CONN RCPT 64POS 0.1 GOLD SMD
| Part | Termination | Contact Type | Contact Finish - Post | Connector Type | Contact Finish - Mating | Number of Positions Loaded | Voltage Rating | Contact Shape | Number of Rows | Fastening Type | Pitch - Mating | Pitch - Mating | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Number of Positions | Current Rating (Amps) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Insulation Height | Insulation Height | Contact Material | Insulation Material | Mounting Type | Operating Temperature [Min] | Operating Temperature [Max] | Insulation Color | Features | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Length - Post | Contact Length - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Solder | Female Socket | Tin | Receptacle | Gold | All | 400 VAC | Square | 2 | Push-Pull | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | 64 | 4.1 A | 30 Áin | 0.76 Ám | 3.66 mm | 0.144 in | Beryllium Copper | Liquid Crystal Polymer (LCP) | Surface Mount | -55 °C | 125 °C | Black | |||||
Samtec Inc. | Solder | Female Socket | Gold | Receptacle | Gold | All | 400 VAC | Square | 2 | Push-Pull | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | 64 | 4.1 A | 20 µin | 0.51 µm | 3.66 mm | 0.144 in | Beryllium Copper | Liquid Crystal Polymer (LCP) | Surface Mount | -55 °C | 125 °C | Black | Pick and Place | 3 µin | 0.076 µm | ||
Samtec Inc. | Solder | Female Socket | Gold | Receptacle Bottom Entry | Gold | All | 400 VAC | Square | 2 | Push-Pull | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | 64 | 4.1 A | 20 µin | 0.51 µm | 3.66 mm | 0.144 in | Beryllium Copper | Liquid Crystal Polymer (LCP) | Surface Mount | -55 °C | 125 °C | Black | Board Guide | 3 µin | 0.076 µm | ||
Samtec Inc. | Solder | Female Socket | Gold | Pass Through Receptacle | Gold | All | 400 VAC | Square | 2 | Push-Pull | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | 64 | 4.1 A | 10 çin | 0.25 çm | 3.5 mm | 0.138 in | Beryllium Copper | Liquid Crystal Polymer (LCP) | Through Hole | -55 °C | 125 °C | Black | 3 µin | 0.076 µm | 0.09 " | 2.29 mm | |
Samtec Inc. | Solder | Female Socket | Tin | Receptacle | Gold | All | 400 VAC | Square | 2 | Push-Pull | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | 64 | 4.1 A | 3 µin | 0.076 µm | 3.66 mm | 0.144 in | Beryllium Copper | Liquid Crystal Polymer (LCP) | Surface Mount | -55 °C | 125 °C | Black | |||||
Samtec Inc. | Solder | Female Socket | Tin | Pass Through Receptacle | Gold | All | 400 VAC | Square | 2 | Push-Pull | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | 64 | 4.1 A | 30 Áin | 0.76 Ám | 3.5 mm | 0.138 in | Beryllium Copper | Liquid Crystal Polymer (LCP) | Through Hole | -55 °C | 125 °C | Black | 0.09 " | 2.29 mm | |||
Samtec Inc. | Solder | Female Socket | Gold | Receptacle | Gold | All | 400 VAC | Square | 2 | Push-Pull | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | 64 | 4.1 A | 20 µin | 0.51 µm | 3.66 mm | 0.144 in | Beryllium Copper | Liquid Crystal Polymer (LCP) | Surface Mount | -55 °C | 125 °C | Black | Pick and Place | 3 µin | 0.076 µm | ||
Samtec Inc. | Solder | Female Socket | Gold | Receptacle Bottom Entry | Gold | All | 400 VAC | Square | 2 | Push-Pull | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | 64 | 4.1 A | 20 µin | 0.51 µm | 3.66 mm | 0.144 in | Beryllium Copper | Liquid Crystal Polymer (LCP) | Surface Mount | -55 °C | 125 °C | Black | 3 µin | 0.076 µm | |||
Samtec Inc. | Solder | Female Socket | Tin | Receptacle | Gold | All | 400 VAC | Square | 2 | Push-Pull | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | 64 | 4.1 A | 10 çin | 0.25 çm | 3.66 mm | 0.144 in | Beryllium Copper | Liquid Crystal Polymer (LCP) | Surface Mount | -55 °C | 125 °C | Black | Pick and Place | ||||
Samtec Inc. | Solder | Female Socket | Tin | Receptacle | Gold | All | 400 VAC | Square | 2 | Push-Pull | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | 64 | 4.1 A | 10 çin | 0.25 çm | 3.66 mm | 0.144 in | Beryllium Copper | Liquid Crystal Polymer (LCP) | Surface Mount | -55 °C | 125 °C | Black |