDAC Inc. | Solder | D-Sub | Gold | 5 A | 15 µin | Panel Mount Through Hole | Signal | Male Pins Plug | Steel | Nickel Plated | Board Side (4-40) | Board Lock Grounding Indents | 1 | DE E | UL94 V-0 | 2 | 9 | Dust Tight Waterproof | IP67 | Glass Filled Polybutylene Terephthalate (PBT) | 85 °C | -25 °C | Copper Alloy | Black |